Core Viewpoint - The article emphasizes the significance of new materials in driving innovation across various industries, highlighting a selection of 100 most promising new materials that are reshaping the future [3]. Group 1: New Generation Semiconductor Materials - Silicon Carbide (SiC) substrates are projected to have a global demand of 1.4 million pieces by 2025, with a compound annual growth rate (CAGR) of 30% [12]. - Gallium Nitride (GaN) epitaxial wafers are expected to reach a market size of $3 billion by 2030, with a CAGR of 48% for automotive GaN devices [18]. - Gallium Oxide (β-Ga₂O₃) is anticipated to have a wafer demand of 500,000 pieces by 2030, with a global market value of $19.3 billion and a CAGR of 50.13% [22]. Group 2: New Energy Strategic Materials - Sulfide solid electrolytes (Li₆PS₅Cl) are projected to have a global demand exceeding 80,000 tons by 2030, with a market size of $12 billion and a CAGR of 68% [68]. - Sodium-ion battery cathodes (Fe₄[Fe(CN)₆]₃) are expected to have a demand of 200,000 tons by 2030, with a market size of $5 billion in China [74]. - Perovskite solar cells (FAPbI₃) are projected to reach a global market size of $12 billion by 2030, with a production capacity exceeding 60% from China [77]. Group 3: New Display and Optical Materials - Quantum Dot Light Emitting Diodes (QLED) are expected to reach a market size of $1.8 billion by 2028, with a penetration rate of over 20% in televisions [125]. - Metal Oxide Thin Film Transistors (IGZO) are projected to have a market size of $2.5 billion by 2025, with a 50% penetration rate in high-end panels [127]. - Micro-LED display technology is anticipated to reach a market size of $30 billion by 2030, with an annual growth rate of 80% [130].

Group 1: Bankruptcy of Zhenxin Semiconductor - Zhenxin Semiconductor Technology Co., Ltd. has been officially accepted for bankruptcy liquidation by the People's Court of Zhenjiang Economic Development Zone as of April 15, 2025 [1] - The court has decided to apply a simplified trial procedure to expedite the handling of the case, with Jiangsu Xuyi Law Firm designated as the bankruptcy administrator [1] - Creditors must declare their claims to the administrator by May 30, 2025, and the first creditors' meeting will be held by June 3, 2025 [2] Group 2: Background and Financial Issues - Zhenxin Semiconductor was established in May 2018 with a registered capital of 1 million yuan, focusing on the research, design, production, packaging, testing, and sales of semiconductors and integrated circuits [1] - The company had previously planned to invest 32 million yuan in a chip testing project, aiming to purchase 35 specialized testing devices to create a production line capable of testing 110 million chips per month, but this plan was ultimately not realized [1] - In July 2023, Zhenxin Semiconductor and its legal representative were restricted from high consumption due to a failure to fulfill obligations from a court ruling related to a lease contract dispute [1] Group 3: Bankruptcy of 聚力成半导体 - 聚力成半导体 (Chongqing) has also entered bankruptcy proceedings, with a request for bankruptcy reorganization filed by Guangdong Zhongbao Weian Security Service Co., Ltd. on April 9, 2024, citing inability to repay debts [2] - The company was established in September 2018 and was initially expected to develop a significant production and research base for gallium nitride (GaN) chips, with a planned investment of 5 billion yuan [3] - The project aimed to build 21 production lines with an expected annual output value exceeding 10 billion yuan, but has faced multiple delays and legal disputes over the years [3] Group 4: Current Status of 聚力成半导体 - As of April 2025, 聚力成半导体 (Chongqing) and its legal representative have also been restricted from high consumption [4]

Core Viewpoint - The article highlights the significant advancements and strategic developments in the GaN (Gallium Nitride) semiconductor industry, particularly focusing on Huazhong Microelectronics and its subsidiary Runxin Microelectronics, which recently celebrated the shipment of its one billionth GaN chip and the establishment of a new epitaxial production base [5][6][7]. Group 1: Company Developments - Huazhong Microelectronics' subsidiary Runxin Microelectronics has successfully shipped one billion GaN chips, marking a major milestone in its production capabilities [5][6]. - The new epitaxial production base was completed in just nine months, utilizing cutting-edge technology to enhance the quality and efficiency of GaN chip production [5][6]. - The establishment of this base is seen as a critical milestone in Huazhong Microelectronics' strategic layout in the GaN sector, aiming to become a leading player in the domestic market [5][6][7]. Group 2: Strategic Collaborations - The strategic partnership between Huazhong Microelectronics and Runxin Microelectronics has evolved through two main phases, with Huazhong Microelectronics acquiring a controlling stake in Runxin to accelerate its GaN strategy [6][7]. - Runxin Microelectronics has built a complete technology chain from epitaxial material preparation to device process optimization, significantly enhancing its market influence and collaboration with leading clients in power management [6][7]. Group 3: Industry Landscape - The article notes that there are currently 15 domestic GaN manufacturers, with production lines expected to exceed 19, indicating a rapidly growing industry [10]. - Companies like InnoSilicon, Silan Microelectronics, and Sanan Optoelectronics are also expanding their GaN production capabilities, with significant monthly wafer production targets [10][11]. - The competitive landscape is characterized by ongoing investments and technological advancements, positioning the GaN sector for substantial growth in the coming years [10][11].