从底层芯片技术到行业生态协同的全方位展示。 在车展首日， 黑芝麻智能创始人兼 CEO单记章在 发布会 开场演讲中回顾了公司成立八年发展历 程：凭借自研 ISP、NPU两大核心IP，构建了华山系列（辅助驾驶芯片）与武当系列（跨域融合芯 片）两大产品线，并成功登陆港交所成为"智能汽车AI芯片第一股"。过去几年，公司通过A1000 （本土首款车规级高算力芯片）、C1236（全球首款跨域融合芯片）等产品持续突破，2025年推出 的A2000系列更以全景通识高算力设计，率先支持大模型端侧推理，推动AI计算效率再升级。 面向未来，黑芝麻智能将以 "技术创新+开放生态"双轮驱动，聚焦芯片研发，赋能汽车智能化转型。 单记章指出，大模型进入端侧推理时代，计算效率与算法架构成为关键挑战。黑芝麻智能通过优化带 宽性能、探索混合模型架构，致力于突破"算法决定上限"的行业瓶颈。同时，公司立足汽车领域， 向机器人、边缘计算等场景延伸，以全栈技术能力开启智能时代的"计算革命"。 本文为IPO早知道原创 作者｜ Stone Jin 微信公众号｜ipozaozhidao 据 IPO早知道消息，黑芝麻智能（2533. HK ）携 旗下明星产品华 ...

Group 1 - The core focus of the article is on the advancements in AI computing capabilities for intelligent driving, emphasizing the shift from data-driven to knowledge-driven algorithms [2] - The founder and CEO of Black Sesame Technology, Shan Jizhang, highlighted that the year 2023 is seen as the year of large-scale mass production for intelligent driving, driven by end-to-end algorithms and high-performance AI chips [2] - A significant challenge identified is the bandwidth limitation following breakthroughs in computing power, with future advancements expected to focus on improving bandwidth [2] Group 2 - Black Sesame Technology has strategically developed foundational chips, including the A1000 chip launched in 2020 and the C1296 chip introduced in 2023, which is crucial for central computing in electronic and electrical architecture [3] - The company has upgraded its intelligent driving capabilities with the C1236 chip, based on 7nm technology, enabling comprehensive urban Navigation on Autopilot (NOA) functions [3] - The latest A2000 chip, which has been delivered to clients, represents a significant breakthrough in AI computing efficiency and supports data closed-loop and multi-chip high-speed interconnection [4]