今日（11月25日）科技成长方向强势进攻，创业板指涨超2.5%，科创综指涨逾1.7%，覆盖创业板+科创板高成长龙头的硬 科技宽基——双创龙头ETF（588330）场内涨幅盘中上探3.45%，现涨2.5%，实时成交额超3200万元，交投较为活跃！ 细分方向来看，光模块三巨头王者归来，中际旭创、新易盛涨超6%，天孚通信涨逾4%；PCB（印制电路板）方面，胜宏 科技涨超6%；光伏方面，阳光电源涨超5%，阿特斯涨逾2%。 【掘金新质生产力，投资中国版"纳斯达克"】 关注双创龙头ETF（588330）及其场外联接基金（A类：013317 / C类：013318）的三大特征： 1、跨市场多元配置，百分百战略新兴：标的指数从科创板和创业板中选取市值较大的50只战略新兴产业上市公司作为指 数样本，汇集高成长龙头，囊括新能源、光伏、光模块、半导体、医疗设备等热门主题； 2、成长风格"战斗基"，一键配置中国顶尖科技：全球科技博弈背景下，科技自立自强和产业链自主可控的重要性提升至 新高度，"中国版纳斯达克"呼之欲出； 3、高弹性工具捕捉科技行情，低门槛布局突围力量：标的指数20%涨跌幅限制，抢反弹更快，有能力担当"反弹先锋"。 相 ...

创50ETF紧密跟踪创业板50指数，创业板50指数由创业板市场中日均成交额较大的50只股票组成，反映 了创业板市场内知名度高、市值规模大、流动性好的企业的整体表现。 数据显示，截至2025年10月31日，创业板50指数(399673)前十大权重股分别为宁德时代(300750)、中际 旭创(300308)、东方财富(300059)、新易盛(300502)、阳光电源(300274)、胜宏科技(300476)、汇川技术 (300124)、迈瑞医疗(300760)、亿纬锂能(300014)、同花顺(300033)，前十大权重股合计占比70.15%。 创50ETF(159681)，场外联接(A：018482；C：018483；I：023024)。 截至2025年11月25日 10:08，创业板50指数(399673)强势上涨，成分股胜宏科技(300476)上涨7.40%，新 易盛(300502)上涨5.97%，中际旭创(300308)上涨5.74%，天孚通信(300394)，长川科技(300604)等个股跟 涨。创50ETF(159681)上涨2.50%，最新价报1.39元。 受AI概念催化，CPO、PCB再度走高，消 ...

Core Insights - The report from HSBC highlights a significant technological and specification upgrade in the printed circuit board (PCB) and copper-clad laminate (CCL) sectors driven by the rapid evolution of AI servers [1][2] - The introduction of NVIDIA's next-generation Rubin platform is identified as a key catalyst for this upgrade cycle, which is expected to increase both the shipment volume and average selling prices of related products [1][2] Group 1: Drivers of Growth - The growth in the PCB/CCL industry is primarily driven by two engines: NVIDIA's new platform and the ASIC chips from major cloud service providers (CSPs) [2] - NVIDIA's Rubin platform, expected to start mass production in the second half of 2026, will trigger a value leap in PCB/CCL through new structures and increased usage of PCBs [2] - The ASIC market is rapidly becoming a critical catalyst, with major CSPs projected to spend over $420 billion on capital expenditures by 2025, a 61% increase year-on-year [2] Group 2: Pricing Environment - The pricing environment for CCL is becoming increasingly favorable due to tight supply conditions and rising raw material costs [4] - The CCL cost index has risen by 40% over the past six months, driven by a 27% increase in copper prices and a 72% increase in glass fiber prices [4] - Manufacturers are expected to pass on these cost increases to downstream PCB customers, particularly in the high-end market [4] Group 3: Key Players and Market Position - Shengyi Technology is positioned to maintain its leading role in supplying M9-level CCL for NVIDIA's Rubin platform, benefiting from a surge in AI data center orders [4] - Shenzhen South Circuit is becoming a core supplier for major clients like Huawei and Google in the high-value AI PCB sector [4] - Dazhong Laser's M9-level CCL materials are expected to drive demand for high-end drilling equipment, reflecting the increasing complexity of PCB manufacturing [5]

