证券代码：300480 证券简称：光力科技 债券代码：123197 债券简称：光力转债 光力科技股份有限公司投资者关系活动记录表 编号：20260123 | | □特定对象调研 □分析师会议 | | --- | --- | | □媒体采访 投资者关系活动 | □业绩说明会 | | | □新闻发布会 □路演活动 | | 类别 □现场参观 | | | √其他 | （投资者电话交流会） | | 参与单位名称及 | 中金资管：陈俊、崔海亮；浙商证券：厉秋迪、褚旭、胡嘉、赵洪。 | | 人员姓名 | | | 时间 2026 年 | 1 月 23 日 15:00-16:00 | | 地点 线上交流 | | | 上市公司接待人 | 总经理、董事：胡延艳 | | 员姓名 | 证券事务代表：关平丽 | | | 公司管理层简要介绍公司情况，并与投资者就公司半导体封测装备 | | | 业务、物联网安全生产监控装备业务的经营情况及其他投资者关心的问 | | | 题进行沟通交流，主要交流内容如下： | | | 1、截至目前，公司订单和发货情况？ | | | 答：感谢您的关注！公司国产化机械划切设备以其媲美国际一流产 | | | 品的性 ...

Core Insights - The article highlights the rapid development and production capabilities of Guangli Technology, particularly in the semiconductor equipment sector, showcasing its significant contribution to the local economy and the semiconductor industry [2][5]. Company Overview - Guangli Technology's first phase project has a maximum annual production capacity of 500 units of the ADT8230 model, which is currently in high demand due to market needs [2][3]. - The ADT8230 model is recognized as a major technological equipment in Henan Province, primarily used for precision slicing of wafers before semiconductor chip packaging [3]. Technological Advancements - The ADT8230 features a self-developed high-performance air spindle that utilizes air suspension technology for contactless support, achieving nanometer-level vibration control precision [3]. - The equipment's micro-level cutting precision and excellent edge control capabilities ensure high yield rates, while its dual-axis design enhances operational efficiency and reduces reliance on manual expertise [3]. Industry Impact - Guangli Technology's production activities have attracted over ten upstream and downstream supporting enterprises to the Zhengzhou Airport Economic Comprehensive Experimental Zone, forming an efficient semiconductor packaging equipment supply chain [3]. - The ongoing development of Guangli Technology's second phase project, which covers approximately 35,000 square meters and focuses on semiconductor back-end packaging and IoT security production equipment, is expected to be completed by 2027 [3][4]. Future Prospects - The completion of the new base will bring the company's total production area close to 100,000 square meters, reinforcing its leading position in the IoT security monitoring equipment and semiconductor packaging sectors [4]. - The company plans to enhance its research and development efforts in advanced equipment such as laser cutting and grinding-polishing integrated machines, thereby expanding its product matrix [4].