公众号记得加星标⭐️，第一时间看推送不会错过。 对于汽车芯片市场而言，2025年算不上是一个"旺年"。 一方面，新能源汽车市场已经提前步入红海市场，连特斯拉CEO埃隆·马斯克都在在财报电话会议上坦承即将面临"运营阻 力"；另一方面，汽车芯片市场的业绩与预测也不容乐观，从德州仪器到意法半导体，都不复此前的乐观。 这不是一场突如其来的危机。自新冠疫情期间的供需失衡和超额下单风波后，汽车芯片行业就像一个负重前行的巨人，拖 着沉重的库存包袱，在充满不确定性的市场中艰难跋涉。近18个月的库存调整期，让整个行业都在痛苦地消化着过去 的"繁荣遗产"。 在这场行业寒冬中，德州仪器（TI）扮演着最坦率的"乌鸦嘴"角色。当其他同行还在寻找复苏的蛛丝马迹时，德州仪器 CEO哈维夫·伊兰毫不留情地给市场泼了一盆冷水："汽车芯片市场尚未复苏。" 要知道，在德州仪器服务的五大关键市场中，其他四个——个人电子产品、企业系统、通信设备和工业市场——都显示出 健康的复苏迹象。工业市场甚至呈现加速复苏的态势，在经历几个季度低迷后展现出积极势头。然而，汽车行业却像一个 格格不入的异类，增长微乎其微，复苏缓慢得令人绝望。 德州仪器的管理层在第二季度 ...

随着智能化进入下半场，过去高度依赖进口的汽车芯片市场，正在发生改变。 近日，"蔚来世界模型NWM"陆续推送到蔚来ET9、新ES6、新EC6等车型，开始在自研芯片"神玑 NX9031"上运行，但刚刚预售的乐道L90仍搭载的是英伟达Orin X芯片。 7月11月，蔚来创始人、董事长、CEO李斌在媒体会上向《中国经营报》记者表示，神玑是全球首个车 规级5纳米高阶智能驾驶芯片，一开始的产能是有限的，所以在较长时间内将主要应用于蔚来品牌，不 会上车乐道品牌。"乐道L90选择英伟达Orin X芯片，一方面在于这款芯片供应量十分充足；另一方面， 此前蔚来大部分车辆都使用这款芯片，积累的数据闭环可以快速让乐道复用。" 记者了解到，汽车应用场景极为丰富和复杂，除了产能问题，汽车芯片还有更高的可靠性要求。一款汽 车芯片想要进入国际通用汽车供应链认证通常需要2—4年，相关企业普遍面临研发投入大、回收成本难 的困境。 中经记者 郭阳琛 石英婧 上海报道 这让国际半导体巨头英特尔也不得不断臂求生。不久前，英特尔决定逐步收缩汽车业务，而这距离其首 次参加上海国际车展仅过了两个月。当时，英特尔还发布了第二代AI增强型软件定义汽车系统级芯片 ...

如何依托科技创新、产业升级与资本赋能的深度融合，推动企业上市培育工作？ 近日，首届湖北科技创新与产业融合发展论坛在武汉举行，湖北省地方金融管理局总会计师吴韧强表 示，湖北高新技术企业、科技型中小企业、专精特新企业数量众多，累计储备"金银种子"企业1355家， 要让多层次资本市场"活水"浇灌上市后备企业全周期生长。 2021年至2023年，湖北连续三年新增上市和过审企业达到20家。2024年，在A股IPO持续收紧的情况 下，湖北新增上市公司排名全国第6，境外上市家数为历年来最多；今年新增境内上市公司排名全国第 5，境外上市有望再攀高峰。 近日，湖北省出台了《新形势下重塑企业挂牌上市服务体系实施方案》，提出将构建"数据+产业"精准 遴选、动态管理机制，通过自主申报、各地各部门筛选、机构推荐、信用价值评价等多渠道，将企业纳 入后备名单。针对科技型、成长型、"专精特新"类企业，制定差异化准入标准，每年动态更新名单，实 现"优进劣汰、精准蓄能"，为企业挂牌上市奠定坚实基础。 当下，湖北上市企业集群不断壮大，新兴产业动能强劲。国产数据库、智能汽车AI芯片、电竞游戏、 交互式AI等四个新兴领域的"全国第一股"在湖北诞生，彰 ...

