Core Insights - Broadcom is experiencing significant growth in AI revenues, reporting a 46% year-over-year increase to $4.4 billion in Q2 of fiscal 2025, with AI networking revenues surging over 170% [1][10] - The company anticipates AI semiconductor revenues to reach $5.1 billion in Q3 of fiscal 2025, indicating a potential 60% year-over-year growth [2][10] - Broadcom's Ethernet-based networking portfolio, including Tomahawk switches and Jericho routers, is widely adopted by major hyperscalers like Google, Meta, and Microsoft, highlighting the importance of networking in AI workloads [3] AI Technology and Innovations - The launch of the next-generation Tomahawk 6 Ethernet switch, capable of 102.4 Tbps, aims to address networking bottlenecks in high-performance AI systems [4][10] - Innovations such as Cognitive Routing 2.0 and co-packaged optics are designed to enhance AI-scale fabrics, further solidifying Broadcom's position in the AI market [4] Competitive Landscape - NVIDIA remains a dominant player in the AI semiconductor market, offering high-performance GPUs and cloud solutions that drive scalable AI deployment [6] - Intel is advancing its AI strategy with new CPU and GPU architectures aimed at edge and data center workloads, indicating increased competition in the AI semiconductor space [7] Financial Performance and Valuation - Broadcom's stock has returned 18.8% year-to-date, outperforming the Zacks Electronics - Semiconductors industry, which grew by 15% [8] - The company is currently trading at a forward price-to-sales ratio of 18.11X, significantly higher than the industry average of 8.72X, suggesting potential overvaluation [11] - The Zacks Consensus Estimate for Q3 fiscal 2025 earnings is $1.66 per share, reflecting a 33.87% year-over-year growth [14]

Group 1: Nvidia - Nvidia has been a key player in the AI boom, particularly in the infrastructure build-out phase, driven by its powerful AI chips known as GPUs, leading to significant revenue growth [3][4] - The company has established a comprehensive portfolio of products and services, allowing customers to rely on Nvidia for all AI deployment needs, and is also investing in future growth areas like quantum computing [4][5] - Nvidia's stock is trading at 36 times forward earnings estimates, indicating reasonable valuation and potential for further gains [5] Group 2: Oracle - Oracle has evolved from a database management company to a leader in cloud infrastructure, offering flexibility through its multicloud service, which is well-received by customers [6][9] - The company reported double-digit revenue growth across its businesses, with cloud infrastructure revenue increasing by 52% to $3 billion and cloud application revenue rising by 12% to $3.7 billion [8] - Remaining performance obligations (RPO) surged by 41% to $138 billion, indicating strong future revenue potential, alongside soaring demand for Oracle's cloud capacity [8][9] Group 3: Broadcom - Broadcom specializes in networking products and has experienced significant growth due to rising demand for AI, with AI semiconductor solutions revenue jumping 77% to $4.1 billion [10][11] - Infrastructure software revenue also increased by 47% to $6.7 billion, with expectations of continued growth as cloud companies expand data centers [11] - The company has seen tremendous demand for its latest Ethernet switching product, Tomahawk 6, which is crucial for AI workloads, suggesting strong earnings momentum ahead [12][13]

