证券之星消息，2025年11月28日晶盛机电（300316）发布公告称长江证券、西部利得、弘尚资产、国寿安保基金、泓德 基金、华商基金、长证国际、建信理财、百年保险资管、东兴基金、合众资产、南方基金、光大保德信、国泰海通资 管、龙航资产、正圆投资、东方基金、道生投资、双安资产、博裕资本、开思私募基金、仙人掌资产、博时基金、三耕 资产、国华兴益、诺安基金、华西基金、青骊投资、金融街证券、笃诚投资、誉辉资本、利位投资、五地、鹏华基金、 智诚海威、山海资本、博远基金、从容投资、磐泽资产、金鹰基金、磐厚动量、富安达基金、泉果基金、同泰基金、太 保资产、恒邦兆丰、聚鸣投资、敦颐资产、淳厚基金、钦沐资产、海富通基金、恒健远志、中邮理财、睿亿投资、无锡 汇蠡投资、前海开源基金、赋格投资、泉汐投资、Marshall Wace、农银汇理、国联安、中银基金于2025年11月27日调研 我司。 具体内容如下： 问：请介绍一下碳化硅衬底材料的应用前景？ 答：SiC是第三代半导体材料的核心代表，因其耐高压、高频、高效等特性，广泛应用于新能源汽车、智能电网、5G通信 等重点行业。同时，在 R设备、CoWoS先进封装中间基板等新兴应用领域 ...

证券代码：300316 证券简称：晶盛机电 浙江晶盛机电股份有限公司投资者关系活动记录表 编号：2025-12 | 投资者关系活动 | √特定对象调研 □分析师会议 □媒体采访 □业绩说明会 | | --- | --- | | 类别 | □新闻发布会 □路演活动 □现场参观 □电话会议 □其他 | | 参与单位名称及 | 参见附件：参会投资者清单。 | | 人员姓名 | | | 时间 | 年 月 日 2025 11 27 | | 地点 | 电话会议 | | 上市公司接待人 | 投资者关系 林婷婷 | | 员姓名 | | | | 1、请介绍一下碳化硅衬底材料的应用前景？ | | | 是第三代半导体材料的核心代表，因其耐高压、高频、 答：SiC | | | 高效等特性，广泛应用于新能源汽车、智能电网、5G 通信等重点行 | | | 业。同时，在 AR 设备、CoWoS 先进封装中间基板等新兴应用领域， | | | SiC 也正逐步成为推动技术突破的关键材料。 | | | 12 寸碳化硅衬底材料的进展？ 2、请问公司 | | 投资者关系活动 | 答：9 月 26 日，公司首条 12 英寸碳化硅衬底加工中试线在子 | ...

Core Viewpoint - Jing Sheng Mechanical and Electrical announced the successful delivery of its self-developed 12-inch atmospheric silicon epitaxy equipment to leading domestic customers, achieving international advanced levels in key performance indicators such as resistivity, thickness uniformity, epitaxial layer defect density, production efficiency, and process repeatability [1] Group 1: Product Development and Delivery - The company is actively promoting customer validation for new products including the 12-inch dry-in-dry-out edge grinding machine and the 12-inch double-sided thinning machine [1] - The 12-inch silicon reduced pressure epitaxy growth equipment has successfully achieved sales, utilizing a single temperature zone and multi-temperature zone closed-loop control mode, combined with multi-vacuum zone precise pressure control technology to ensure high stability during the epitaxy growth process [1] Group 2: Technological Advancements - The unique flat cavity structure and multi-port diversion system design of the equipment significantly enhance the film thickness uniformity and doping uniformity of the epitaxial layer, meeting the high standards required for advanced processes [1] - The company has successfully developed ultra-fast ultraviolet laser grooving equipment for advanced packaging applications, filling a gap in the domestic high-end ultraviolet laser grooving technology field and achieving domestic substitution [1]