Core Insights - The PCB industry is experiencing unprecedented growth opportunities driven by the surge in AI server demand and the unexpected recovery in traditional sectors [1][2] Demand Drivers - The resilience in PCB demand is attributed to a dual-driven model of emerging sectors' explosion and the recovery of traditional fields [2] - AI technology breakthroughs are pushing the industry into a "golden phase" of simultaneous volume and price increases [2] - AI server PCB demand is expected to significantly increase, with Nvidia's GB 200/300 NVL72 shipments projected to meet expectations by 2025, and Blackwell & Rubin series shipments potentially exceeding 50,000-60,000 units by 2026 [2][3] - The technical requirements for AI servers far exceed those of traditional servers, with high-layer count (HLC) and high-density interconnect (HDI) boards becoming core demands [2] Market Dynamics - UBS estimates that the single-unit PCB content for AI servers is 5-10 times higher than that of traditional servers, significantly driving the server PCB market [3] - The domestic AI chip and cluster solutions are accelerating the formation of a local AI server supply chain, benefiting companies like Shenzhen Circuits and Huitian Technology [3] - Traditional PCB demand is also recovering, contributing 70-80% of revenue from sectors like smartphones, PCs, and general servers [3] Sector-Specific Insights - The smartphone sector is benefiting from the unexpected shipment volume of the iPhone 17 series, with global smartphone shipment forecasts for 2025/26 raised to 1.26 billion and 1.27 billion units, reflecting year-on-year growth of 3% and 1% respectively [3] - The PC market is seeing a recovery driven by the replacement cycle following the end of Windows 10 support, with global PC shipment growth expected to exceed 4% in 2025/26 [3] - General server demand is notably resilient, with global shipments projected to grow by 8.6% and 8.0% in 2025/26, and hyperscale data center shipments expected to grow by 17.8% and 9.8% [4] Industry Chain Analysis - The PCB industry chain shows a concentration of value in upstream segments, with substrates and copper-clad laminates (CCL) being the most certain segments benefiting from AI demand [5] - BT substrates are experiencing high utilization rates due to the recovery in storage chip demand and supply shortages of key materials [7] - The price of BT substrates has increased by 30% this year, with further increases expected by year-end [8] - The high-speed CCL segment is seeing explosive demand driven by AI server upgrades, with prices expected to rise by 10-15% in the second half of 2025 [9] Company Profiles - Shenzhen Circuits: Covers major North American clients [10] - Huitian Technology: Main PCB supplier for Google and optical modules [11] - Shenghong Technology: Strong position with Nvidia and aggressive capacity expansion [12] - Sany Electronics: Significant orders from AWS leading to strong Q3 performance [13] - Sany Technology: Strong earnings certainty due to CCL price increases [14] - Dazhu CNC: Q3 performance exceeded expectations, reflecting PCB segment dynamics [15] - Ding Tai High-Tech: Facing process challenges due to high difficulty in Q fabric [16] - Zhongcai Technology: Expected to benefit from sustained PCB demand in the coming year [17] Conclusion - The Chinese PCB industry is entering a new upward cycle driven by AI, with upstream segments like substrates and CCL, along with leading companies in the AI server supply chain, being the primary beneficiaries [18]

Core Viewpoint - The PCB industry is experiencing unprecedented growth opportunities driven by the surge in AI server demand and the unexpected recovery in traditional sectors, marking the beginning of a new growth cycle for the industry [1][2]. Demand Drivers - The resilience in PCB demand is attributed to a dual-driven pattern of "emerging sectors' explosion + traditional sectors' recovery" [2]. - The demand for PCBs in AI servers has transitioned from a conceptual phase to actual performance, significantly increasing the industry's growth potential [3]. - AI servers require higher PCB content, with UBS estimating that the single-unit PCB content for AI servers is 5-10 times higher than traditional servers, leading to a rapid expansion of the server PCB market [4]. Traditional Sector Recovery - Traditional PCB demand is also recovering, contributing 70-80% of revenue for PCB companies, providing a solid foundation for the industry [5]. - The smartphone sector is benefiting from the unexpected shipment volumes of the iPhone 17 series, with global smartphone shipment forecasts for 2025/26 adjusted to 1.26 billion and 1.27 billion units, reflecting year-on-year growth of 3% and 1% respectively [5]. - The PC market is seeing a resurgence due to the replacement cycle following the end of Windows 10 support, with global PC shipment growth expected to exceed 4% in 2025/26 [5]. PCB Industry Chain Analysis - The PCB industry chain exhibits a concentrated value distribution, with substrates and copper-clad laminates (CCL) being the core raw materials benefiting from the AI demand explosion [7]. - BT substrates are experiencing high utilization rates due to the recovery in storage chip demand and supply shortages of key materials [8]. - The ABF substrate market is undergoing a domestic production acceleration, with potential for Chinese PCB companies to capture market share through cost advantages and localized services [9]. CCL Market Dynamics - The CCL market is characterized by a supply-demand imbalance in high-end products, with high-speed CCL being the most explosive segment due to AI server upgrades [10]. - UBS forecasts a 10-15% increase in high-speed CCL average selling prices (ASP) by the second half of 2025, with tight supply conditions expected to persist into 2026 [11]. Company Performance - Companies like Huadian and Shennan Circuits are well-positioned with full coverage of North American clients and strong relationships with major AI customers [12][13]. - Shenghong Technology is expanding aggressively and maintaining strong customer acquisition trends, while companies like Sinyi Electronics are benefiting from increased orders from AWS [13][14]. - The PCB sector's valuation reflects the industry's upward cycle expectations, with the PCB index rising 70% year-to-date, and a projected net profit CAGR of 42% from 2024 to 2027, indicating reasonable current valuations [17]. Conclusion - The Chinese PCB industry is entering a new upward cycle driven by AI, with upstream segments like substrates and CCL, along with leading companies in the AI server supply chain, being the primary beneficiaries [17].

