自动驾驶赛道，新的百亿独角兽诞生！ 大疆孵化的智能化"地面部队"——卓驭科技，刚刚官宣融资，来自中国汽车工业老大哥一汽，投资总额超36亿，卓驭科技投后估值超百亿。 自动驾驶赛道在2025年底，梯队、阵营、名次在大浪淘沙中愈加清晰： 有人上市寻求资本市场的"热钱"，有人正面临着生死难题，也有人在背后默默发力，扩大自己的疆土…… 卓驭科技就是"开疆扩土"梯队的一员。 也是多模态VLA大模型、舱驾一体重构范式、传统主机厂转型追赶浪潮下，最被寄予厚望的那一个玩家。 获战投36亿，估值超百亿 与前三年的资本"寒冬"形成鲜明对比，自动驾驶行业在2025年呈现爆发之势。 包括L4/Robotaxi、低速无人车、传感器、L2+等等广义的自动驾驶赛道，今年融资大约19起，公开可查的资金总额已经超过400亿元。 卓驭科技刚刚官宣的融资，在今年一众新进展中是十分特殊的存在。 首先是资金总额高，占今年赛道融资总金额的近1/10，如果限定到L2+范围，卓驭科技则是今年从资本市场获得弹药补充最多的玩家。 与自动驾驶赛道的创业阶段相比，如今投资者阵营的构成中，VC身影逐渐淡出，产业资本成为主力，这也是产业方用真金白银为自动驾驶技术落地商业 ...

Core Viewpoint - The launch of the new Alpha T5 by Jihu marks a significant advancement in the mid-size SUV market, featuring both pure electric and range-extended powertrains, with a price range of 10.98 million to 15.48 million yuan [1] Group 1: Product Features - The Alpha T5 is the first model equipped with the Yuanjing intelligent driving assistance system, enhancing its safety and driving capabilities [1] - It incorporates a "bionic dual-eye" visual architecture that simulates human stereoscopic vision, allowing for effective obstacle detection and avoidance without relying on pre-existing databases [3] - The vehicle is powered by the Snapdragon 8775 automotive-grade chip, providing 144 Tops of computing power and enabling integrated cabin and driving domain functionalities [5] Group 2: Performance Metrics - The Alpha T5 achieves a 0-100 km/h acceleration time of 6.5 seconds when fully charged and 6.8 seconds when the battery is depleted [8] - The WLTC fuel consumption is recorded at 5.18 liters per 100 km, with an electric consumption of 16.5 kWh per 100 km, and a comprehensive range of 1215 km under CLTC conditions [8] Group 3: Design and Comfort - The vehicle features a streamlined design with a drag coefficient reduced to 0.243 Cd, and an increase in length by 70 mm, resulting in a wheelbase of 2845 mm [10] - The rear trunk capacity expands to 1546 liters when the second-row seats are folded down, enhancing storage options [10] - New color options include Vana Blue and Lava Gray for the exterior, and Chihuo Brown for the interior, adding to the vehicle's aesthetic appeal [10] Group 4: Battery and Charging Technology - The vehicle utilizes the "Beijing Automotive Shenqing" range-extended power system with Atkinson cycle technology, achieving a thermal efficiency of 43% [7] - The custom-made CATL battery maintains a discharge power of 140 kW even when the state of charge (SOC) drops to 9%, with a total output power of 200 kW from the battery and range extender [7] - The pure electric version boasts a maximum range of 705 km, with fast charging capabilities allowing 30%-80% charge in under 9 minutes, and over 500 km of range added in just 15 minutes [10]

