台积电第二工厂的建设现场已实际停工（12月1日，熊本县菊阳町） 台积电熊本第一工厂已开始生产12~28纳米产品，受全球EV销量低迷等影响，开工率尚未达 到最初预期。第二工厂原本计划生产6~40纳米产品，目前台积电已启动相关调整，以引入 用于生产主流AI半导体的4纳米生产设备…… 日本经济新闻（中文版：日经中文网），台积电（TSMC）正考虑改变2025年10月在熊本县内开工建设 的新工厂的计划，改为生产尖端半导体。台积电已启动相关调整，以引入用于生产主流人工智能 （AI）半导体的4纳米生产设备。如果该计划得以实现，将有助于日本国内AI半导体的稳定供应。 美国英伟达等企业研发的AI半导体在各国和企业间遭到争抢。即使在AI数据中心新设计划接连不断的 日本，如何确保AI半导体供应也已成为重大课题。 AI半导体是一切技术革新的基础，因此，构建国内供应网对于提高产业竞争力至关重要。 半导体的电路线宽越小，性能就越高。台积电于2024年底投产的日本首个生产基地——熊本第一工厂 （熊本县菊阳町）已开始生产适用于车载半导体等的12~28纳米产品。原计划2027年投产的第二工厂原 本计划生产也适用于通信设备的6~40纳米产品。 ...

台积电第二工厂的建设现场已实际停工（12月1日，熊本县菊阳町） 受全球纯电动汽车（EV）销量低迷等影响，半导体市场复苏迟缓，第一工厂的开工率尚未达到最初预 期。如果第二工厂能够生产4纳米产品，将更易于生产需要更微细加工的AI半导体。除了4纳米产品， 设置AI半导体组装工序也在考量范围内。台积电将在评估日本国内需求后，决定是否调整计划。 目前，第二工厂的建设现场已实际停工。如果确定要调整计划，原定于2027年的投产时间可能会推迟。 台积电在接受日经采访时表示："我们在日本的项目正持续推进。目前，我们正与合作企业就建设工作 的细节及执行计划进行协商"。 负责运营熊本工厂的JASM公司（熊本县菊阳町）有索尼集团、电装、丰田汽车等日本企业少额出资。 总投资额为225亿美元（约合3.5万亿日元），日本经济产业省已决定提供约1.2万亿日元的资金支持。如 果因计划调整导致工厂完工推迟，日本政府的应对措施将成为焦点。 台积电熊本第一工厂已开始生产12~28纳米产品，受全球EV销量低迷等影响，开工率尚未达到最初预 期。第二工厂原本计划生产6~40纳米产品，目前台积电已启动相关调整，以引入用于生产主流AI半导 体的4纳米生产设备 ...

Core Viewpoint - Hyundai Mobis is making a significant move into the semiconductor and robotics sectors, aiming to accelerate innovation in electrification and software-defined vehicles (SDVs) [2][3] Group 1: Future Growth Strategy - The core focus of Hyundai Mobis's future growth strategy is to enhance its leading technological competitiveness, actively developing differentiated technologies to lead paradigm shifts and expand its global market presence [3] - The company plans to enter the next-generation in-car display market by developing the world's first windshield display technology using holographic optical films, with a prototype showcased at CES 2025 [3] Group 2: Software-Defined Vehicles (SDVs) - Hyundai Mobis is accelerating the development of key technologies for SDVs, which rely on software for all functionalities, emphasizing the importance of an integrated platform for precise control systems [4] - The company aims to complete the development of this integrated platform and vehicle demonstrations by 2028, targeting global commercialization [4] Group 3: Electrification and Battery Safety - Hyundai Mobis has accumulated substantial capabilities in electrification and plans to lead the market by developing solutions that address urgent customer experience pain points, such as battery safety [5] - The company is developing a battery system that prevents thermal transfer using fireproof materials and has created a system that automatically sprays extinguishing agents in case of battery fires [5] Group 4: Semiconductor Development - Hyundai Mobis is developing a total of 16 types of semiconductors, including those for airbags and motor control, with an expected production of 20 million units this year [6] - The company is focusing on building a domestic cooperative ecosystem connecting vehicles, foundries, and external partners to enhance its competitiveness in the automotive semiconductor sector [6] Group 5: Robotics Market Entry - Hyundai Mobis has announced plans to enter the actuator market for robotics, leveraging its long-term experience in automotive parts development [7] - The company aims to explore opportunities in sensors, controllers, and grippers, starting with actuators that control robot movements [7] Group 6: Financial Strategy and Shareholder Returns - Hyundai Mobis aims to improve its business structure centered on profitability, targeting an annual sales growth rate of over 8% by 2027 through optimizing high-value products [7] - The company plans to maintain its financial growth momentum, with a cash dividend policy consistent with last year and an increase in mid-term dividends from 1,000 KRW to 1,500 KRW [7]

Core Viewpoint - The article discusses the increasing efforts of Chinese automotive manufacturers and chip companies to develop and adopt domestic products in response to the U.S. government's tightening export controls on high-tech products, particularly in the automotive chip sector [1][3]. Group 1: Industry Trends - Chinese automotive manufacturers, including XPeng and NIO, are replacing NVIDIA chips with self-developed chips in their latest models [2]. - At least 10 Chinese chip companies are focusing on the automotive market as a core development area, with companies like Horizon Robotics, Huawei HiSilicon, and others rapidly emerging [2]. - The market share of domestic brands in the total supply of automotive chips is projected to rise from approximately 9% in 2024 to 15-20% in 2025, potentially reaching 50% within five years when including self-developed chips [4]. Group 2: Competitive Landscape - Companies like BYD, GAC, FAW, Great Wall, and Geely are increasingly investing in chip research, manufacturing, and packaging, posing a challenge to NVIDIA [3]. - Horizon Robotics is emerging as a significant competitor to NVIDIA in the smart driving market, providing optimized AI chips and software to over 40 automotive companies [5]. - In the L0 to L2 level smart driving solutions market, Horizon Robotics leads with a 33.97% market share, followed by Mobileye at 20.35% and NVIDIA at 14.71% [8]. Group 3: Technological Developments - The "Starry Sky One" chip developed by a Chinese company has achieved AI computing power of 512 TOPS, filling a gap in the domestic market for advanced autonomous driving chips [9]. - Chinese companies are making significant strides in producing mature process semiconductors, with expectations for rapid increases in self-sufficiency rates for microcontrollers and silicon carbide power switch chips from 19% to 67% and 5% to 74%, respectively, by 2030 [9][12]. - The rapid electrification and digitalization of Chinese automobiles are creating opportunities for new companies focused on designing logic chips for infotainment systems and autonomous driving features [12].