Core Insights - Qualcomm celebrates its 20 years in the automotive business and aims to leverage its "Snapdragon Digital Chassis" to drive industry transformation [3][5] - The company has established close collaborations with nearly all global automakers and numerous Chinese enterprises, witnessing explosive growth in the number of automotive manufacturers in China [3][5] Group 1: Automotive Business Development - Qualcomm has become the leading ecosystem supplier in the connected vehicle and infotainment systems sector, extending its leadership into cockpit and Advanced Driver Assistance Systems (ADAS) [3][5] - The company emphasizes the importance of ecosystem collaboration, partnering with major Chinese automotive manufacturers such as BAIC Group, Changan, and NIO [3][5] Group 2: ADAS and Safety - Qualcomm has focused on ADAS over the past two years, enhancing its competitiveness through superior chip performance, localized software support, and a comprehensive safety architecture [5][6] - The company has partnered with BMW to provide computer vision software and driving strategy stacks for the new generation of BMW models, set to launch in July 2025 [5][6] Group 3: Modular Architecture - Qualcomm is transitioning the automotive industry towards a centralized computing architecture, creating a highly complex, scalable, and modular framework that supports digital cockpit and ADAS functionalities [6][7] - The architecture's scalability allows for a range of vehicle models from entry-level to luxury, addressing market cost sensitivity [7] Group 4: Innovation and Market Impact - At the 2025 Shanghai Auto Show, over 100 vehicle designs or solutions based on Qualcomm's platform were showcased, highlighting the rapid implementation of its technology in China [9] - Qualcomm's strategy focuses on technological innovation and ecosystem collaboration, driving the automotive industry towards a smarter and safer future [9]

Core Viewpoint - Wuhan is accelerating the construction of a technology finance system that aligns with technological innovation, aiming to establish itself as a national technology finance center by 2027 through a comprehensive action plan [1][2]. Group 1: Action Plan Overview - The action plan outlines five major actions: nurturing patient capital, improving technology credit quality, building a multi-level capital market, risk compensation sharing, and optimizing the technology finance ecosystem [2]. - By 2027, Wuhan plans to establish over 50 specialized technology finance institutions and achieve a scale of over 300 billion yuan in equity investment funds and over 500 billion yuan in loans to technology enterprises [2]. Group 2: Government Investment Fund Role - The action plan emphasizes the role of government investment funds in guiding technology finance, with a focus on nurturing patient capital [3][4]. - Wuhan has integrated two government industry funds, which have collectively participated in the establishment of 111 funds and invested over 20.4 billion yuan, attracting over 83.4 billion yuan in social capital [4]. Group 3: Technology Credit Expansion - The action plan aims to enhance the technology credit service system by encouraging banks to establish specialized technology finance institutions and improve credit access for technology enterprises [7][8]. - As of June 11, 2023, Wuhan has issued 36.563 billion yuan in knowledge value credit loans to 4,287 technology enterprises, with plans to further innovate credit products [9]. Group 4: Multi-Level Capital Market Development - Wuhan is committed to developing a multi-level capital market, supporting the listing of technology enterprises through a structured nurturing approach [10][11]. - The city has seen significant progress in nurturing companies for capital market competition, with eight new domestic and foreign listed companies in 2024 [11]. Group 5: Mergers, Acquisitions, and Bond Financing - The action plan supports mergers and acquisitions for technology enterprises, allowing up to 80% loan coverage for controlling acquisitions [12]. - Since the introduction of the bond market "technology board" policy, Wuhan has successfully issued 172 billion yuan in technology innovation bonds, with 12 enterprises participating [13].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 科技产业观察室 。 随着美中科技竞争加剧，中国正积极推动汽车芯片国产化，预计到2027年完全采用自主研发与生 产的芯片。据日经新闻报导，至少有两家中国汽车品牌将于明年起开始量产搭载100%国产芯片的 车款。 中国政府透过工业和信息化部（MIIT）主导此项计画，要求各大车厂定期自评国产芯片采用率。 该政策目标大幅提升，从2024年的25%迅速调升到2027年完全使用自主芯片，这反映了中国推进 芯片自主化的强烈决心。 虽然官方未强制达成100%的目标，但各大汽车品牌如吉利、比亚迪等均表示愿意优先采用国产芯 片。某半导体开发商指出，即使外资芯片在中国设厂生产，车厂仍倾向选择完全自主的中国品牌。 然而，中国汽车芯片的自主化仍面临重大挑战。特别是在自动驾驶系统领域，仍高度依赖Nvidia和 高通等美国供应商，短期内难以完全替代。且中国芯片在性能与可靠性方面仍与国际一线品牌有明 显差距。 尽管存在上述瓶颈，中国汽车业界正积极与国内晶圆厂如中芯国际（SMIC）合作，重新审视整个 芯片供应链并验证国产替代方案的可行性。广汽集团（GAC）等企业更进一步强化了与晶圆厂的 ...

黑芝麻智能首席市场营销官杨宇欣 【文/观察者网专栏作者 心智观察所】 2025年，中国车市的硝烟，不仅弥漫在价格战的战场，更深藏于技术升级的暗涌。当"降本增效"成为全 行业的紧箍咒，电动化浪潮的喧嚣未歇，一场围绕智能化的下半场角逐已然鸣枪。 昔日动辄数十万的L2+乃至L3级高阶辅助驾驶，正悄然挣脱豪华与高价的桎梏，在芯片算力的跃升与电 子电气架构由"分布式"向"域控"乃至"中央计算"的革命性进化中，Tier2、Tier1以及整车厂这条生态链都 在寻找成本下探的坚实路径。高阶辅助驾驶这颗曾经遥不可及的明珠，正以意想不到的速度和姿态，向 着更广阔、更亲民的消费腹地加速下沉。 黑芝麻智能科技有限公司（以下简称"黑芝麻智能"）多年来坚持自主研发和创新投入，突破重重挑战， 持续践行"智驾平权"的美好愿景。近日，企业首席市场营销官杨宇欣向心智观察所讲述了黑芝麻智能是 如何依托其核心产品矩阵——华山系列高性能自动驾驶芯片与武当系列跨域计算芯片，深度参与并塑造 中国智能汽车未来图景的。 持续推动"智驾平权" 在终端价格战的压力下，主机厂的降本压力逐渐传导至产业链上游，而架构层面的创新能够带来质变级 降本。在汽车智能化的下半场 ...

