【DT新材料】获悉，近日，LG化学宣布开发出尖端半导体封装核心材料—液态PID(Photo Imageable Dielectric)，正式布局人工智能和高性能半导体市场。 PID作为感光绝缘材料，用在半导体芯片和基板之间建立微电路并形成传输电信号通道，是在先进封装工艺中提高电路精密度、增强半导体性能与可靠性 的核心材料。 随着高性能半导体对于高精密电路的需求不断攀升，PID的重要性日益凸显。LG化学的液态PID具备高分辨率、低温亦可稳定固化、兼具低收缩和低吸收 率的特性，有效提高了工艺稳定性。此外，该产品不含PFAS(全氟及多氟烷基化合物)、NMP和甲苯等物质，更符合环境相关法规要求。 随着集成电路（IC）基板尺寸不断增大、特征尺寸持续缩小，热膨胀差异导致的开裂风险显著增加。传统液态 PID 在大型基板上难以实现双面均匀性， 为此，LG化学还研发出薄膜型 PID，能够解决以下问题： 除此之外，LG 化学正持续扩大先进半导体封装领域关键后端材料的量产与研发规模，涵盖以下品类： 展品范围 材料:高纯气体、高纯石墨、晶种、金属粉、结合剂和黏结剂等 大基板一致性：在大型基板上保持均匀的厚度与图形保真度 高强度与高弹 ...

Core Viewpoint - LG Chem has developed advanced liquid PID (Photo Imageable Dielectric) materials for semiconductor packaging, targeting the artificial intelligence and high-performance semiconductor markets, highlighting the increasing importance of PID in high-precision circuits [2][4]. Group 1: Product Features - The liquid PID material offers high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, enhancing process stability [2]. - The new PID is free from PFAS, NMP, and toluene, aligning with environmental regulations [2]. - LG Chem has also developed a film-type PID to address issues of uniformity on large substrates, which include maintaining consistent thickness and graphic fidelity, high strength and elasticity to reduce cracking during thermal cycles, low moisture absorption for long-term reliability, and compatibility with existing processes [3]. Group 2: Expansion in Semiconductor Packaging - LG Chem is expanding its production and R&D scale in key backend materials for advanced semiconductor packaging, which includes products such as Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [3].