Group 1 - Northrop Grumman's "Cygnus" cargo spacecraft successfully docked with the International Space Station, delivering approximately 5000 kilograms of scientific materials and supplies, marking the company's 23rd resupply mission for NASA [2] - The OPPO Find X9 series will feature displays exclusively supplied by Tianma, with pre-orders already initiated [2] - Jiangsu Province launched its largest user-side energy storage station, capable of storing 240 megawatt-hours, which can meet the daily electricity needs of about 25,000 households [2] - Horizon Robotics plans to release a new integrated cockpit chip in 2026, with mass production expected next year, representing a significant advancement in intelligent driving technology [2]

Group 1 - Horizon is set to release a new integrated cockpit and driving chip in 2026, which is expected to be the most complex chip designed by the company to date [3] - The new chip development is led by Horizon's VP and Chief Architect Su Qing, focusing on defining computing power based on software algorithm requirements, which is becoming a mainstream development model in the autonomous driving chip sector [3][4] - The integrated cockpit and driving chip aims to reduce data transmission latency and simplify vehicle hardware design, offering a cost advantage over separate chips for mid-to-low-end autonomous driving and cockpit systems [5] Group 2 - Qualcomm is a major player in the integrated chip market, with its Snapdragon 8775 chip offering AI computing power of 72 Tops, and an upgraded version, the SA8797, providing 320 Tops, which is set to be used by companies like Li Auto and Leap Motor [4][5] - Horizon's lower-tier chips (J2/J3) still account for a significant portion of its shipments, with an expected shipment volume of around 4 million units in 2025, split evenly between low-tier and mid-to-high-tier solutions [5][6] - BYD is actively integrating its cockpit and driving teams to develop its own integrated chip products, with plans to launch a One-Board solution that combines cockpit and driving functions on a single PCB [6][7] Group 3 - BYD's "Heavenly Eye" driving assistance system is categorized into three platforms based on computing power and configuration, with plans to mass-produce the B platform by 2025, potentially offering advanced driving features at lower price points [7][8] - BYD aims to maintain its scale through smart technology, planning to introduce high-level driving assistance features at competitive prices as it faces increasing competition in the electric vehicle market [8]