（2025 年 6 月 30 日，北京）—— 中国 IC 独角兽联盟今日正式揭晓 "中国半导体行业高质量发展创新成果征 集" 活动获评榜单，涵盖领军人物、领军企业、优秀解决方案/产品三大类别，全面展现国内集成电路全产业链 的创新实力与发展成果。本次榜单聚焦设计、制造、封装、测试、材料、装备等关键环节，旨在通过标杆示范 推动行业技术突破与生态协同，助力中国半导体产业实现高质量发展。 一、领军人物：技术创新与产业变革的核心驱动力 三、优秀解决方案 / 产品：技术突破与市场落地的双重验证 榜单涵盖十大创新产品与解决方案，覆盖 AI 芯片、存储技术、汽车电子等热门领域，展现技术产业化的深度 融合。 1、北京安声科技有限公司 2024-2025中国智能耳机全链路最佳解决方案--智能耳机全链路 2、江苏神州半导体科技有限公司 榜单评选出十位在技术研发、企业管理与产业协同中表现突出的领军人物，他们凭借前瞻性战略布局与技术突 破，为行业发展注入新动能。 二、领军企业：全产业链协同发展的标杆力量 榜单表彰十家在细分领域具有领先地位的企业，其技术创新与市场表现为行业树立典范。 1、海世高半导体科技（苏州）有限公司 总经理 曹龙吉 ...

Group 1 - The company signed a non-binding letter of intent to acquire a target company focused on developing and selling cost-effective, low-power AI system-on-chip (SoC) solutions [1] - The target company's products include self-developed intellectual property for image signal processors (ISP), neural network processors (NPU), and analog IP, primarily serving the automotive intelligence and edge AI application sectors [1] - The acquisition aims to enhance the company's product offerings in automotive-grade computing chips and expand into broader robotics applications, providing a full range of AI inference chips and solutions [1] Group 2 - The company is a leading supplier of automotive-grade intelligent vehicle computing SoCs and solutions, ranking as the third-largest global supplier by shipment volume of high-performance automotive SoCs in 2022 [2] - The company showcased its Huashan and Wudang series chips at the 2025 Hong Kong Auto Show, including the Huashan A2000 chip designed for next-generation AI models, featuring the largest NPU core in the industry [2] - The Wudang C1200 family is designed for multi-domain integration and cockpit integration scenarios, with the C1236 being the first single-chip platform supporting high-speed assisted driving [3]

Group 1 - The automotive industry is experiencing a significant opportunity with the rise of third-party high-performance computing chips, as companies face the choice between self-developed and externally supplied chips for intelligent driving [1][4] - Tesla's strategy of self-developing HW3.0 and later collaborating with Broadcom for HW4.0 highlights the increasing importance of specialized third-party suppliers in meeting the growing computational demands of intelligent driving [1][3] - Black Sesame Intelligence, a leading domestic chip supplier, has proven its capabilities by becoming a supplier for BYD's "Tianshen Eye" intelligent driving platform and showcasing its products at the Hong Kong "Car Expo" [1][3][4] Group 2 - Black Sesame Intelligence's global expansion is a natural outcome of the trend of Chinese new energy vehicles entering international markets, with its chips widely adopted by major automakers like Geely and Dongfeng [4][5] - The company has been focusing on high-performance chips since its establishment in 2016, launching the 58 TOPS Huashan A1000 chip in 2020 and the 106 TOPS A1000 Pro in 2021, positioning itself ahead of competitors [5][6] - The launch of the Huashan A2000 family, capable of exceeding 1000 TOPS, aligns with the industry's shift towards higher-level intelligent driving features, making Black Sesame a viable alternative to NVIDIA's Orin [6][7] Group 3 - Black Sesame Intelligence is experiencing a commercial harvest period, with a projected revenue increase of 51.8% in 2024 and a gross margin rise to 41.1% [7] - The performance of a System on Chip (SoC) is not solely determined by computational power; the integration with algorithms is crucial, especially as AI model technology advances [7][8] - The Huashan A2000 family features the industry's largest NPU core, "Jiushao," designed for neural network computations, which enhances efficiency compared to traditional GPUs [7][8] Group 4 - The Jiushao architecture supports mixed precision and is optimized for high-precision quantization and Transformer algorithms, which are essential for the development of autonomous driving technologies [8][9] - Black Sesame Intelligence's technology is also being applied in the field of embodied intelligence, with its chips supporting various applications beyond autonomous driving, including humanoid robots [8][9] - The company has partnered with Fourier to provide computational support for its "Dexterous Hand," indicating its commitment to expanding into broader applications of embodied intelligence [9]