Core Insights - The world's first mass-produced model equipped with Qualcomm's SA8775P integrated cockpit and driving solution, the new Alpha T5 from Arcfox, has officially launched [1] - Shenzhen Zhuoyu Technology Co., Ltd. is a core technology partner of Arcfox, driving the transition from "separate cockpit and driving" to "integrated cockpit and driving" [1] Group 1: Technological Advancements - Zhuoyu's Inertial Navigation Binocular™ is the most mature and reliable bionic vision solution in the industry, serving as the core sensor for the Alpha T5's advanced driving assistance [4] - This system perceives the three-dimensional world like human eyes, generating dense visual point clouds to detect and avoid obstacles, ensuring driving safety even in challenging conditions [4] Group 2: Architectural Innovations - Traditional automotive intelligence uses a "smart cockpit + smart driving assistance" dual-domain architecture, which has three limitations: increased manufacturing costs due to independent hardware deployment, potential delays in functional collaboration due to long data transmission links, and increased maintenance difficulty due to complex wiring [5] - The SA8775P integrated cockpit and driving solution developed by Zhuoyu and BAIC optimizes these limitations by integrating cockpit and driving systems into a single chip, allowing flexible software configuration of computing power without hardware redesign [5] Group 3: Milestones and Future Plans - The launch of the SA8775 integrated cockpit and driving solution marks a significant milestone in Zhuoyu's journey, following previous innovations in visual parking and mid-computing power driving assistance solutions [6] - Zhuoyu aims to continue collaborating with partners like BAIC to innovate in architecture and technology, providing safer and more efficient driving assistance solutions [6]

Core Insights - The strategic partnership between Botai Vehicle Networking Technology and SenseTime marks a significant step towards the integration of AI in smart cockpit technology, indicating a new phase in China's intelligent connected vehicle industry [1][2] Group 1: Strategic Collaboration - Botai and SenseTime will focus on the deep integration of AI large models in smart cockpits, while also investing in humanoid robots and integrated cockpit-driving solutions [1] - The collaboration aims to create a platform-level AI agent that offers a comprehensive solution from software to cloud services, enhancing the user experience in smart cockpits [1][2] Group 2: Technological Advancements - The partnership will leverage AIDC infrastructure and self-developed AI inference and training chips to reconstruct the smart cockpit experience across multiple dimensions, including personalized interaction and safety [2] - A high-efficiency collaborative mechanism for "end-side large models" will be established, forming an integrated smart connected vehicle platform [2] Group 3: Humanoid Robotics Development - The collaboration will combine SenseTime's advanced visual perception algorithms with Botai's expertise in hardware design and mass production to develop a new generation of flexible and intelligent humanoid robots [2] - These robots are expected to excel in scenarios such as smart cockpit services and vehicle maintenance, potentially transforming the robotics industry [2] Group 4: Ecosystem Development - The companies will work together to create a full-stack solution focusing on integrated cockpit-driving, vehicle-road collaboration, and international expansion [3] - The integration of driving decisions with cockpit experiences will be enhanced through AI-generated personalized features, promoting unified interaction among people, vehicles, and the environment [3]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告之內容概不負責，對其準確 性或完整性亦不發表任何聲明，並明確表示概不就因本公告全部或任何部份內容而產生或因 倚賴該等內容而引致之任何損失承擔任何責任。 PATEO CONNECT Technology (Shanghai) Corporation 博 泰 車 聯 網 科 技 ( 上 海 ) 股 份 有 限 公 司 （ 於 中 華 人 民 共 和 國 成 立 的 股 份 有 限 公 司 ） （股份代號：2889） 自願公告 訂立合作框架協議 本公告乃由博泰車聯網科技（上海）股份有限公司（「本公司」或「博泰」）自願作出。 訂立合作框架協議 本公司董事（「董事」）會（「董事會」）謹此宣佈，於2025年10月7日，本公司與上 海商湯智能科技有限公司（「商湯智能科技」）訂立合作框架協議（「合作框架協 議」）。 合作框架協議主要內容 合作原則 本公司及商湯智能科技基於「資源互補、優勢共享、合 作共贏」的原則，決定建立長期戰略合作關係，並簽署 合作框架協議，以共同推動人工智能在智能網聯汽車等 相關領域的融合與應用。 本公司及商湯智能科技將聯合部署高性能服務器， 依託A ...

