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道氏技术携手两企业拓展原子级科学计算算力业务
Zheng Quan Shi Bao· 2025-08-07 18:35
Group 1 - The core viewpoint of the news is that Daoshitechnology has signed a strategic cooperation agreement with Gongji Technology and its affiliate Xinpeisen to collaborate on atomic-level scientific computing capabilities [1][2] - Daoshitechnology aims to build multiple intelligent computing centers for atomic-level scientific calculations, leveraging Gongji Technology's expertise in site selection and network layout, while Xinpeisen will provide high-speed computing servers [1] - The agreement is a framework document indicating the initial willingness to cooperate, and it does not involve specific financial amounts, thus the impact on the company's performance remains uncertain [2] Group 2 - Daoshitechnology is also expanding into the humanoid robotics sector, having signed another strategic cooperation agreement with Suzhou Nengsida and Xinpeisen to develop key components such as electronic skin and muscles for humanoid robots [2] - The company has a technological and production advantage in carbon materials, which will be integrated into the development of humanoid robot components, enhancing the application of its carbon material products [2] - For the first half of 2025, Daoshitechnology expects a net profit attributable to shareholders of 220 million to 238 million yuan, representing a year-on-year growth of 98.77% to 115.03% [3]
道氏技术:芯培森公司主要从应用AI相关技术
Mei Ri Jing Ji Xin Wen· 2025-08-04 08:06
Core Viewpoint - The company DaoTech (300409.SZ) is addressing investor inquiries regarding its investment in Chip Pei Sen APU, focusing on how it supports complex scientific calculations while lowering development barriers for researchers and enterprises [2] Group 1 - DaoTech emphasizes the use of AI-related technologies, such as AI Agents and large atomic models, to facilitate the use of APU computing power servers for researchers [2] - The company is also developing software interfaces that maintain users' existing habits, making it easier for scientific personnel to utilize the APU technology [2] - The response highlights the company's commitment to promoting the widespread application and adoption of its technology among researchers and enterprises [2]
道氏技术与能斯达、芯培森达成合作,共同打造更优性能人形机器人
Ju Chao Zi Xun· 2025-07-30 03:02
Core Viewpoint - Dao's Technology has signed a strategic cooperation agreement with Suzhou Nengda Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance the development and market expansion of key materials for humanoid robots [2] Group 1: Strategic Cooperation - The agreement focuses on integrating the strengths of the three companies in the new materials sector, particularly in carbon materials for humanoid robot components such as electronic muscles and skins [2] - Dao's Technology will be responsible for the research and production of carbon materials, while Nengda will apply these materials in formulations, and Chipenson will provide molecular simulation design and high-speed computing support [2] Group 2: Market Development - The three companies aim to leverage their market resources and brand advantages to jointly explore downstream customers and promote the sales and application of high-performance humanoid robot components [2] - The agreement serves as a framework for long-term cooperation, guiding future specific collaboration matters, which will be subject to regulatory approval and information disclosure obligations [2]
道氏技术拟与能斯达、芯培森就碳材料应用于人形机器人关键零部件开展合作
Zhi Tong Cai Jing· 2025-07-29 11:40
Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Xinpeisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration aims to integrate the strengths of all parties in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - The partnership will leverage Nengsida's advancements in electronic skin technology and Xinpeisen's APU computing servers to support material research and development [1] Group 2: Product Development - The strategic cooperation will facilitate the expansion of applications for carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The focus will be on accelerating the application process of carbon materials in critical components of humanoid robots, enhancing product performance [1]
道氏技术(300409.SZ)拟与能斯达、芯培森就碳材料应用于人形机器人关键零部件开展合作
智通财经网· 2025-07-29 11:38
Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance the development and market expansion of key materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration focuses on integrating the strengths of each party in the development of materials needed for humanoid robot components such as electronic muscles, electronic skin, and joints [1] - The partnership aims to leverage the company's technological and production advantages in carbon materials, while Nengsida has launched several electronic skins for humanoid robots [1] - Chipenson's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the joint efforts in material development [1] Group 2: Product Application and Market Expansion - The strategic cooperation will help the company expand the application scenarios of its carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The initiative is expected to accelerate the application process of carbon materials in key components of humanoid robots, enhancing product performance [1]
道氏技术:与两家公司签订《战略合作协议》
Mei Ri Jing Ji Xin Wen· 2025-07-29 11:35
Group 1 - The company, Dao Shi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to focus on innovation in the new materials sector [1] - Dao Shi Technology has established technical and production advantages in carbon material products, while Nengsida has launched several electronic skins for humanoid robots [1] - The collaboration aims to integrate the strengths of all parties to develop and market key components such as electronic muscles, electronic skin, and joints for humanoid robots, enhancing product performance through the application of carbon materials [1] Group 2 - For the fiscal year 2024, Dao Shi Technology's revenue composition is projected to be 99.97% from manufacturing and 0.03% from other sources [1] - As of the report, Dao Shi Technology has a market capitalization of 13.9 billion yuan [1]
道氏技术:签订人形机器人相关战略合作框架协议
Zheng Quan Shi Bao Wang· 2025-07-29 11:32
Core Viewpoint - Dao's Technology (300409) has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chip Peisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The agreement aims to integrate the strengths of the three companies in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - Dao's Technology has established technical and production advantages in carbon material products, while Nengsida has launched multiple electronic skin products for humanoid robots [1] - Chip Peisen's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the collaboration [1] Group 2: Focus on Carbon Materials - The collaboration will focus on applying carbon materials in the formulation of key components for humanoid robots, enhancing product performance [1]