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【私募调研记录】盘京投资调研江波龙、天孚通信
Zheng Quan Zhi Xing· 2025-08-27 00:07
Group 1: Jiangbolong - Jiangbolong's domestic market share in eSSD is second only to Solidigm and Samsung, with PCIe SSD and RDIMM products already in mass production for leading domestic enterprises [1] - The company's SOCMM products have been launched, offering over 2.5 times the bandwidth of traditional RDIMM and a 20% reduction in latency, while being one-third the size of standard RDIMM [1] - Jiangbolong has introduced TCM mode and partnered with SanDisk to launch customized UFS products, accelerating adoption among multiple Tier 1 customers [1] Group 2: Tianfu Communication - In the first half of 2025, Tianfu Communication achieved revenue of 2.456 billion yuan, a year-on-year increase of 57.84%, and a net profit of 899 million yuan, up 37.46% [2] - The growth in active business is primarily driven by increased deliveries of high-speed active products, with the company continuously expanding its customer base [2] - The company's Thailand factory has commenced production, with phase two focused on R&D and customer validation, expecting large-scale production next year [2]
江波龙(301308) - 2025年8月22日投资者关系活动记录表
2025-08-26 09:10
Group 1: Business Strategy and Product Development - The company focuses on enterprise-level storage products, emphasizing high-end technology, long R&D cycles, and strong customer loyalty, which tests the comprehensive strength of storage enterprises [2] - The SOCAMM product, designed for AI data centers, offers over 2.5 times the bandwidth and approximately 20% lower latency compared to traditional RDIMM, with a size one-third that of standard RDIMM [3] - The company has achieved a cumulative deployment of over 80 million self-developed main control chips by the end of July, with rapid growth expected [5] Group 2: Market Position and Competitive Advantage - The company ranks second in domestic market share for eSSD, following Solidigm and Samsung, with PCIe products starting to be adopted by leading domestic enterprises [2] - The TCM (Technology Contract Manufacturing) model is being developed to connect wafer manufacturers with core downstream customers, aiming to reduce industry cycle fluctuations and enhance market responsiveness [4] - The company has established strategic partnerships with major clients like SanDisk to launch customized high-quality UFS products for the mobile and IoT markets [6] Group 3: Financial Performance and Future Outlook - The company anticipates significant growth opportunities through its TCM model, which has already shown positive effects in collaboration with industry participants [4] - The self-developed UFS4.1 product achieves sequential read/write speeds of 4350MB/s and 4200MB/s, with random read/write performance reaching 630K IOPS and 750K IOPS, outperforming mainstream market products [5] - The company is preparing for the development of the next generation of main control chips to meet the increasing performance demands of AI terminals [5] Group 4: Risk Management and Market Challenges - Investors are advised to be cautious regarding the SOCAMM product, which has not yet generated revenue despite its potential applications in AI servers [3] - The company is leveraging its self-developed technologies to navigate market challenges and capitalize on growth opportunities in embedded business sectors [5]