January 27, 2026 10:15 PM GMT Asia-Pacific Technology | Asia Pacific AI Supply Chain: TPU/ASIC updates; ICMS NAND demand calculation We sense that AI semi vendors have started securing critical 2027 components – T-Glass/ABF, HBM, and TSMC 3nm – (e.g., MediaTek's 3nm TPU). Downgrade Egis to EW, as its 2026 appears to be shaping up as a year of transition. ASIC – Volume upside for MediaTek's 3nm TPU project in 2027: In our Target Price Up report, we highlighted the supply chain's bull case of 6-7mn TPU units ...