Core Viewpoint - The article emphasizes the importance of interconnect architecture in AI infrastructure, highlighting that while GPUs are crucial, the ability to train and run large models relies heavily on effective interconnect systems [1]. Group 1: Interconnect Architecture - Interconnect architecture encompasses various levels, including chip-to-chip communication within packages and system-level networks that support thousands of accelerators [1]. - Nvidia's dominance in the industry is attributed to its expertise in developing and integrating these interconnect architectures [1]. - Broadcom has been quietly advancing various technologies related to interconnect architecture, including Ethernet architectures for large-scale expansion and internal chip interconnect technologies [1][3]. Group 2: Ethernet Switch Technology - Broadcom has introduced high-capacity switches, such as the 51.2Tbps Tomahawk 5 and the recently launched 102.4Tbps Tomahawk 6, which can significantly reduce the number of switches needed for large GPU clusters [3]. - The number of switches required decreases as the switch's port count increases, allowing for more efficient connections among GPUs [3]. - Nvidia has also announced its own 102.4Tbps Ethernet switch, indicating a competitive landscape in high-capacity switch technology [4]. Group 3: Scalable Ethernet Solutions - Broadcom's Tomahawk 6 switches are positioned as a shortcut for rack-level architectures, supporting between 8 to 72 GPUs, with future designs expected to support up to 576 GPUs by 2027 [6]. - Ethernet technology is being utilized for both scalable and large-scale networks, with Intel and AMD also planning to implement Ethernet for their systems [7]. Group 4: Co-Packaged Optics (CPO) Technology - Broadcom has invested in co-packaged optics (CPO) technology, which integrates components typically found in pluggable transceivers into the same package as the switch ASIC, significantly reducing power consumption [9][10]. - The efficiency of Broadcom's CPO technology is reported to be over 3.5 times that of traditional pluggable devices [10]. - The third generation of CPO technology is expected to support up to 512 200Gbps optical ports, with future developments aiming for 400Gbps channels by 2028 [11]. Group 5: Multi-Chip Architecture - As Moore's Law slows, the industry is shifting towards multi-chip architectures, allowing for higher yields and optimized costs by using smaller chips [14]. - Broadcom has developed a 3.5D eXtreme Dimension System in Package (3.5D XDSiP) technology to facilitate the design of multi-chip processors, which is open for licensing to other companies [15]. - The first products based on this design are expected to enter production by 2026, although the specific applications of Broadcom's technology in AI chips may remain undisclosed [15].

Investment Rating - The report does not provide a specific investment rating for the companies mentioned, but it highlights potential beneficiaries of Broadcom's Tomahawk 6 launch, indicating a positive outlook for certain players in the AI networking value chain [1][20]. Core Insights - Broadcom's Tomahawk 6 (TH6) switch chip, launched on June 3, 2025, utilizes 3nm technology and supports 200G SerDes, enhancing networking transmission bandwidth and reducing latency. This launch is expected to drive a new technology upgrade cycle in the global AI infrastructure and networking markets, benefiting companies with advanced technologies [1][36]. - The report identifies key players that may benefit from the TH6 upgrade cycle, including Zhongji InnoLight and Suzhou TFC in the optical transceiver market, Shennan Circuits and WUS PCB in PCB/CCL manufacturing, and Unisplendour in AI server/switch manufacturing [1]. - The report discusses the competitive landscape of AI networking, highlighting the shift from Ethernet to NVIDIA's InfiniBand in large-scale AI data centers, while also noting the emergence of Ultra Ethernet specifications aimed at improving communication efficiencies for scaling out AI clusters [2][20]. Summary by Sections AI Networking Overview - The AI networking market is divided into scale-out and scale-up networks, with Ethernet historically leading in traditional data centers but losing ground to InfiniBand in AI infrastructure deployments [2][11]. - The Ultra Ethernet Consortium has developed specifications to enhance Ethernet's capabilities, aiming to regain momentum in the AI networking space [2][13]. Scale-Up Networking Technologies - NVIDIA's NVLink and the newly developed UALink Consortium's Ultra Accelerator Link are key technologies for scale-up networking, enabling high-speed interconnections between GPUs and AI accelerators [3][24]. - Broadcom's Scale-Up Ethernet (SUE) aims to provide low latency and high bandwidth connectivity for XPU scale-up networks, competing with NVIDIA's NVLink [31][34]. Market Dynamics and Trends - The global AI application landscape shows strong growth, with OpenAI's ChatGPT leading in daily active users (DAU), reaching 110 million in early June 2025 [4][74]. - In China, Bytedance's Doubao has surpassed DeepSeek in DAU, indicating a competitive generative AI application market [5][77]. Competitive Landscape - Broadcom's TH6 switch chip offers a switching capacity of 102.4 Tbps, significantly higher than its predecessors, and is designed to support both scale-up and scale-out architectures [36][41]. - Competitors like Cisco and NVIDIA are also advancing their switch technologies, with Cisco's SiliconOne G200 and NVIDIA's Spectrum series providing strong alternatives in the market [41][42]. Future Outlook - The report anticipates a rapid growth in demand for 1.6T optical modules and data center interconnects driven by the adoption of Broadcom's TH6 [38]. - The overall switch market is projected to grow, with cloud service providers expected to account for a significant portion of data center switch sales by 2027 [52][53].

