Market Overview - The main board saw significant gains with companies like Bona Film Group (+10.02%), Tiantong Co., Ltd. (+10.02%), and Zhongci Electronics (+10.01%) leading the charge [1] - The ChiNext board also performed well, with Hengxin Oriental (+20.04%) and Online Offline (+20.00%) showing strong increases [1] - The Sci-Tech Innovation board was led by Dekeli (+20.00%) and Tengjing Technology (+10.54%) [1] - Active sub-industries included SW Printed Circuit Boards (+5.43%) and SW Communication Network Equipment (+3.68%) [1] Domestic News - Aibang ARAI announced that its 12-inch Micro OLED production line has successfully lit up, marking a new phase in silicon-based OLED product mass production [1] - Semiconductor Investment Alliance reported that Shengmei Shanghai has launched several devices compatible with HBM processes, including Ultra ECP 3D equipment for TSV copper filling [1] - United Microelectronics Corporation (UMC) signed a technology licensing agreement with imec for silicon photonics processes, aiming to target next-generation high-speed connectivity applications [1] - Baiwei Storage highlighted the increasing demand for high-bandwidth, low-latency storage chips in robotics, launching products suitable for embodied intelligence [1] Company Announcements - Shenzhou Information disclosed a plan for its controlling shareholder to reduce holdings by up to 28,827,300 shares between December 31, 2025, and March 30, 2026 [2] - Saiwei Microelectronics announced a share reduction plan by Shanghai Lingguan, intending to reduce up to 14,500 shares for personal funding needs [2] - Juguang Technology reported the completion of a share reduction by shareholder Wang Donghui, decreasing his stake from 6.6427% to 3.6427% with a total reduction amounting to 323 million yuan [2] - Zhangyue Technology received a cash dividend of 4.99 million yuan from its associate company, which will positively impact its 2025 financial performance [2] Overseas News - DNP successfully developed a nano-imprint lithography (NIL) template with a line width of 10nm, meeting the miniaturization needs for advanced logic semiconductors [2] - Omdia reported a 3% year-on-year increase in global wearable wristband shipments in Q3 2025, reaching 54.6 million units, with market value rising by 12% [2] - IBM announced an acquisition of Confluent for $11 billion, aiming to integrate it into its software division to enhance AI-driven data platforms [2] - The U.S. government allowed NVIDIA to export its H200 AI chips to China under certain conditions, including a 25% revenue share for the U.S. [2]

盛美上海在互动平台表示，目前，盛美上海已推出多款适配HBM工艺的设备。其中，公司的Ultra ECP 3d设备可用于TSV铜填充；全线湿法清洗设备及电镀铜设备等均可用于HBM工艺，全线封测设备（包 括湿法设备、涂胶、显影设备及电镀铜设备）亦可应用于大算力芯片2.5D封装工艺。 ...