Core Viewpoint - LG Chem has developed advanced liquid PID (Photo Imageable Dielectric) materials for semiconductor packaging, targeting the artificial intelligence and high-performance semiconductor markets, highlighting the increasing importance of PID in high-precision circuits [2][4]. Group 1: Product Features - The liquid PID material offers high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, enhancing process stability [2]. - The new PID is free from PFAS, NMP, and toluene, aligning with environmental regulations [2]. - LG Chem has also developed a film-type PID to address issues of uniformity on large substrates, which include maintaining consistent thickness and graphic fidelity, high strength and elasticity to reduce cracking during thermal cycles, low moisture absorption for long-term reliability, and compatibility with existing processes [3]. Group 2: Expansion in Semiconductor Packaging - LG Chem is expanding its production and R&D scale in key backend materials for advanced semiconductor packaging, which includes products such as Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [3].

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

Summary of Conference Call on PCB Industry Industry Overview - The conference call discusses the PCB (Printed Circuit Board) industry, highlighting the significant demand driven by advancements in AI and data centers, particularly due to NVIDIA's investment in OpenAI of 100 billion RMB, indicating a robust demand for GPU and ASIC chips, which in turn boosts PCB demand [1][2]. Key Insights and Arguments - **NVIDIA's Product Evolution**: NVIDIA's transition from the eight-card architecture to the GB200/GB300 series and now to the Ruby series has led to significant enhancements in PCB specifications, including increased layers and density, which raises the value of single-chip PCBs [1]. - **Market Demand Projections**: The global PCB market demand is expected to exceed 90 billion RMB by 2026, but supply-side capacity remains tight due to the heavy asset nature of the industry and long production cycles, with overseas production lagging behind expectations [1][8]. - **Supply-Demand Dynamics**: The PCB industry is anticipated to experience a relative shortage of capacity in the coming years, as companies like Huadian Technology and Shenghong Technology are accelerating expansion, but at a pace slower than the explosive demand growth [1][9]. - **Investment Potential**: Companies such as Huadian Technology, Shenghong Technology, and Pengding possess significant investment potential due to their client progress and capacity expansion. Additionally, upstream material suppliers like Shengyi Technology are gaining traction within the NVIDIA and Amazon supply chains, indicating strong future growth [1][10]. Additional Important Points - **Role of PCBs in Data Centers**: PCBs play a crucial role in data centers for carrying and transmitting signals, with specifications improving significantly with each chip iteration. The shift towards PCBs over traditional copper cables is driven by better heat dissipation and lower maintenance costs [3]. - **Specific Requirements of NVIDIA's Series**: The Ruby series introduces an orthogonal backplane solution, replacing some copper cable connections, which enhances assembly efficiency and significantly increases the value of single-chip PCBs to approximately 150,000 to 200,000 RMB [6]. - **Material Upgrades**: The PCB market's growth is also tied to advancements in upstream materials, particularly in copper-clad laminates (CCL) and copper foil, with companies like Shengyi Technology adapting production lines to meet demand surges [11][12]. - **Future Supply-Demand Structure**: The supply-demand structure in the PCB industry is expected to remain tight due to rapid demand growth and the heavy asset nature of the industry, which prolongs new factory setups and customer validation cycles [13]. - **NVIDIA's Orthogonal Backplane Progress**: The orthogonal backplane solution from NVIDIA is still in the validation phase, with expectations of adoption, indicating a potential upward valuation for the PCB segment [14].

