镇岳510 SSD主控芯片
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平头哥芯片卖爆了!
国芯网· 2026-01-30 13:58
国芯网[原:中国半导体论坛] 振兴国产半导体产业! 不拘中国、 放眼世界 ! 关注 世界半导体论坛 ↓ ↓ ↓ 1月30日消息,据报道,阿里巴巴旗下芯片业务"平头哥""真武"PPU芯片,总出货量已达数十万片,超越寒武纪, 于中国国产 GPU 厂商中处于领先地位! "真武"PPU芯片采用自研平行运算架构和片间互联技术,配合全栈自研软件栈,实现软硬件全自研; 其存储器为 96G HBM2e,片间互联带宽达到700 GB/s,可应用于AI训练、AI推理和自动驾驶。 阿里巴巴已将"真武"PPU大规 模用于千问大模型的训练和推理,并结合阿里云完整的AI软件栈进行深度优化,为客户提供一体化产品和服务。 据悉,"真武"PPU已在阿里云实现多个"万卡集群"部署,服务中国国家电网、中国中科院、小鹏汽车、新浪微博 等400多家客户。 业内人士透露,对比关键参数,"真武"PPU的整体性能超过了英伟达A800和主流中国国产GPU,与英伟达H20相 当。 此外,据多位业内人士表示,"真武"PPU性能优异稳定、性价比突出,在业内口碑良好,市场呈现供不应 求。 此外,多位行业从业者表示,"真武"PPU性能优异稳定、性价比突出,在业内口碑良 ...
阿里平头哥自研AI芯片浮出水面,已实现多个万卡集群部署
Nan Fang Du Shi Bao· 2026-01-29 04:19
1月29日,曾被央视《新闻联播》在2025年9月曝光的平头哥PPU芯片正式官网上线。这款由阿里自主研发的高端AI芯片命名为"真武810E",它的发布标志着 阿里的AI版图实现了从大模型、云服务到芯片的全栈布局。 "真武810E"芯片上线背后,正值外界传闻阿里拟分拆平头哥并独立IPO。成立于2018年的平头哥,是阿里全资持有的半导体芯片业务主体。成立以来,平头 哥推出含光800 AI推理芯片、倚天710 Arm服务器CPU、镇岳510 SSD主控芯片以及多款超高频RFID电子标签芯片等。 作为一款AI训推一体芯片,"真武810E"也让阿里的"大模型+云服务+芯片"的全栈布局思路更为清晰。阿里方面试图通过构建AI全栈体系,推动芯片架构、 云平台架构与模型架构的协同创新,从而实现在阿里云上训练和调用大模型时达到最高效率。 Qwen3-Max ← Qwen3-Max-Thinking + Qwen3-VL @ Qwen3-Coder Qwen-Image Fun-CosyVoice € Fun-ASR FINNA G 阿里云 中国最大、亚太第 云基础设施 覆盖 29 个地域, 92 个可用区 数据处理与分析 "真武8 ...
加速构建AI芯片生态闭环?阿里旗下芯片公司平头哥被传将独立上市
Jin Rong Jie· 2026-01-23 10:01
1月22日,据多家媒体报道,阿里巴巴(NYSE:BABA,09988.HK)正计划重组旗下芯片公司平头哥半 导体(T-Head),并支持其未来独立上市。 随着国内大型科技企业持续加大对AI算力与基础设施的投入,相关芯片公司正迎来资本化的窗口期。 有观点认为,平头哥的拆分计划是阿里巴巴AI自主研发体系加速构建闭环的重要标志。 此前,阿里巴巴集团CEO吴泳铭曾宣布将在未来三年投入超过3800亿元用于云与AI硬件基础设施建 设。而平头哥作为阿里系AI芯片研发商,或将成为阿里在AI时代构建长期竞争力的关键支撑。分拆上 市将为其在激励机制、融资能力及对外合作等方面提供更大的空间与灵活性。 财经频道更多独家策划、专家专栏,免费查阅>> 责任编辑:山上 消息传出后,阿里巴巴美股盘前一度涨超5%。截至发稿,公司尚未对此事作出正式回应。 平头哥半导体有限公司成立于2018年9月,由阿里巴巴此前收购的中天微系统与阿里达摩院内部芯片团 队整合而来。该公司拥有覆盖云端与终端的全栈产品体系,包括数据中心芯片和物联网芯片等,实现了 从设计到应用的全链路布局:在数据中心领域,已推出倚天710服务器芯片、含光800 AI推理芯片、 PPU ...