Group 1 - Horizon is set to release a new integrated cockpit and driving chip in 2026, which is expected to be the most complex chip designed by the company to date [3] - The new chip development is led by Horizon's VP and Chief Architect Su Qing, focusing on defining computing power based on software algorithm requirements, which is becoming a mainstream development model in the autonomous driving chip sector [3][4] - The integrated cockpit and driving chip aims to reduce data transmission latency and simplify vehicle hardware design, offering a cost advantage over separate chips for mid-to-low-end autonomous driving and cockpit systems [5] Group 2 - Qualcomm is a major player in the integrated chip market, with its Snapdragon 8775 chip offering AI computing power of 72 Tops, and an upgraded version, the SA8797, providing 320 Tops, which is set to be used by companies like Li Auto and Leap Motor [4][5] - Horizon's lower-tier chips (J2/J3) still account for a significant portion of its shipments, with an expected shipment volume of around 4 million units in 2025, split evenly between low-tier and mid-to-high-tier solutions [5][6] - BYD is actively integrating its cockpit and driving teams to develop its own integrated chip products, with plans to launch a One-Board solution that combines cockpit and driving functions on a single PCB [6][7] Group 3 - BYD's "Heavenly Eye" driving assistance system is categorized into three platforms based on computing power and configuration, with plans to mass-produce the B platform by 2025, potentially offering advanced driving features at lower price points [7][8] - BYD aims to maintain its scale through smart technology, planning to introduce high-level driving assistance features at competitive prices as it faces increasing competition in the electric vehicle market [8]

Group 1 - The 2025 IAA Mobility exhibition in Munich showcased Black Sesame Intelligence's various chips and solutions, focusing on AI-driven smart vehicles [1] - Black Sesame introduced the "Safe Intelligent Foundation" solution, which utilizes the Wudang C1200 family of cross-domain integration chips to address safety and cost challenges in automotive cross-domain integration [1][2] - The Wudang C1200 family includes the C1236, the first domestic SoC chip supporting navigation-assisted driving, and the C1296, the industry's first multi-domain integration computing chip [2] Group 2 - The Huashan A2000 chip sample was a highlight, integrating CPU and NPU functionalities, and is designed to support advanced driver assistance systems and robotics [1][2] - The production results of the Huashan A1000 family have been successfully implemented in multiple vehicle models, including Geely Galaxy E8 and Dongfeng Yipai eπ007 [2] - Black Sesame aims to drive innovation and global collaboration in the automotive industry by providing cost-effective and reliable advanced driving assistance technology [2]

Core Insights - The automotive-grade SoC (System on Chip) chips are essential for vehicle intelligence, covering smart cockpit and autonomous driving, and are becoming key replacements for traditional ECUs as automotive electronic architectures upgrade [1][2] - The smart cockpit market is expected to double globally from $33.16 billion in 2021 to $70.63 billion by 2024, with China experiencing a growth rate exceeding 31% [1][8] - The penetration rate of cockpit domain controllers in China is projected to reach 29.37% by 2024, highlighting the potential in lower-tier markets [1][8] - Autonomous driving is accelerating towards L3 level, with significant penetration expected by 2025, and L4 level projected to reach 4.4% by 2027 [1][9] Industry Overview - Automotive-grade SoC chips are integrated circuits designed for automotive electronic systems, combining processors, memory, interfaces, and sensors into a single chip to enable functionalities like autonomous driving and smart cockpit [2][3] - The industry is characterized by a clear upstream and downstream collaboration, with upstream relying on imported IP cores and semiconductor materials, while the midstream chip design is active with companies like Horizon Robotics and Black Sesame [6][7] Market Segmentation - The automotive-grade SoC chips are primarily divided into two categories: smart cockpit SoCs focusing on CPU/GPU performance and multimedia processing, and autonomous driving SoCs emphasizing AI computing power and functional safety [3][5] - The smart cockpit market is rapidly growing, with a projected compound annual growth rate (CAGR) of 28.66% from 2021 to 2024, and expected to reach $148.41 billion by 2030 [8] - The autonomous driving sector is transitioning from ADAS to higher-level autonomous driving, with L3 technology expected to be implemented in 2024 [9] Competitive Landscape - The smart cockpit chip market is currently dominated by foreign companies, with Qualcomm, AMD, and Renesas holding 85% of the market share by 2024, while domestic suppliers have increased their market share from less than 3% to over 10% [12][13] - The autonomous driving SoC market is primarily led by Nvidia, Tesla, and Mobileye, but domestic companies like Huawei and Horizon Robotics are gaining traction [13] Future Trends - The automotive-grade SoC industry is evolving towards high computing power, low power consumption, and increased localization, with a target of achieving over 70% localization by 2028 [14][15] - The demand for high-performance SoC chips is expected to grow significantly as autonomous driving capabilities penetrate lower-tier vehicle markets [16] - The integration of chip technology with algorithms and tools is expected to enhance the competitive edge of domestic manufacturers, fostering a collaborative ecosystem [15][16]