Summary of Conference Call on PCB and CCL Industry Industry Overview - The PCB (Printed Circuit Board) industry is experiencing a continuous increase in demand and price for electronic materials, particularly CCL (Copper Clad Laminate) due to the rising need for high-performance materials driven by advanced chip technologies [1][2][5] - The cost structure of CCL indicates that raw materials account for 90% of its cost, with copper foil and resin being the primary cost drivers [1][2][4] Key Trends and Developments - High-end chips are significantly increasing the demand for high-speed and high-frequency CCL, which is essential for advanced PCB technologies such as HDI (High-Density Interconnect), multi-layer, and M-SAP (Modified Semi-Additive Process) [1][5][6] - The industry is expected to see a demand increase of 3 to 4 times from 2026 to 2027, primarily driven by the Ruby Ultra product line and R series chips [2][14] - The production process of CCL involves multiple steps, including resin mixing, soaking electronic cloth, drying, cutting, and laminating copper foil, which are critical for ensuring the quality of the final PCB product [4][10] Supply Chain Dynamics - The supply chain for CCL is complex, with a verification cycle lasting from 1.5 to 2 years, requiring frequent feedback and adjustments across various stages [1][10] - Key upstream suppliers include companies like 德芙 (Daf), 菲利华 (Feilihua), and 中材 (Zhongcai), which provide essential materials such as electronic cloth, copper foil, and resin [7][11] Challenges and Barriers - Solid-state materials face significant challenges in the drawing and weaving processes, particularly with quartz materials, which have a slower yield rate due to their hardness [8] - The resin segment has a high R&D barrier due to the need for close customer collaboration and continuous adjustments to meet performance specifications [9] Market Forecast and Financial Insights - The market for high multi-layer PCBs is projected to grow, with each PCB requiring approximately 6 times its weight in CCL, indicating a substantial market opportunity [12] - The expected revenue from the Ruby series is projected to reach 2 billion, with a profit of 1 billion, highlighting the financial potential of new product lines [13] - The overall market for carbon-hydrogen resin is estimated to reach 1.9 billion, with the industry revenue currently around 1 billion, indicating significant growth potential [13][14] Conclusion - The PCB and CCL industry is poised for substantial growth driven by technological advancements in high-end chips and the increasing demand for high-performance materials. The supply chain dynamics, production challenges, and financial forecasts suggest a robust outlook for the industry in the coming years [1][14]

Summary of Conference Call on HVLP Copper Foil and Related Industries Industry Overview - The conference call primarily discusses the **HVLP copper foil** market and its relation to the **AI server** industry, particularly focusing on the advancements in **NVIDIA's** chip technology and the implications for the **PCB (Printed Circuit Board)** sector [1][4][5]. Key Points and Arguments AI Industry Developments - The AI industry has transitioned from training to inference, marking a significant deepening of AI applications. NVIDIA's recent launch of the **Rubin XPS GPU** enhances processing performance and cost efficiency for context inference and video generation [2][4]. - The demand for **CCL (Copper Clad Laminate)** is expected to grow alongside AI server upgrades, with NVIDIA's upcoming **CPX chip** anticipated to utilize **M9 materials** [1][4]. Market Dynamics - The high-end electronic foil market is currently dominated by **Mitsui Mining & Smelting**, which has raised its global shipment guidance and increased the proportion of high-end products. Despite competition from Taiwanese, Japanese, and domestic manufacturers, the growing downstream demand is expected to expand market opportunities [1][5]. - The high-end electronic circuit foil market is projected to reach approximately **10 billion** yuan by 2026, with the AI PC market estimated at **70 billion** yuan. Demand for third and fourth generation products is expected to be around **30,000 to 35,000 tons** [3][9]. Domestic Substitution Trends - Domestic substitution in the high-end electronic foil sector is accelerating, but the high technical barriers and long validation cycles for HVLP copper foil create a supply-demand mismatch. The substitution process is expected to gain momentum from late 2025 to mid-2026 [1][6]. Profitability and Cost Structure - There is a significant difference in processing fees across different generations of HVLP copper foil. The processing fees for second, third, and fourth generation products are **100,000**, **150,000**, and **200,000 yuan per ton**, respectively, compared to traditional ITF copper foil priced between **20,000 to 70,000 yuan per ton**. This pricing structure enhances profitability for domestic electrolytic enterprises [8][12]. Company Performance Insights - **Defu Technology** is expected to ship around **1,000 tons** of high-end electronic circuit foil in the first half of 2025, with projections for total shipments to reach **3,000 to 4,000 tons** by year-end. The company is also increasing its production expectations and entering the **Taiwan Light** supply chain [10][14]. - **Copper Crown Copper Bo** anticipates a production capacity of **55,000 tons** of high-end electrode foil by 2026, with a focus on meeting the supply chain demands [11][20]. Future Outlook - The overall market for high-end electronic circuit foils is expected to remain tight, with both Defu Technology and Copper Crown Copper Bo focusing on customer share growth and capacity expansion [11][20]. - Defu Technology's profit forecast for 2026 is projected to exceed **1 billion yuan**, driven by contributions from its lithium battery segment and the integration of **Wusonbao** [17][18]. Additional Important Insights - The high-end electronic foil market is characterized by a collaborative expansion among manufacturers rather than zero-sum competition, indicating a positive outlook for supply dynamics [5][6]. - The transition period for production line changes at Defu Technology is relatively short, typically requiring only one to two weeks for adjustments, reflecting operational efficiency [18][19]. This summary encapsulates the critical insights from the conference call, highlighting the evolving landscape of the HVLP copper foil market and its interconnections with the AI industry and broader electronic components sector.