Group 1 - The 2025 Hong Kong International Auto and Supply Chain Expo aims to enhance the international development capabilities of China's automotive and supply chain industries through professional exchanges [1][10] - The event features representatives from the Hong Kong government, industry associations, financial institutions, and mainland automotive manufacturers discussing topics such as development strategies, supply chain innovations, and ESG competitiveness [1][2][3] Group 2 - Hong Kong is positioned as a significant international financial center and a hub for offshore RMB business, attracting mainland automotive companies due to its mature capital ecosystem and international trade channels [3][4] - The Hong Kong government has implemented multiple policies to foster high-quality economic development, including three major plans totaling 100 billion HKD each, aimed at promoting coordinated development across the automotive supply chain [4] Group 3 - The conference includes expert speeches addressing the challenges and future directions of the intelligent connected new energy vehicle industry, emphasizing the need for innovation in various aspects of the automotive sector [5][6] - A total of 57 projects have been shortlisted for the "China Automotive Supply Chain Innovation Achievement Recommendation," covering innovations in technology, management, branding, and business models [9][10] Group 4 - The event highlights the importance of financial services as an "accelerator" for the international expansion of the automotive industry, with financial institutions presenting tailored solutions for Chinese companies going abroad [8] - The conference will feature additional forums and activities focused on the rise of Chinese automotive brands and cross-border financial strategies, further promoting collaboration and innovation in the industry [10]

2025.04. 30 本文字数：1704，阅读时长大约3分钟 导读 ：本土供应链凭借技术突破、快速响应和成本优势，正在重构全球汽车产业格局，未来，智能汽车产业的竞争将不仅是单点技术的比拼，更是生态协同能力和供应链 整合效率的较量。 除了和英特尔合作外，黑芝麻智能近日也发布了基于武当系列芯片构建的安全智能底座，联合东风汽车、均联智行宣布，基于武当C1296芯片的首 个国产单芯片中央计算平台量产启动，该舱驾一体化方案正式进入量产阶段。 从本次上海车展芯片企业战略来看，芯片企业推出的产品算力和集成度更高了。比如地平线推出征程6P芯片，算力达560TOPS，采用端到端技术 架构，可同时处理20路摄像头数据，满足城区复杂场景下的实时决策需求；黑芝麻智能华山A2000芯片家族基于7nm车规工艺打造，实现单芯片多 任务并行处理能力；芯擎科技"龍鹰"系列智能座舱和"星辰"系列高阶辅助驾驶全矩阵芯片集中亮相。 随着本土芯片企业的集体崛起，长期以来由英伟达Orin-X和特斯拉FSD主导的全球智驾辅助芯片市场出现松动。方正证券研究所发布的一份研报显 示，2024年全球智驾域控芯片装机量528万颗，其中英伟达Drive Orin- ...

Core Insights - The chip industry is witnessing two major trends: increased computing power and integration, as demonstrated by new products from Aisin YuanZhi and HezhiMa Intelligent [1] Group 1: Aisin YuanZhi's M57 Series - Aisin YuanZhi launched the M57 series of automotive chips, which boasts a computing power of 10 TOPS and supports mixed precision and BEV algorithms [1] - The M57 chip has a power consumption of no more than 3.5W even at a junction temperature of 125 degrees Celsius, making it suitable for both traditional and energy-efficient electric vehicles [1] - The self-developed image processing technology, Aisin ZhiMou AI-ISP, generates high-definition images under extreme lighting conditions, enhancing decision-making for in-vehicle systems [1] - The integrated MCU with a safety island achieves ASIL-B and ASIL-D level functional safety, ensuring that the advanced driver-assistance systems (ADAS) do not cause accidents due to individual function failures [1] Group 2: HezhiMa's Huashan A2000 Family - HezhiMa's Huashan A2000 family of chips, built on a 7nm automotive-grade process, claims to have computing power up to four times that of current mainstream flagship chips [2] - The Huashan A2000 family includes three products: A2000 Lite for urban assisted driving, A2000 for general assisted driving, and A2000 Pro for high-level general assisted driving [2] - The Huashan A2000 chips feature a self-developed "JiuSha" NPU architecture that supports Transformer hardware acceleration and mixed precision operations (FP8/FP16), enhancing multi-task parallel processing efficiency [3] - The architecture includes a priority preemption mechanism to ensure sufficient computing resources for high-priority tasks, improving safety in complex driving scenarios [3] Group 3: Wudang Series and Safety Technologies - HezhiMa also introduced the Wudang series of chips, which is the industry's first cross-domain integrated computing chip, enhancing vehicle safety by ensuring independent operation of key systems [3] - The Wudang C1296 chip, also showcased, integrates smart cockpit, ADAS, and vehicle body control domains, allowing real-time data communication among them [4] - This solution is already being implemented in multiple new models from Dongfeng and is expected to achieve mass production by 2025 [4]