Core Insights - The article discusses the successful hosting of the 2025 Chengmai SuperBrain online seminar, focusing on the theme of "integrating cockpit and driving with 'SuperBrain': an open ecosystem platform" [1] - Chengmai Technology launched the cockpit-driving integration production accelerator "SuperBrain platform," aimed at promoting the implementation of cockpit-driving integration [1][3] Industry Trends - The automotive industry is transitioning from distributed electronic architectures to domain control architectures, ultimately moving towards a central computing platform to address challenges such as long R&D cycles and insufficient hardware-software collaboration [3] - Cockpit-driving integration is identified as a key path to reduce costs and enhance efficiency by sharing computing power and building a unified software platform [3] Company Developments - Chengmai Technology has over ten years of experience in the smart automotive sector, offering mature solutions in smart cockpits, central domain control, and assisted driving [3] - The SuperBrain platform is designed for the next generation of automotive electronic architectures, leveraging established chip solutions from partners like NXP, Qualcomm, NVIDIA, and Horizon [3][5] Product Features - The SuperBrain platform is an integrated intelligent computing platform that supports flexible hardware configuration and continuous software upgrades, enabling real-time data sharing and dynamic computing power allocation [5] - It aims to help clients compress project development cycles and quickly create differentiated functionalities [5] Partner Insights - NXP highlighted the complexity and cost challenges of diverse ADAS architectures and introduced a scalable vehicle computing platform for software-defined vehicles [6] - Continental Group emphasized China's leadership in SDV and EEA evolution, suggesting that global OEMs may adopt strategies from Chinese manufacturers [6] - Nullmax discussed its evolution from independent domain control to integrated cockpit-driving solutions, focusing on AI-driven multi-domain integration for various transportation scenarios [7] Collaborative Efforts - A roundtable discussion among industry leaders reached consensus on the necessity of cross-chip integration and the establishment of unified interface standards as critical for mass production [8] - The launch of the SuperBrain platform marks a significant step for Chengmai Technology in the cockpit-driving integration field, with plans for continued collaboration with global partners to accelerate the large-scale implementation of smart automotive technologies [8]

Core Insights - The rapid development of "integrated cockpit and driving" in the Chinese market is driven by the fusion of independent smart cockpit and smart driving functions, creating a powerful "central brain" for managing all intelligent features of vehicles [1][2] - The evolution of automotive architecture is becoming the core of transformation in the automotive industry, with a shift from distributed systems to centralized systems [2][3] Industry Trends - The automotive architecture is transitioning from a distributed system with multiple independent "brains" to a centralized system, leading to the emergence of three main forms: integrated driving and parking, integrated cockpit and parking, and integrated cockpit and driving [2] - The trend towards centralized computing is exemplified by the adoption of a single universal SoC (System on Chip) as the core of central computing, with Qualcomm's Snapdragon Ride Flex SoC being a key player in this new phenomenon [2][3] Technological Advancements - The advantages of "computing power sharing" and cost reduction are prompting more automakers to consider the "integrated cockpit and driving" solution, as the computing power of cockpit SoCs and driving SoCs continues to increase [3][4] - NIO's central computing platform, ADAM, can share up to 256 TOPS of computing power between driving and cockpit functions, enhancing operational efficiency [3] Challenges - The challenge of "system multi-domain parallelism" remains a significant hurdle for the "integrated cockpit and driving" approach, as the differing focuses of smart cockpit and smart driving systems complicate their integration [4][5] - The increasing number of display interfaces and the need for advanced human-machine interaction (HMI) further elevate the computing power requirements for AI technologies in vehicles [5][6] Future Outlook - Many players in the automotive industry are actively launching products related to "integrated cockpit and driving," with over ten Chinese automakers and ecosystem partners planning to adopt the new Snapdragon automotive platform [6][7] - While "integrated cockpit and driving" is currently a leading solution, it may not be the ultimate answer for future smart driving technologies, indicating a need for ongoing evaluation as advancements occur [7]