Chiplet先进封装技术
Search documents
超千项新技术新展品首展首发 第二十五届工博会展现全球工业科技前沿成果
Zheng Quan Shi Bao Wang· 2025-09-29 03:20
Core Insights - The 25th China International Industry Fair showcased over 3,000 exhibitors from 28 countries, highlighting trends in high-end, intelligent, and green industrial development [1] - The fair featured significant achievements in China's industrial sector, including the C919 aircraft and high-speed maglev trains, supported by 1,500 foundational projects [2] - The event served as a platform for companies to enhance collaboration and innovation within the industrial ecosystem, with substantial interest from international buyers [3] Historical Context - China's industrial landscape has been reshaped by a complete industrial chain and continuous innovation, establishing a strong presence in the global market [2] - The exhibition included historical industrial artifacts, showcasing the evolution of China's manufacturing capabilities [2] Current Trends - The fair emphasized the transformation of industrial robots into intelligent collaborators capable of environmental perception and autonomous decision-making [3] - The event facilitated the release of the "Shanghai Industrial Mother Machine Industry Capability Handbook," promoting over 80 cooperative projects with a total contract value exceeding 3 billion yuan [3] Future Outlook - The exhibition highlighted emerging technologies such as controllable nuclear fusion and AI-driven manufacturing systems, indicating a shift towards zero-carbon futures [4] - Innovations like advanced packaging technology and heavy-load robots were showcased, reflecting China's role as a key player in global industrial innovation [5] - The fair underscored China's transition from a technology follower to a significant contributor and leader in global industrial development [5]
到场专业观众达22.4万人,第二十五届工博会闭幕
Guo Ji Jin Rong Bao· 2025-09-28 03:44
Core Insights - The 25th China International Industry Fair (CIIF) concluded with a focus on "New Quality in Industry, Boundless Intelligent Manufacturing" showcasing advancements in high-end, intelligent, and green industrial development [1][4] - The event attracted over 3,000 exhibitors from 28 countries and regions, with a record attendance of 224,000 professional visitors, marking an 11% increase from the previous year [4] - The fair highlighted significant technological innovations, including nearly 400 representative achievements in various fields, and featured 1 special award and 10 main awards [4] Industry Trends - The CIIF served as a platform to display the latest industrial trends, emphasizing "embodied intelligence" as a key direction for future development [9] - New energy technologies such as controllable nuclear fusion and modular nuclear reactors were showcased, indicating a shift towards zero-carbon futures [9] - Digital twins, AI algorithms, and cloud platforms are being integrated into factories for comprehensive lifecycle management [9] Company Highlights - Shanghai Electric displayed historical industrial artifacts alongside modern innovations, reflecting China's journey from self-reliance to technological advancement [6] - Siemens introduced nearly 20 AI-related products, including a new generation of intelligent assembly equipment for electric vehicles, marking its first pilot application in China [6] - The fair facilitated significant business interactions, with over 80 cooperation projects and a signing amount exceeding 3 billion yuan [7] Innovations and Breakthroughs - Chiplet advanced packaging technology was presented by Chip and Semiconductor, showcasing breakthroughs in computational power [10] - The world's first heavy-duty robot with a load capacity of over 5,000 kg was unveiled by Chai Fu Robotics, setting a new standard in industrial robotics [10] - The introduction of the "CIIF Talk" segment attracted nearly 4 million online viewers, focusing on the future of industry and technological advancements [10]
复旦南通高新区制局基于FOPLP Chiplet产业生态发展合作交流会成功召开
势银芯链· 2025-04-25 06:56
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 添加文末微信,加 先进封装 群 Chiplet先进封装技术是半导体制程微缩脚步放缓后必然发展路径,其拥有独立IP物理化带来的 降本增效优势,以及可模块化异质异构集成特点,正在成为提升芯片性能的又一关键技术解决 方案。 在通州区委副书记、南通高新技术产业开发区党工委常务副书记吴冰冰开幕致辞下,本次交流 会正式开启。 会议上,南通高新技术产业开发区相关领导详细解读了南通在集成电路领域的产业优势、人才 及资源情况、交通运输发展规划。复旦大学智能材料与未来能源创新学院相关领导深入浅出的 势银研究: 势银产业研究服务 势银数据: 势银数据产品服务 势银咨询: 势银咨询顾问服务 重要会议: 4月29日,2025势银异质异构集成封装产业大会(浙江宁波) 点此报名 分享了复旦大学在微电子材料与器件分析技术方向的产学研布局。制局半导体(南通)有限公 司董事长付伟为各与会专家详细介绍了本次在南通高新区落地的先进封装模组制造项目,制局 半导体总投资10.5亿元,聚焦小芯片和异构集成技术,凭借具有高产出、低成本的FOPLP先进 封装解决方案,致力于为 ...