摩尔定律是由英特尔的共同创办人高登·摩尔在1965年提出，并非自然科学定律，而是趋势预测。 摩尔定律是指在相同面积的积体电路（芯片）上，可容纳的电晶体数量大约每18个月到24个月会增加一 倍，提升效能，降低成本。 半导体先进制程推进，业界不时传出摩尔定律将死或终结，不过，ASML台湾暨东南亚区客户行销主管 徐宽成昨（19）日指出，摩尔定律走不下去是不对的，预期未来15年制程蓝图会继续推进。此外，记忆 体应用方面不论NAND或DRAM都需要键合，改善异质整合。 他提到，新的芯片架构上，先进封装技术利用"矽中介层"堆叠下，新的机台曝光效率升级对ASML是重 要里程碑，ASML在后段封装较少为外界关注，但实际上已推出XT:260设备，并于今年第3季首度出货 应对客户需求，在过往芯片微缩以外，放大面积造成的生产效率提升也是另一个议题。 ASML旗下EUV协助芯片制造商进行线宽微缩包含Low NA EUV（NXE:3800E）：提升先进制程客户的 生产效率和设备可用以及High NA EUV：具备更高成像品质与简化流程（单次曝光）的优势。 ...

Core Insights - ASML Holding NV reported quarterly results and bookings that exceeded expectations, with a warning of a significant decline in sales in China projected for 2026 [1][3] Financial Performance - Quarterly bookings reached €5.4 billion, slightly above analyst expectations of €5.36 billion [1] - Net sales for the third quarter were €7.5 billion, with a gross margin of 51.6%, both aligning with prior guidance [1] Management Commentary - CFO Roger Dassen described the quarter as "solid," highlighting improvements in lithography intensity and the acceleration of extreme ultraviolet (EUV) technology adoption [2] - Progress on High NA EUV development is reported to be on track [2] Future Outlook - ASML reaffirmed its full-year 2025 outlook, forecasting approximately 15% sales growth over 2024 and a gross margin around 52% [3] - Projected fourth-quarter sales are expected to be between €9.2 billion and €9.8 billion, with gross margins ranging from 51% to 53% [3] - Despite strong results, the company cautioned about a substantial decline in sales in China in 2026 compared to elevated levels in 2024 and 2025 [3]

Core Viewpoint - ASML Holding's shares have declined due to lower-than-expected net bookings and concerns over tariffs impacting the semiconductor industry [1][9] Group 1: Company Performance - ASML reported Q1 bookings of 3.9 billion euros ($4.5 billion), falling short of analyst expectations of 4.9 billion euros ($5.6 billion) [4] - Revenue for the quarter increased by 45% to 7.7 billion euros ($8.8 billion), within the company's guidance range [5] - Equipment sales rose nearly 45% year-over-year to 5.7 billion euros ($6.5 billion), while service revenue climbed 54% to 2 billion euros ($2.3 billion) [5] Group 2: Technology and Market Position - ASML holds a virtual monopoly on extreme ultraviolet (EUV) lithography, essential for advanced chip manufacturing [2][10] - The introduction of High NA EUV technology is expected to further shrink chip sizes, although some customers are hesitant due to its high price [3][10] Group 3: Future Outlook - The company anticipates growth in 2025 and 2026, driven by demand for artificial intelligence (AI) and expansion plans from major customers like Taiwan Semiconductor and Intel [6] - ASML maintained its full-year revenue guidance of 30 billion to 35 billion euros ($34.1 billion to $39.8 billion) with a gross margin of 51% to 53% [8] Group 4: Risks and Challenges - Tariffs have introduced uncertainty, affecting system sales, import costs, and the complexity of indirect impacts on the business [7][9] - Concerns persist regarding the company's exposure to China, which accounted for 27% of shipments in Q1, and potential future sales prohibitions [9] Group 5: Investment Perspective - ASML shares are currently trading at a forward price-to-earnings multiple of 24 based on 2025 estimates, presenting a potentially attractive valuation given its competitive position [11] - Investors are encouraged to consider building positions in ASML stock, despite short-term market volatility [12]

Core Viewpoint - The rapid development of artificial intelligence (AI) is pushing the limits of traditional computing technologies, necessitating sustainable and energy-efficient solutions for exponential scaling of parallel computing systems [1][2][30]. Group 1: Technological Advancements - The article emphasizes the importance of optimizing the entire system from software and system architecture to silicon and packaging to maximize performance, power consumption, and cost [2]. - Key technologies such as RibbonFET and PowerVia are highlighted for their potential to enhance performance and efficiency in semiconductor design [4][5]. - High NA EUV technology is noted for its ability to simplify electronic design automation (EDA) and improve yield and reliability [7][8]. Group 2: 3D Integration and Packaging - 3D Integrated Circuits (3DIC) are crucial for achieving higher computational power in smaller areas while reducing energy consumption [11]. - The need for advanced packaging techniques to enhance interconnect density and energy efficiency is discussed, with a focus on modular design environments [12][15]. - The integration of glass in packaging to scale interconnect geometries and improve power transmission efficiency is identified as a significant technological advancement [14]. Group 3: Power Delivery and Efficiency - The article discusses the increasing power demands for AI workloads and the limitations of traditional motherboard voltage regulators (MBVR) [21][22]. - Fully Integrated Voltage Regulators (FIVR) are proposed as a solution to improve power conversion efficiency by bringing voltage regulation closer to the chip [23][24]. - The potential of pairing high-voltage switch-capacitor voltage regulators with low-voltage integrated voltage regulators for enhanced power density and efficiency is explored [24]. Group 4: Software and Ecosystem Collaboration - Software is deemed a critical component of the innovation matrix, requiring collaboration within the open-source ecosystem to enhance security and streamline processes [25]. - The need for industry-wide collaboration to develop next-generation advanced computing systems is emphasized, ensuring alignment with market demands and sustainability [28]. Group 5: Industry Challenges and Opportunities - The article outlines the challenges faced in achieving exponential performance improvements for AI, including power, connectivity, and cost issues [30]. - It calls for innovative approaches across various domains, including process technology, 3DIC system design, and power delivery, to meet the industry's computational demands [30].