"中国芯片要爆发了。" 官宣完"地表最强"的英伟达新GPU后，黄仁勋面对全球媒体的镜头如是说。 英伟达已经收到了首批由台积电生产的Rubin GPU，每个GPU芯片都采用了HBM4高带宽内存，主板其他区域配备了32个LPDDR内存插槽，和HBM4内存 协同工作。 在FP4精度下，浮点计算性能可达50PFLOPs，相较于现有的GB300，性能有数倍跃迁。 而Vera则采用Arm架构，搭载了88个核心以及176线程，NVLINK-C2C互联带宽可达1.8TB/s。 他还大夸中国模型，直言Qwen、DeepSeek都是"世界级、革命性"的成果。 近一个小时的接连提问，有一半的问题都关于中国，仿佛让人忘了英伟达的新成果才是这场发布会的主角。 发布会上，老黄介绍了英伟达新核弹Vera Rubin，算力100PFLOPs，是英伟达首款专用AI计算机DGX-1性能的100倍。 该款芯片也正是OpenAI英伟达千亿大单第一阶段要部署的芯片，现在老黄手里已经有了样品，预计明年实现量产。 此外，老黄还官宣了英伟达在量子计算、6G通信、自动驾驶等其他领域的战略布局。 下一代芯片和超算 Vera Rubin平台是继GB200（Gra ...

CHINA - 2025/09/04: In this photo illustration, the logo of Advanced Micro Devices, Inc. (AMD) is displayed on the screen of a tablet. (Photo Illustration by Sheldon Cooper/SOPA Images/LightRocket via Getty Images)SOPA Images/LightRocket via Getty ImagesOn Monday, during its earnings announcement, Oracle (NYSE:ORCL) delivered a striking revelation that surprised even the most optimistic analysts. The company’s remaining performance obligations (RPO) for its cloud division surged 359% year-over-year, re ...

Core Insights - Compal Electronics has launched its new high-performance server platform SG720-2A/OG720-2A, designed for generative AI and large language model training, featuring AMD Instinct™ MI355X GPU architecture and advanced liquid cooling options [1][3][6] Technical Highlights - The SG720-2A/OG720-2A supports up to eight AMD Instinct MI350 Series GPUs, enabling scalable training for LLMs and generative AI applications [7] - It incorporates a dual cooling architecture, including air and two-phase liquid cooling, optimized for high thermal density workloads, enhancing thermal efficiency [7] - The server is built on the CDNA 4 architecture with 288GB HBM3E memory and 8TB/s bandwidth, supporting FP6 and FP4 data formats, tailored for AI and HPC applications [7] - High-speed interconnect performance is achieved through PCIe Gen5 and AMD Infinity Fabric™, facilitating multi-GPU orchestration and reducing latency [7] - The platform is compatible with mainstream open-source AI stacks like ROCm™, PyTorch, and TensorFlow, streamlining AI model integration [7] - It supports EIA 19" and ORv3 21" rack standards with a modular design for easy upgrades and maintenance [7] Strategic Collaboration - Compal has a long-standing collaboration with AMD, co-developing solutions that enhance efficiency and sustainability in data center operations [5] - The launch of SG720-2A/OG720-2A at both Advancing AI 2025 and ISC 2025 highlights Compal's commitment to expanding its global visibility and partnerships in the AI and HPC sectors [7]