备受瞩目的台积电中科二期园区1.4nm制程新厂，基桩工程将于11月5日动工，台积电供应链传出，由于 美国基于分散地缘风险考虑，对2nm制程需求有急迫性，加上南科沙崙生态科学园区开发缓不济急， 1nm制程有可能提前落地中科厂。 台积电中科二期园区新厂10月17日正式向中科管理局申报开工后，中科管理局证实，台积电向管理局作 租地简报时，确定已由原规划的2nm制程，更改为更先进的1.4nm制程，预计2028年下半年实现量产。 据了解，美国要求台积电美国厂加速2nm家族的2nm及1.6nm制程量产时程，向前推进至2027年；这也 迫使台积电必须加快高雄厂1.6nm及中科厂1.4nm的建厂时程。 供应链说，台积电在美国的投资建厂，先进制程只到2nm至1.6nm，目前1.4nm制程尚未列入赴美投资规 划。 未来中科四座厂房量产，将是全球最大的AI结合高性能计算（HPC）芯片生产基地，初期投资金额预估 将达460亿美元，员工数则在8000至1万人。 另据了解，南科虽然规划提供给台积电1nm先进制程厂使用，但预计最快2027年底前完成各项审查工 作，接续才能交地建厂，势必无法符合美国对2nm、甚至1.6nm制程的需求。 对此 ...

Group 1 - TSMC has officially submitted the application for the construction of its A14 (1.4nm) advanced process plant in the Central Taiwan Science Park, with an estimated initial investment of up to $49 billion, creating 8,000 to 10,000 job opportunities [1] - The new plant is expected to begin mass production in the second half of 2028, with the first risk trial production planned to be completed by the end of 2027 [1] - TSMC's new facility will be the largest production base for AI/HPC chips globally, with projected revenues exceeding $50 billion once operational [1] Group 2 - Tainan City has successfully secured approval for the "Nanke Shalun Ecological Science Park," which is expected to be used for future 1nm semiconductor processes [2] - Recent investments from SoftBank and NVIDIA into Intel, along with Samsung's push for 1.4nm process mass production, have prompted TSMC to accelerate its 1.4nm process layout to maintain market exclusivity [2]