Group 1: Company Insights - Siwei Map introduced the trend of equal driving rights, with mid-to-high level assisted driving functions penetrating into lower-end models, creating market opportunities [1] - The data compliance business showed significant growth, with the Intelligent Cloud segment expected to generate revenue of 2.254 billion in 2024, representing a year-on-year increase of 28.96% [1] - The world model has been applied in behavior prediction and trajectory generation, targeting OEMs and Tier 1 suppliers [1] - The company needs to achieve a certain sales volume to realize profitability, focusing on improving labor efficiency and controlling costs [1] - Strengthened regulatory policies are promoting high-quality development in the industry, with the company holding advantages in mapping and data compliance [1] Group 2: Technology and Product Development - Jiefa Technology specializes in automotive electronic chip design, with stable mass production of SoC and MCU chips, and the launch of the C8025E integrated chip for cabin and parking [1] - The cost of integrated products is primarily driven by computing chips, with the company reducing costs through large-scale procurement [1] - The expected labor efficiency ratio for 2024 is approximately 1.68 million in revenue per employee, an increase of over 50% year-on-year [1] - The company won a bid for the high-level autonomous driving demonstration zone project in Beijing and is actively following up on various vehicle-road-cloud projects in multiple cities [1] - Revenue growth is projected to exceed 12% in 2024, with an additional 3 million sets of basic driving fixed-point products and 600,000 sets of integrated parking products expected in Q1 2025, with confidence in significantly reducing losses [1]

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 5月19日晚，信邦智能发布公告称，公司拟通过发行股份、可转换公司债券以及支付现金的方式取得无 锡英迪芯微电子科技股份有限公司（以下称"英迪芯微"）控股权，并募集配套资金。 信邦智能表示，本次交易是公司围绕汽车产业链，经过全面考察和深度思考，选择规模大、增速快且国 产化率较低的汽车芯片赛道作为投资并购方向的重要举措，系公司在熟悉的汽车领域寻求新质生产力、 实现产业升级的关键布局。 根据2024年年报，信邦智能归母净利润仅495.07万元，同比暴跌88.33%，创下上市以来新低；扣非净利 润488.69万元，同比下降79.01%。 事实上，若追溯过往数据，自2022年IPO以来，信邦智能归母净利润和ROE（净资产收益率）均已连续 3年下降，上市后业绩迅速变脸。这一反差暴露了公司成本控制不力与业务扩张效率低下的问题，对景 胜科技的失败收购及海外新能源项目成本超支，进一步拖累了业绩。 值得注意的是，截至2024年末，信邦智能资产负债率仅为18.05%，从2018年的45%连续7年下降，账面 货币资金达8.01亿元，占总资产比例超40%，且无有息 ...

Core Viewpoint - Xunbang Intelligent is rapidly entering the automotive chip sector through a merger and acquisition of Wuxi Yindi Chip Microelectronics Technology Co., Ltd. (Yindi Chip) to enhance its business and address declining profitability [1][4]. Group 1: Acquisition Details - The acquisition will be executed through issuing shares, convertible bonds, and cash payments to gain control of Yindi Chip, along with raising supporting funds from no more than 35 specific investors [3]. - Yindi Chip is a leading domestic supplier of automotive-grade mixed-signal chips, with projected revenues of CNY 494 million and CNY 584 million for 2023 and 2024, respectively [1][8]. - The net profit for Yindi Chip is expected to be CNY 2.43 million in 2023 and a loss of CNY 28.99 million in 2024, with adjusted net profits of CNY 62.87 million and CNY 46.41 million, respectively [1][8]. Group 2: Strategic Rationale - The acquisition is part of Xunbang Intelligent's strategy to seek new productivity and achieve industrial upgrades in the automotive chip sector, which has a large scale, rapid growth, and low domestic production rate [4]. - The collaboration is expected to facilitate resource sharing, particularly leveraging Xunbang's established Japanese customer base to penetrate the Japanese automotive chip market [5]. - Yindi Chip has a strong competitive edge in the automotive chip market, having shipped over 250 million chips since its establishment in 2017, with over 90% of its revenue coming from automotive-grade chips by 2024 [4][5]. Group 3: Financial Performance - Xunbang Intelligent has experienced a continuous decline in net profit from CNY 65.06 million in 2022 to CNY 4.95 million in 2024, marking a total decline of approximately 94% compared to 2021 [7][8]. - The company aims to improve asset quality and operational performance through this merger, as it has faced challenges such as increased project costs and reduced orders in the automotive equipment sector [8]. - Yindi Chip's investment in R&D and talent acquisition is expected to strengthen its market position and support high-quality development in the automotive chip field [5][9].