Core Insights - LG Chem has developed a cutting-edge semiconductor packaging core material, liquid PID (Photo Imageable Dielectric), to enter the AI and high-performance semiconductor market [2] - PID is essential for establishing microcircuits and forming transmission channels between semiconductor chips and substrates, enhancing circuit precision and semiconductor performance [2] - The demand for high-performance semiconductors is increasing, highlighting the importance of PID [2] Material Characteristics - The liquid PID features high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, improving process stability [2] - It is free from PFAS, NMP, and toluene, aligning with environmental regulations [2] Challenges and Solutions - The risk of cracking due to thermal expansion differences increases with larger integrated circuit (IC) substrates [2] - Traditional liquid PID struggles with uniformity on large substrates; LG Chem has developed a film-type PID to address this issue [4] Expansion Plans - LG Chem is expanding its production and R&D scale in the advanced semiconductor packaging sector, covering various key backend materials [2][4] - The product categories include Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [4]

Core Viewpoint - LG Chem has developed advanced liquid PID (Photo Imageable Dielectric) materials for semiconductor packaging, targeting the artificial intelligence and high-performance semiconductor markets, highlighting the increasing importance of PID in high-precision circuits [2][4]. Group 1: Product Features - The liquid PID material offers high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, enhancing process stability [2]. - The new PID is free from PFAS, NMP, and toluene, aligning with environmental regulations [2]. - LG Chem has also developed a film-type PID to address issues of uniformity on large substrates, which include maintaining consistent thickness and graphic fidelity, high strength and elasticity to reduce cracking during thermal cycles, low moisture absorption for long-term reliability, and compatibility with existing processes [3]. Group 2: Expansion in Semiconductor Packaging - LG Chem is expanding its production and R&D scale in key backend materials for advanced semiconductor packaging, which includes products such as Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [3].