Core Insights - The article discusses the competitive landscape of AI networking, highlighting the advantages of InfiniBand over Ethernet in large data centers, particularly in the context of NVIDIA's dominance in the GPU market [1][6][13]. Broadcom Tomahawk 6 - Broadcom announced the shipment of the Tomahawk 6 (TH6) switch chip, which utilizes 3nm technology and supports up to 102.4Tbps switching capacity, doubling the capacity of current mainstream Ethernet switch chips [2][4]. - The TH6 chip is priced at under $20,000, nearly double that of its predecessor, but offers significant performance improvements that justify the cost [2][4]. AI Network Optimization - TH6 excels in both scale-out and scale-up architectures, allowing connections to up to 100,000 XPUs and supporting 512 XPU single-hop connections, significantly reducing latency and power consumption [3][9]. - The chip features Cognitive Routing 2.0 technology, optimized for modern AI workloads, enhancing global load balancing and dynamic congestion control [3][9]. Market Trends - The introduction of TH6 is expected to drive rapid growth in the demand for 1.6T optical modules and data center interconnects, marking a new technology upgrade cycle in the global AI infrastructure market [4][10]. - The global optical circuit switch hardware sales are projected to grow at a CAGR of 32% from 2023 to 2028, outpacing Ethernet and InfiniBand switches [10]. Ethernet vs InfiniBand - Approximately 78% of top supercomputers use Ethernet solutions based on RoCE, while 65% utilize InfiniBand, indicating a competitive dynamic between the two technologies [13][16]. - InfiniBand has gained traction in the early stages of generative AI infrastructure deployment due to NVIDIA's market position, although Ethernet is expected to regain momentum as cloud service providers invest in self-developed ASIC projects [16]

Core Insights - Marvell Technology (MRVL) is enhancing its position in AI infrastructure by expanding its custom chip capabilities, integrating new components to improve performance and scalability across large-scale systems [1][6] Financial Performance - In Q1 FY26, Marvell reported record Data Center revenues of $1.44 billion, representing a 76% increase year over year, driven by the rapid scaling of custom AI silicon [2][10] - Marvell's forward price-to-sales ratio is 7.36X, which is lower than the industry average of 8.15X [13] Strategic Developments - Marvell partnered with NVIDIA in May 2025 to offer NVLink Fusion technology, enhancing the flexibility of its custom cloud platform silicon for next-generation AI infrastructure [3] - The introduction of a new multi-die packaging solution based on proprietary interposer technology aims to improve die-to-die interconnect efficiency, reduce power consumption, and lower product costs [4] - Marvell launched the Ultra Accelerator Link (UALink) scale-up solution, providing an open-standards-based interconnect platform that enhances compute utilization and reduces latency [5] Competitive Landscape - Advanced Micro Devices (AMD) is advancing its AI solutions through the acquisition of ZT Systems, which will reduce deployment time for hyperscalers [7] - Broadcom (AVGO) reported a 170% year-over-year increase in AI networking revenues, now comprising 40% of its total AI semiconductor revenues, and introduced the Tomahawk 6 switch to enhance AI cluster performance [8] Market Outlook - The Zacks Consensus Estimate for Marvell's fiscal 2026 and fiscal 2027 earnings indicates year-over-year growth of 77.71% and 27.73%, respectively, with recent upward revisions in earnings estimates [16]

