Workflow
相机模组
icon
Search documents
【丘钛科技(1478.HK)】产品规格持续升级、IoT 模组放量有望拉动业绩超预期 ——跟踪点评报告(付天姿/王贇)
光大证券研究· 2025-07-09 14:25
Core Viewpoint - The company has shown a positive trend in mobile camera module shipments, with a year-on-year growth in June, driven by the launch of Huawei's flagship model [3] Group 1: Mobile Camera Modules - In June, the company's mobile camera module shipments reached 32.648 million units, with a month-on-month increase of 0.8% and a year-on-year increase of 1.5%, marking the first positive year-on-year growth in the first half of 2025 [3] - The total mobile camera module shipments for the first half of 2025 were 183.866 million units, reflecting a year-on-year decline of 14.8%, attributed to the company's focus on high-end products and reduction of low-end product shipments [3] - The proportion of shipments for camera modules with 32MP and above reached 53.4%, an increase of 5.5 percentage points year-on-year, indicating an upgrade in product specifications [3] - The company expects that the ongoing trend of optical specifications upgrades in mobile phones will drive significant increases in average selling price (ASP) and gross margin in the second half of 2025 [3] Group 2: Other Camera Modules - In June, the company's shipments of other camera modules reached 1.7 million units, with a month-on-month increase of 10.2% and a year-on-year increase of 99.3%, primarily due to significant growth in IoT and smart automotive camera module shipments [4] - The total shipments of other camera modules in the first half of 2025 saw a year-on-year increase of 47.9%, with the first and second quarters showing year-on-year increases of 16.6% and 86.3%, respectively [4] - The company has a broad layout in optical products for drones and handheld imaging devices, including camera modules and visual modules, and expects continued high growth in IoT camera module shipments due to the rapid expansion of the global consumer drone and handheld imaging device market [4] Group 3: Fingerprint Recognition Modules - In June, the company's fingerprint recognition module shipments reached 13.9 million units, with a month-on-month decrease of 8.8% and a year-on-year increase of 7.3% [5] - The first half of 2025 saw fingerprint recognition module shipments of 94.357 million units, reflecting a year-on-year increase of 59.7%, attributed to the company's increased market share [5] - The high-value ultrasonic fingerprint recognition modules have seen a significant increase in monthly average shipments, rising from 1.35 million units in the second half of 2024 to 2.273 million units in the first half of 2025, driving product specification upgrades [5]
索尼CIS,拆分?
半导体芯闻· 2025-04-29 09:59
*免责声明:文章内容系作者个人观点,半导体芯闻转载仅为了传达一种不同的观点,不代表半导体芯闻对该 观点赞同或支持,如果有任何异议,欢迎联系我们。 如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自半导体芯闻综合 ,谢谢 。 Sony传出考虑将半导体事业分拆出去、IPO(首次公开发行)上市,将营运资源集中在娱乐领域。 彭博社28日报导,据熟知详情的多位关系人士透露,Sony考虑以IPO上市为前提、将半导体子公 司「索尼半导体解决方案公司(SSS、Sony Semiconductor Solutions)」分拆出去,借此将营运资 源集中在娱乐领域。关系人士指出,SSS有可能会在今年内上市。 1位关系人士表示,Sony考虑活 用被称为「部分分拆(partial spin-off)」的手法、也就是分拆后母公司(Sony)仍将持续持有子公司 (SSS)部分股权。 报导指出,Sony半导体事业以使用于智慧手机等用途的影像传感器为核心,Sony影像传感器全球 市占率超过5成,不过为了维持优势、有必要持续进行迅速的大规模投资,而藉由将事业分拆,有 望更易于进行灵活的营运决策、资金调度。不过因川普的关税政策以及加强对中出 ...