CTE 布：载板链条涨价+CPU 加单 20260201 摘要 AI 发展驱动电子级玻纤布需求激增，GPU 服务器中 T 波布用量远超手机， AI 服务器对 HBM、SSD 等需求增加，进一步推高玻纤布需求，预计玻 纤布价格上涨趋势将持续。 红河计划第一期玻纤布涨价 20%，美松面临日东纺涨价压力。日东纺计 划 2026 年底完成扩产，预计 2027 年 Q1 量产，扩产后总产能预计增 加三倍，但具体分配比例尚未明确。 GPU 对 ABF 载板需求显著增加，Intel 提前预订订单，Uni Micro 和芯 恩电子全年订单增加 30%。NVIDIA AI 服务器大量使用 ABF 材料，推 动 ABF 材料需求爆发。 ABF 材料市场由日本企业主导，阿基诺摩托公司近乎垄断。英伟达和英 特尔积极扩展 ABF 产能，据悉产能已排到 2027 年，表明 ABF 材料仍 供不应求。 AI 发展显著影响存储器市场，AI 服务器内存条需求是普通内存条的四倍。 HBM 依赖 ABF 材料，3D NAND Flash 使用 BT 材料，预计 2025 和 2026 年全球存储器市场分别增长 35%和 25%。 Q&A 最近载板 ...

Core Viewpoint - The construction and building materials industry is undergoing a significant restructuring and value reassessment driven by the deepening "anti-involution" policies, accelerated state-owned enterprise (SOE) restructuring, and improving expectations in the real estate chain [1] Group 1: Policy Environment - The strategic restructuring of SOEs aims to merge similar entities and reduce homogeneous competition among construction SOEs, while the "anti-involution" policy promotes supply-side reforms in traditional building materials, enhancing industry concentration and optimizing competition [3] - The State-owned Assets Supervision and Administration Commission (SASAC) has indicated a strong push for strategic and professional restructuring of SOEs, which is expected to reduce internal competition and enhance overall profitability [3] - The implementation of the "anti-involution" policy has led to significant production capacity adjustments in the cement industry, with over 280 clinker production lines replaced and 150 million tons of outdated capacity withdrawn annually, creating a foundation for industry profitability recovery [3] Group 2: Industry Structure - Traditional building materials leaders are expected to benefit from supply clearing and cost transmission, leading to a recovery in profitability, while new materials serving sectors like renewable energy and AI are experiencing independent growth [4] - In the traditional sector, leading companies in waterproof materials and cement are expected to consolidate their market positions and improve profitability due to their strong pricing power amid rising raw material costs [4] - New materials, such as electronic-grade fiberglass, are positioned for growth driven by demand from consumer electronics, electric vehicles, and AI servers, indicating a clear second growth curve for the industry [4] Group 3: Demand Side - Although long-term population trends may pressure overall construction demand, short-term real estate policies are expected to stabilize demand for building materials, particularly in the consumer segment [5][6] - Recent signals from policy levels have indicated a recovery in the second-hand housing market, which is expected to stabilize demand for construction materials [6] - New demands from urban renewal and major national projects are anticipated to provide additional growth opportunities for the construction materials sector [6] Group 4: Supply Side - Rising prices of upstream raw materials are prompting certain segments of the building materials industry to initiate a price increase cycle, benefiting leading companies with pricing power [7][8] - The transition to green and intelligent production is becoming a new industry standard, raising entry barriers and investment costs, which may favor stronger companies capable of upgrading [8] Group 5: Investment Strategy - The construction materials sector is diverse, and investing through the building materials ETF (159745) allows for efficient exposure to leading companies across the entire industry chain [9][10] - The ETF tracks the CSI All-Share Construction Materials Index, providing balanced exposure to key sub-sectors and benefiting from both traditional sector recovery and new material growth [10] - The current period of industry transformation presents a unique opportunity for investors to capitalize on the shift from disordered expansion to a more optimized and concentrated market structure [10]

Group 1 - The article discusses the upcoming 2026 Future Industry New Materials Expo, which will focus on common needs in future industries such as robotics, automotive, drones, data centers, aerospace, AI, and new energy [1] - International Composite Material has announced a project to build a production line for high-frequency and high-speed electronic fiber cloth with an estimated total investment of 1.693 billion yuan, aimed at enhancing the company's competitiveness in high-end manufacturing [2] - The company has successfully launched an 85,000-ton electronic-grade glass fiber production line, with products certified for 5G low dielectric glass fiber and successful integration into leading supply chains [2] Group 2 - The report from CITIC Securities indicates that the demand for orthogonal backplanes and upgrades in Cowop technology will lead to PCB becoming more similar to semiconductors, resulting in a steady increase in value [3] - Domestic PCB companies are gaining global market share, which is driving the localization of upstream supply chains, including high-end resins, glass fiber cloth, and copper foil [3] - The article highlights the importance of optimizing production capacity and cost control in response to industry demand differentiation and price pressures in the terminal market [2]