Financial Performance - In the first three quarters of 2025, the company achieved a revenue of ¥8,273,220,959.41 and a net profit attributable to shareholders of ¥901,103,576.55 [2] - As of June 30, 2025, the company had unfulfilled contracts for integrated circuit and compound semiconductor equipment exceeding ¥3.7 billion (including tax) [5] Product Development - The company launched its first 12-inch silicon carbide (SiC) substrate processing pilot line on September 26, 2025, marking a significant advancement in domestic equipment development with 100% localization [2][3] - The pilot line covers the entire process from crystal growth to detection, utilizing domestically developed equipment, thus establishing a complete closed loop for 12-inch SiC substrates [3] Capacity Expansion - The company is actively expanding its SiC production capacity, with a project in Shangyu aiming for an annual output of 300,000 SiC substrates and an 8-inch SiC substrate industrialization project in Penang, Malaysia [4] - Additionally, a project in Yinchuan is set to produce 600,000 8-inch SiC substrates annually, enhancing the company's technological and scale advantages in the SiC substrate field [4] Semiconductor Equipment Progress - The company has successfully delivered its self-developed 12-inch atmospheric silicon epitaxy equipment to leading domestic clients, achieving international advanced levels in key performance indicators [6] - The company is also advancing the market promotion of new products such as the 12-inch dry-in-dry-out edge grinding machine and the 12-inch double-sided thinning machine [6] Component and Material Development - The subsidiary, Jinghong Precision, is focusing on the localization of core semiconductor components, enhancing manufacturing capabilities and product quality [8] - In the semiconductor consumables sector, the company has achieved domestic substitution for quartz crucibles, leading the market share and gradually increasing it [10] Client Base and Market Position - The company has established a strong reputation among high-end clients in the semiconductor and photovoltaic industries, maintaining long-term strategic partnerships with notable firms [10] - Major clients include well-known companies such as Longi Green Energy, Tongwei Co., and JinkoSolar, contributing to the company's industry influence [10]

Summary of Key Points from the Conference Call of Jing Sheng Electromechanical Industry Overview - Jing Sheng Electromechanical focuses on three main business areas: semiconductor equipment, substrate materials, and consumables [2][3][5] - The company is actively advancing its 12-inch silicon epitaxy equipment, achieving international advanced levels in key indicators [2][3] - The transition from 6-inch to 8-inch silicon wafers is a significant trend in the industry, with expectations that 8-inch will become mainstream by 2027 [6][10] Company Performance - In the first three quarters of 2025, Jing Sheng Electromechanical reported revenue of 8.273 billion yuan and a net profit of 901 million yuan [3] - The company has successfully delivered 12-inch silicon epitaxy equipment to leading domestic clients and is developing new products such as laser external groove and laser slotting equipment [3][4] - The third quarter saw improved profitability due to high-margin semiconductor equipment revenue and effective cost control [3][12] Product Development and Market Strategy - The first 12-inch silicon carbide substrate processing pilot line has been completed, with 100% domestic equipment [2][5] - The company is expanding its global supply capabilities by building an 8-inch silicon carbide substrate project in Penang, Malaysia [2][7] - Jing Sheng Electromechanical is positioned as a leader in the 12-inch silicon carbide substrate market, with competitive advantages in 6-inch and 8-inch sizes [2][6] Competitive Landscape - The silicon carbide substrate industry is expected to see increased concentration among leading companies, with potential price declines due to scale supply increases [2][7] - The company aims to maintain its competitive edge through technological innovation and cost control, particularly in larger sizes [2][6] Future Outlook - The semiconductor equipment industry is expected to maintain high growth due to China's focus on expanding its semiconductor industry and increasing self-sufficiency [12][20] - The company anticipates a rebound in the photovoltaic equipment market in 2026, following a challenging 2025 [15][17] - The demand for silicon carbide in high-power applications, such as data centers, is projected to grow significantly, driven by its low-loss characteristics [11][13] Additional Insights - The company is investing in advanced manufacturing technologies to enhance efficiency for downstream clients [4] - The transition to larger wafer sizes is expected to lead to a healthier price trend for 8-inch wafers due to limited domestic capacity [10] - The company is also exploring various thermal materials, including silicon nitride and gallium nitride, to meet the growing demand in power semiconductors [18][20] This summary encapsulates the critical insights from the conference call, highlighting the company's strategic positioning, performance metrics, and future industry trends.