阿里旗下芯片公司被指将上市,曾一年造出据称全球最强AI芯片
2 1 Shi Ji Jing Ji Bao Dao· 2026-01-22 11:58
Core Viewpoint - Alibaba's semiconductor subsidiary T-Head is reportedly planning to go public, which has led to a significant increase in Alibaba's stock price, rising over 5% in pre-market trading [1]. Group 1: Company Developments - T-Head, established in September 2018, is Alibaba's fully-owned semiconductor business, focusing on a comprehensive product line that includes data center chips and IoT chips, achieving end-to-end design coverage [4]. - The company has made rapid advancements in chip development, with its first self-developed chip launched in September 2019, showcasing significant performance improvements over competitors [3][5]. - T-Head's AI chip, the含光800, has demonstrated exceptional performance, achieving a processing capability equivalent to 10 GPUs and significantly reducing processing time for image recognition tasks [5][6]. Group 2: Market Impact - The news of T-Head's potential IPO has been perceived positively in the market, leading to a notable increase in Alibaba's stock price, indicating investor confidence in the company's semiconductor ambitions [1]. - The successful launch of the 含光800 AI chip has positioned T-Head as a competitive player in the semiconductor industry, with plans to offer AI computing power through Alibaba Cloud, enhancing its market presence [6][7]. Group 3: Competitive Landscape - T-Head's advancements in chip technology are part of a broader trend in the semiconductor industry, where companies like Baidu are also pursuing IPOs for their AI chip divisions, indicating a growing interest in this sector [7].
阿里旗下芯片公司被指将上市,曾一年造出据称全球最强AI芯片
21世纪经济报道· 2026-01-22 11:40
记者丨陶力 编辑丨张伟贤 1月22日,一枚重磅炸弹落在了半导体圈和资本市场。 有消息称,阿里巴巴计划旗下的芯片子公司平头哥(T-Head)单独上市。消息一出,阿里巴巴 美股股价直线拉升,盘前涨幅一度超过5%。 21世纪经济报道记者就此消息向阿里巴巴官方求 证,暂未得到回复。 张建锋在大会上表示: "在全球芯片领域,阿里巴巴是一个新人,玄铁和含光800是平头哥的 万里长征第一步,我们还有很长的路要走。" 一直以来,阿里巴巴内部对于"芯片"研发业务讳莫如深。2025年9月18日,阿里巴巴合作伙伴 鼎信通讯在互动平台上回复投资者,称公司芯片开发采用平头哥的CK802 32位内核架构,平 头哥与公司签订有全面技术授权协议。 这被市场视为,平台哥在芯片领域的深耕和布局已经开始商业化落地。 "平头哥"即平头哥半导体有限公司,于2018年9月宣布成立,是阿里巴巴集团的全资半导体芯 片业务主体。该公司拥有端云一体全栈产品系列,涵盖数据中心芯片、IoT芯片等,实现芯片 端到端设计链路全覆盖。 此前9月16日,《新闻联播》报道了中国联通三江源绿电智算中心项目建设成效,其中披露了 平头哥最新研发的AI芯片PPU。产品线方面,平头哥 ...
突破存力瓶颈,平头哥镇岳SSD主控芯片:全面赋能
半导体行业观察· 2025-03-19 00:54
Core Viewpoint - The article emphasizes the critical role of storage power in the AI ecosystem, highlighting the need for innovative storage solutions to meet the diverse demands of AI throughout its lifecycle [1][7]. Group 1: Storage Power in AI - The demand for storage power is exponentially increasing as AI permeates all aspects of production and life, with storage being likened to the "blood system" supporting AI's "brain" [1]. - Different stages of the AI lifecycle have varying storage requirements: high bandwidth for data collection, low latency for data cleaning, energy efficiency for training, and cost-reliability balance for inference [1]. Group 2: Town Yue 510 SSD Controller Chip - The Town Yue 510 SSD controller chip from PingTouGe Semiconductor is positioned as a solution to the storage bottleneck in the AI ecosystem, achieving breakthroughs in architecture and algorithms [3][5]. - The chip is characterized as a "hexagonal warrior," excelling in low latency (4 microseconds for random writes), high energy efficiency (420K IO processing per watt), high bandwidth (≥3400K IOPS), high reliability (10^-18 UBER), low cost (supporting various NAND types), and high capacity (≥32TB) [4][6]. Group 3: Architectural and Algorithmic Innovations - The chip's architecture features a "bottom-up reconstruction" with six RISC-V cores forming a heterogeneous computing cluster, significantly reducing IO processing latency [5]. - Key algorithmic innovations include a combination of Bit-Flipping and Normalized Min-Sum algorithms for data error correction, achieving a UBER of 10^-18, placing it among the top tier in the industry [6]. Group 4: Ecosystem Development and Industry Collaboration - PingTouGe is actively building an ecosystem around the Town Yue 510 chip, with rapid productization and deployment in Alibaba Cloud's EBS services, achieving a 92% reduction in latency compared to competitors [9]. - Collaborations with companies like Yiheng Chuangyuan and Derui Lingxin have led to high-performance SSDs based on the Town Yue 510, enhancing capabilities for AI training and real-time data analysis [10][11]. Group 5: Future Outlook - The company is preparing for future advancements, focusing on the maturity of the ecosystem and planning the next generation of chips to further enhance reliability and reduce power consumption [14]. - The vision is to transform storage from a mere data container into a driving force for AI innovation, akin to essential utilities like water and electricity [14].