Core Insights - The prices of electronic materials are expected to rise due to the dual impact of increasing international precious metal prices and surging demand for AI servers [1][4]. Group 1: Price Increases - South Asia plans to raise the prices of all copper-clad laminate (CCL) products and PP by 8%, effective from late November, in response to rising costs of international LME copper prices, copper foil processing fees, and electronic-grade fiberglass cloth [1][4]. - The demand for electronic-grade fiberglass cloth is currently outstripping supply, with Taiwan Glass confirming this situation while aiming to become the second-largest player in the high-end fiberglass cloth market by 2026 [1][4]. Group 2: Industry Dynamics - The CCL market is significantly influenced by the costs of raw materials, with copper foil accounting for approximately 42% of the total cost, followed by resin at 26% and fiberglass cloth at 19% [2][6]. - AI servers are a major driver of CCL demand, with the usage of CCL in a single AI server being three times that of a regular server [3][7]. - The competition and collaboration between AI giants like Google and NVIDIA are expected to further boost the demand for AI servers, thereby increasing the need for CCL [3][7]. Group 3: Future Outlook - The president of Formosa Plastics Group and chairman of South Asia, Wu Chia-Chao, indicated that while the fourth quarter performance may be uncertain due to seasonal factors, the outlook for next year appears more promising, with a focus on profitability rather than revenue [1][4]. - Despite the unpredictable market conditions for next year, a significant improvement is anticipated by 2027 [1][4].

Core Viewpoint - Jin'an Guoji plans to raise up to 1.3 billion yuan through a private placement to enhance production capacity and R&D capabilities in the high-grade copper-clad laminate sector, marking its first equity refinancing since its IPO nearly 14 years ago [2][8]. Group 1: Capital Increase and Projects - The company intends to issue shares to no more than 35 specific investors, with the total fundraising amount not exceeding 1.3 billion yuan, which will be used entirely for a project to produce 40 million square meters of high-grade copper-clad laminates and for the construction of a research and development center [2][3]. - The total investment for the high-grade copper-clad laminate project is 1.501 billion yuan, with 1.25 billion yuan planned to be funded from the raised capital [4]. - The R&D center construction project has a total investment of 55.6217 million yuan, with 50 million yuan allocated from the fundraising [5]. Group 2: Market Context and Performance - The copper-clad laminate industry is experiencing a shift towards high-end products due to the rapid development of consumer electronics, AI terminals, and new energy vehicles, leading to increased market demand [3][8]. - Jin'an Guoji achieved a revenue of 3.251 billion yuan in the first three quarters of 2025, a year-on-year increase of 10.28%, and a net profit attributable to shareholders of 173 million yuan, up 73.9% [9]. - The company reported a significant recovery in its performance, with a non-recurring net profit of 151 million yuan, reflecting a year-on-year increase of 541.35% [9][10]. Group 3: R&D and Innovation - Jin'an Guoji's R&D expenses amounted to 135 million yuan, representing 4.15% of its revenue, with a total of 246 domestic patents and 2 foreign patents granted as of September 2025 [12]. - The company aims to enhance its R&D capabilities by adding advanced research and precision testing equipment, which will improve the efficiency of product performance verification and technology transfer [5][11].

Core Viewpoint - The company plans to invest in the expansion of its subsidiary, aiming to enhance its production capacity of electronic-grade fiberglass cloth, which is expected to improve its competitiveness in the market [1] Investment Details - The total investment for the project is expected to be no more than 100 million RMB, with fixed asset investment around 50 million RMB and working capital also around 50 million RMB [1] - The project is anticipated to begin trial production by the end of December 2026 [1] Strategic Importance - The expansion will meet the demand for electronic-grade fiberglass cloth from the subsidiary, ensuring a stable supply of raw materials [1] - This move is expected to strengthen the company's competitive position in the industry [1]

