Group 1 - The article emphasizes the critical role of ABF film (Ajinomoto Build-up Film) in the semiconductor industry, highlighting its importance as a key material for high-density interconnection and high-speed transmission in advanced chip packaging [2][4][5] - ABF film is predominantly produced by Ajinomoto, which holds over 95% of the global market share, creating a near monopoly in the industry [44][45] - The demand for ABF film is driven by the rapid advancements in AI, 5G communication, high-performance computing, and automotive electronics, with projections indicating significant market growth in the coming years [43][28] Group 2 - The global IC packaging substrate market is expected to reach approximately 96.1 billion yuan in 2024 and grow to 135.03 billion yuan by 2028, with a compound annual growth rate (CAGR) of 8.8% [31][32] - The market for storage chip packaging substrates is projected to grow from 13.26 billion yuan in 2023 to 18.95 billion yuan by 2028, while logic chip packaging substrates are expected to increase from 38.76 billion yuan to 55.40 billion yuan in the same period [31][33] - The article outlines the competitive landscape of the ABF film market, noting that domestic companies in China are beginning to emerge but still lag behind established players like Ajinomoto [44][45][48] Group 3 - ABF film's unique properties, such as low thermal expansion and excellent dielectric performance, make it suitable for high-density wiring and high-frequency applications, which are essential for modern electronic systems [7][25][29] - The article discusses the technological barriers to entry in the ABF film market, including patent protections, customer certification processes, and economies of scale that favor established manufacturers [48][49] - The future of ABF film is linked to advancements in chip technology, with expectations for even finer line widths and lower loss characteristics to meet the demands of next-generation applications [22][28][30]

Group 1 - ABF film (Ajinomoto Build-up Film) is a critical insulating material for semiconductor packaging, essential for high-density interconnection and high-speed transmission in advanced chips [5][7][25] - The global market for ABF films is projected to grow from approximately $471 million in 2023 to $685 million by 2029, driven by demand from high-performance computing, 5G communication, cloud computing, and automotive electronics [43][41] - Japan's Ajinomoto dominates the ABF film market with over 95% market share, creating a significant barrier for new entrants due to its extensive patent network and technical know-how [45][48] Group 2 - The global IC packaging substrate market is expected to reach approximately 96.1 billion yuan in 2024 and grow to 135.03 billion yuan by 2028, with a compound annual growth rate of 8.8% [31][30] - The demand for ABF substrates is primarily driven by high-performance computing, 5G communication, and automotive electronics, which require advanced packaging technologies [28][25] - The competitive landscape for IC packaging substrates shows that Taiwan, Japan, and South Korea dominate the market, with domestic Chinese companies holding a smaller market share [54][61] Group 3 - The ABF film's unique properties, such as low thermal expansion and excellent dielectric performance, make it suitable for high-density wiring and high-frequency applications [23][29] - The technology behind ABF films allows for extremely fine circuit lines, with capabilities of achieving line widths and spacings below 10μm, essential for modern high-performance chips [22][25] - The market for ABF films is expected to expand significantly due to the increasing complexity of chips used in AI, 5G, and automotive applications, which require advanced packaging solutions [43][41]