Summary of Jinsheng Electric's Conference Call Company Overview - **Company**: Jinsheng Electric - **Industry**: Semiconductor and Photovoltaic Equipment Key Points Financial Performance - In the first half of 2025, Jinsheng Electric achieved a revenue of 5.799 billion yuan and a net profit attributable to shareholders of 639 million yuan [3] - The company reported a net cash inflow from operating activities of 447 million yuan, a year-on-year increase of 55.84%, indicating improved financial management [2][4] Business Segments - Jinsheng Electric focuses on three main business segments: semiconductor equipment, substrate materials, and consumables [2] - The company has over 3.7 billion yuan in unfulfilled contracts for integrated circuits and compound semiconductor equipment as of June 30, 2025 [3] Semiconductor Equipment - The company successfully delivered 12-inch silicon epitaxy equipment to leading domestic clients and is promoting 8-inch silicon carbide (SiC) epitaxy equipment [3] - New products such as the 12-inch dry-in dry-out edge polishing machine and double-sided thinning machine are undergoing customer validation [3] - Jinsheng Electric is a market leader in large silicon wafer equipment and is expanding its overseas market for semiconductor components and consumables [3][4] Photovoltaic Equipment - The company is optimistic about the long-term development of the photovoltaic industry and is addressing overcapacity challenges through technological innovations [2][5] - New products like Topcon efficiency EPD equipment and BC end silver-free multi-wire welding equipment are expected to have a positive impact from 2025 to 2026 [5][6] Silicon Carbide (SiC) Development - Jinsheng Electric has made significant advancements in 12-inch SiC crystal growth technology and is validating 8-inch SiC substrates with global customers [2][4] - The company plans to produce 600,000 wafers per month to meet future market demand, anticipating that 8-inch SiC will fully replace 6-inch [2][7] - The expected turning point for SiC development is projected for 2026-2027, particularly in the automotive sector [3][11] Market Outlook - The company expects a significant increase in demand for 8-inch conductive chips and MOSFETs by 2026-2027, driven by investments from major players like Infineon [9][11] - The photovoltaic industry is recovering from a downturn, and Jinsheng Electric is focused on maintaining order expansion and enhancing competitiveness through innovation [16] Challenges and Strategies - The company faces challenges in the photovoltaic equipment sector due to intense competition and cash flow pressures, particularly in the dry pot and diamond wire segments [28] - Jinsheng Electric is committed to continuous investment in key areas to ensure long-term sustainable development despite current financial performance not meeting expectations [29] Inventory and Supply Chain - The company maintains a lean inventory in the photovoltaic sector, while semiconductor components are stocked due to the long cycle nature of the industry [20] Conclusion - Jinsheng Electric is strategically positioned in the semiconductor and photovoltaic equipment markets, with a focus on innovation and expansion to capture future growth opportunities in the SiC and photovoltaic sectors [2][3][4][5][6][7][11][16][29]

Financial Performance - The company achieved operating revenue of 579,895.11 million yuan in the first half of 2025, with a decline in revenue and profit from photovoltaic equipment and materials due to cyclical adjustments in the industry [2] - The semiconductor business continued to grow, with unfulfilled contracts for integrated circuits and compound semiconductor equipment exceeding 3.7 billion yuan as of June 30, 2025 [2] Semiconductor Equipment Development - The company successfully delivered 12-inch atmospheric silicon epitaxy equipment to leading domestic customers, achieving international advanced levels in key performance indicators [3] - New products such as the 12-inch dry-in-dry-out edge grinding machine and 12-inch double-sided thinning machine are undergoing customer validation [3] Silicon Carbide Substrate Progress - The company made significant breakthroughs in the growth of 12-inch conductive silicon carbide crystals, addressing core challenges in temperature uniformity and crystal cracking [4] - The company is expanding its global customer verification for 8-inch silicon carbide substrates and has received bulk orders from international clients [4] Semiconductor Components and Materials - The subsidiary, Jinghong Precision, is enhancing its manufacturing capabilities for core components, focusing on precision processing and special welding [5] - The company has achieved domestic substitution for semiconductor quartz crucibles, leading the market share and overcoming technical bottlenecks for large-sized crucibles [5] Sapphire Business Growth - The sapphire material business experienced year-on-year growth driven by new applications in LED and consumer electronics sectors [5] Customer Base and Risk Management - The company has established a strong reputation among high-end clients in the semiconductor and photovoltaic industries, with long-term strategic partnerships [6] - To mitigate order fulfillment risks, the company focuses on large, financially stable clients and implements strict credit management and contract practices [6]