Core Insights - The Shanghai Stock Exchange Sci-Tech Innovation Board Chip Index experienced a slight decline of 0.13% as of June 16, 2025, with mixed performance among constituent stocks [1] - The Sci-Tech Chip ETF (588200) has shown a significant increase of 51.49% over the past year as of June 13, 2025 [1] Market Performance - The Sci-Tech Chip ETF recorded a turnover rate of 1.6% and a transaction volume of 407 million yuan during the trading session [4] - Over the past year, the average daily transaction volume of the Sci-Tech Chip ETF reached 2.276 billion yuan, ranking first among comparable funds [4] - The ETF's scale increased by 684 million yuan in the past month, also ranking first among comparable funds [4] - In the last two weeks, the ETF's shares grew by 333 million, marking a significant increase [4] - The ETF attracted a total of 510 million yuan in inflows over the last nine trading days [4] Leverage and Returns - The latest margin buying amount for the Sci-Tech Chip ETF reached 77.49 million yuan, with a margin balance of 1.394 billion yuan [4] - The net value of the Sci-Tech Chip ETF increased by 50.68% over the past year, ranking 70th out of 2854 index equity funds, placing it in the top 2.45% [4] - The highest single-month return since inception was 25.18%, with the longest consecutive monthly gains being four months and the maximum cumulative gain of 36.01% [4] Industry Developments - Broadcom has made significant progress in the Co-Packaged Optics (CPO) sector, launching a single-channel 200G CPO product series in May and delivering the Tomahawk 6 (TH6) switch chip in June [5] - The collaboration between Broadcom and NVIDIA in advancing CPO technology is expected to enhance the maturity of the industry chain ecosystem [5] - The top ten weighted stocks in the Sci-Tech Chip Index account for 57.93% of the index, with notable companies including SMIC, Haiguang Information, and Cambrian [5][7] Investment Opportunities - Investors without stock accounts can access domestic chip investment opportunities through the Sci-Tech Chip ETF linked fund (017470) [7]

细分赛道： 服务器：本周服务器指数下跌 2.10%，月涨幅达 2.11%。全球 AI 算力需求持续强劲。本周英伟达 CEO 黄仁勋在 GTC Paris 大会中发布演讲，以法国、德国、英国为代表的欧洲国家将加速 AI 算力建设，未来欧洲将部署超 3000EFLOPS 的 Blackwell 系统，GB200 和 GB300 出货预期修复，我们预计工业富联等服务器代工厂估值将稳健提升，建议关注。 光模块：本周光模块板块表现亮眼，指数上涨 1.64%，月涨幅达 13.47%。除了上周博通正式发布 Tomahawk 6 交换机 芯片、800G/1.6T 光模块需求预期上修的催化以外，本周的主要催化还来自 Oracle 资本开支上调、对 AI 需求指引积 极。我们认为 4 月中美关税站以来光模块板块超跌，伴随中美关税战的暂缓、近两周以来产业端的多重催化，预计国 内光模块板块将迎来估值修复。建议关注中际旭创、新易盛及天孚通信等核心标的。 IDC：英伟达欧洲"AI 工厂"计划与甲骨文资本开支扩张驱动海外需求，国内 AIDC 算力中心及租赁招标持续推进，我们 看好超大型 AI 集群的部署将带动 IDC 加速建设。 通信周观 ...

Broadcom (AVGO 1.17%) has a long track record of success in the semiconductor and electronics industries. It's quickly becoming a leading supplier of artificial intelligence (AI) hardware for the data center, which includes custom chips and networking equipment.Broadcom's soaring AI revenue is a key reason its stock has tripled in the last two years, catapulting the company to a $1 trillion market capitalization. It's one of only nine American companies in the ultra-exclusive trillion-dollar club, and its e ...

每经编辑｜肖芮冬 6月12日，通信ETF（515880）开盘走高后在下午略有调整，全天收涨2.07%。 资料来源：Wind 6月3日，博通公司Broadcom宣布其Tomahawk 6交换芯片已开始出货。该产品为全球首款单芯片具备 102.4太比特/秒交换容量。随后，博通公布了FY2025Q2的财报，营收为150.04亿美元，同比+20%/环比 +1%；毛利率为79.4%，同比+3.2pcts/环比+0.3pct。博通指引三季度营收约为158亿美元，同比增长 21%，分析师预期157.2亿美元。 尽管博通的指引让市场觉得不够惊艳，但是关于其交换机的发酵却并没停止。算力网络的升级必然推动 通信网络高端化，英伟达GB200 NVL72机架放量之后，组网必备的800G或1.6T交换机需求也会迅速提 升。从通信网络来看，A股的CPO和PCB是两块业绩兑现能力最强的板块，一是技术存在较强的壁垒， 无论是设计研发能力还是工程制造经验，都在中短期内挡住了竞争对手。二是A股优质的企业已经跻身 于全球AI的核心产业链中，相关企业的业绩兑现能力在2024年来的业绩报告中已被多次证明。 Oracle周三盘后发布了2025财年第四季 ...