Core Viewpoint - The PCB market is experiencing a structural transformation driven by the demand for high-end products, particularly in AI-related applications, leading to a significant increase in both demand and prices for high-end PCBs [1][3][4]. Group 1: Market Conditions - The current PCB market is characterized by a shortage of high-end products and pressure on low-end products, with overall market conditions improving compared to last year [1][2]. - Many PCB companies have reported positive earnings forecasts for the first half of the year, with some companies experiencing significant growth, such as a 3.7 times increase in net profit for certain firms [2][3]. - The demand for high-end PCBs is being driven by the rapid growth of AI server hardware, which requires advanced PCB technologies [3][9]. Group 2: Company Performance - Major companies like Pengding Holdings and Huadian Electronics are seeing substantial increases in net profits, with expected growth rates exceeding 40% year-on-year [3][6]. - Companies involved in the production of electronic-grade fiberglass and copper-clad laminates are also reporting significant increases in sales and profitability due to rising demand [2][6]. - The overall order saturation for PCB manufacturers is reported to be over 90%, indicating strong market demand [6][7]. Group 3: Future Projections - The global PCB market is projected to grow significantly, with estimates suggesting a market value of $78.6 billion by 2025, driven by advancements in AI and high-performance computing [4][8]. - The demand for high-layer and high-density interconnect (HDI) boards is expected to grow at rates of 14.2% and 18.5%, respectively, indicating a shift towards more complex PCB designs [8][10]. - The industry is likely to face challenges related to potential overcapacity as more companies announce expansion plans to meet the surging demand for high-end PCBs [10][12]. Group 4: Technological Advancements - The shift towards high-end PCBs is accompanied by increased technical barriers, with only a few manufacturers capable of producing advanced PCBs that meet the requirements of AI servers and high-speed data transmission [9][11]. - Companies are investing heavily in new technologies and production capabilities to meet the evolving demands of the market, including investments in low-loss materials and advanced manufacturing processes [5][10]. - The regulatory environment is also pushing companies to focus on high-quality production and green manufacturing practices, further raising the competitive bar in the industry [11][12].

Group 1 - The core point of the article is that the subsidiary of the company, Anhui Jinrui Electronic Glass Fiber Co., Ltd., is currently operating at full capacity in the production of electronic-grade glass fiber cloth [1] Group 2 - The electronic-grade glass fiber cloth produced is primarily for the company's own use in manufacturing copper-clad laminate products [1]

Summary of Key Points from the Conference Call Industry Overview - The conference call discusses the PCB (Printed Circuit Board) industry, particularly focusing on the demand driven by AI technology and the evolution of high-end materials like CCL (Copper Clad Laminate) and advanced PCB types such as HDI (High-Density Interconnect) and AIPCB (3D PCB) [1][3][5]. Core Insights and Arguments - **AI Technology Impact**: AI has significantly boosted PCB demand, leading to a surge in high-speed boards and 3D PCBs. Companies like Shenghong have shown remarkable performance during this growth phase [1][3][5]. - **Material Upgrades**: The industry is moving towards higher frequency and lower loss materials, with a shift from traditional materials like PPO to more advanced hydrocarbon compounds. This trend is essential to meet the increasing performance and price demands from downstream applications [1][4][10]. - **Supply-Demand Dynamics**: The PCB industry is currently experiencing a supply-demand imbalance, with companies like Shenghong seeing profits rise from 1 billion CNY annually to nearly 1 billion CNY quarterly due to high demand [7][9]. - **Domestic Supply Chain Opportunities**: The domestic supply chain in China is crucial, as local companies are well-positioned to meet the growing demand, especially in the context of the global supply chain being dominated by foreign players [9][20]. - **Future Market Projections**: The market for server-side PCBs is expected to reach 50-60 billion CNY by 2026, with total demand potentially hitting 80-100 billion CNY across various devices [14][15]. Additional Important Insights - **High-End Material Requirements**: High-end CCLs are projected to account for about 50% of costs in the PCB market, with specific performance requirements such as low dielectric constant and low loss factors becoming increasingly critical [16][13]. - **Technological Integration**: The integration of HDI and high-layer PCB technologies is already occurring, with companies capable of producing both types of boards, indicating a trend towards more complex and higher-layered PCBs [6][24]. - **Emerging Trends and Challenges**: The industry faces challenges with new materials like motor materials and PAFE boards, which have high performance but also significant processing difficulties. The market is also seeing a clear TCB (Thermal Conductive Board) landscape dominated by companies like Shenghong [18][19]. - **Investment Opportunities**: There are significant opportunities in high-end PCB innovations, particularly in materials that cater to AI applications. Companies developing advanced materials and technologies are likely to see substantial growth [19][21][25]. Conclusion - The PCB industry is on a trajectory of growth driven by technological advancements, particularly in AI. The focus on high-end materials and the domestic supply chain's role in meeting demand are critical factors for future success. Investors should pay attention to long-term trends and the evolving landscape of materials and technologies within the industry [1][5][25].