Core Viewpoint - Tianyu Semiconductor (02658) has entered into a strategic cooperation agreement with Qinghe Crystal Semiconductor Technology (Group) Co., Ltd. to leverage their respective strengths in silicon carbide (SiC) materials and bonding equipment optimization for the development of advanced bonding materials [1] Group 1: Strategic Cooperation - The agreement aims to establish a mutually beneficial partnership by combining Tianyu's industry strength in SiC epitaxial wafers with Qinghe's expertise in bonding integration technology and equipment [1] - The collaboration will focus on the development and technological iteration of bonding materials, including bonding SiC, silicon-on-insulator (SOI), piezoelectric substrates on insulators (POI), and large-size (12 inches and above) SiC composite heat dissipation substrates [1] Group 2: Expected Outcomes - The partnership is expected to enhance the group's technical capabilities in large-size composite substrates, ensure equipment stability, and further solidify the group's market position [1]

Core Viewpoint - The strategic cooperation agreement between Tianyu Semiconductor and Qinghe Crystal Semiconductor Technology aims to leverage their respective strengths in silicon carbide (SiC) materials and bonding equipment to develop advanced bonding materials and optimize production processes [1][2][3] Group 1: Cooperation Details - The cooperation will focus on process development for bonding materials including SiC, SOI, POI, and large-size (12-inch and above) SiC composite heat dissipation substrates [1] - Qinghe Crystal will provide equipment customization, optimization, and process support for various bonding substrates, including single-crystal and multi-crystal SiC [2] - The agreement includes provisions for equipment improvement and technical support, with both parties committed to enhancing manufacturing capabilities and addressing technical issues collaboratively [2] Group 2: Intellectual Property and Collaboration - Each party retains independent ownership of any intellectual property developed during the collaboration [3] - During the cooperation period, the company will prioritize collaboration with Qinghe Crystal for complete line projects and equipment procurement, unless Qinghe Crystal's equipment fails to meet specified technical or production requirements [3] - The board believes that this partnership will create a mutually beneficial relationship, enhancing the company's capabilities in large-size composite substrates and solidifying its market position [3]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責， 對其準確性或完整性亦不發表任何聲明，並明確表示概不就因本公告全部或任何部 分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 Guangdong Tianyu Semiconductor Co., Ltd. 廣東天域半導體股份有限公司 (於中華人民共和國註冊成立的股份有限公司) （股份代號：2658） 有關訂立 戰略合作協議的 自願公告 本公告乃由廣東天域半導體股份有限公司（「本公司」，連同其附屬公司，統稱「本集 團」）自願作出，旨在向本公司股東（「股東」）及本公司潛在投資者提供本集團最新業 務發展情況。 本公司董事（「董事」）會（「董事會」）欣然公佈，於2026年1月16日（交易時段後），本 公司及青禾晶元半導體科技（集團）有限責任公司（「青禾晶元」）訂立戰略合作協議 （「協議」），據此，協議訂約方（各自為「訂約一方」，統稱「訂約方」）同意建立戰略合 作，憑藉本公司在碳化硅材料領域的優勢及青禾晶元在鍵合設備定製與優化方面的 能力，共同開展鍵合材料（包括鍵合碳化硅(SiC)、絕緣體上硅(SOI)、絕緣體上壓電 基板(POI)及超 ...

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2025年12月31日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 廣東天域半導體股份有限公司 呈交日期: 2026年1月2日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | H | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 02658 | 說明 | H股 | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 58,990,426 | RMB | | 1 | RMB | | 58,990,426 | | 增加 / 減少 (-) | | | | | | | RMB | | | | 本月底結存 | | | 58,990,426 | RMB | | | 1 RMB | | 58,990,426 | | 2. 股份分類 | 普通股 | ...

Core Viewpoint - Tianyu Semiconductor (02658) announced that the stabilization price period for its global offering ended on January 1, 2026, which is 30 days after the deadline for submitting applications for the Hong Kong public offering [1] Group 1 - There was no over-allotment of H-shares in the international offering [1] - The stabilization agent or any person acting on its behalf did not take any stabilization actions during the stabilization price period [1] - The underwriters and overall coordinators did not exercise the over-allotment option, which has now expired as of January 1, 2026 [1]

Core Viewpoint - Tianyu Semiconductor (02658) announced that the stabilization price period for its global offering ended on January 1, 2026, which is 30 days after the deadline for submitting applications for the Hong Kong public offering [1] Group 1 - There was no over-allotment of H-shares in the international offering [1] - Stabilization agents or any persons acting on their behalf did not take any stabilization actions during the stabilization price period [1] - The sponsor and overall coordinator, on behalf of the international underwriters, did not exercise the over-allotment option, which has now expired as of January 1, 2026 [1]

香港交易及結算所有限公司、香港聯合交易所有限公司（「聯交所」）及香港中央結算 有限公司（「香港結算」）對本公告的內容概不負責，對其準確性或完整性亦不發表任 何聲明，並明確表示概不就因本公告全部或任何部分內容而產生或因依賴該等內容 而引致的任何損失承擔任何責任。 除本公告另有界定者外，本公告所用詞彙與廣東天域半導體股份有限公司（「本公 司」）所刊發日期為2025年11月27日的招股章程（「招股章程」）所界定者具有相同涵 義。 本公告乃根據香港法例第571W章證券及期貨（穩定價格）規則第9(2)條作出。本公 告僅供參考，並不構成收購、購買或認購本公司證券的邀請或要約。決定是否投資 發售股份前，有意投資者應細閱招股章程，以了解下述有關本公司及全球發售的詳 細資料。任何有關發售股份的投資決定應僅依賴招股章程中所提供的資料而作出。 本公告不會直接或間接於或向美國（包括其領土及屬地、任何美國州份以及哥倫比 亞特區）發佈、刊發或派發。本公告並非且不構成在美國或於任何其他司法管轄區 購買或認購證券的任何要約或招攬的一部分。發售股份未曾亦不會根據《1933年美 國證券法》（經不時修訂）（「美國證券法」）或美國任何州或其他司法管 ...

Group 1 - Hong Kong chip stocks experienced an initial rise, with Semiconductor Manufacturing International Corporation (SMIC) increasing by over 5% [1] - Hua Hong Semiconductor saw an increase of over 3% [1] - Other stocks such as Tianyu Semiconductor, Shanghai Fudan, and InnoCare also followed the upward trend [1]

Group 1 - The semiconductor stocks in the Hong Kong market experienced a widespread decline, with notable drops in several companies [1] - Tianyu Semiconductor fell by over 5%, while China Electric Huada Technology and ZTE Corporation both dropped by over 3% [1] - Other companies such as Huahong Semiconductor, Jingmen Semiconductor, ASMPT, and Hongguang Semiconductor also saw declines exceeding 2% [1] Group 2 - Tianyu Semiconductor's stock decreased by 5.18%, with a latest price of 43.920 and a total market value of 17.272 billion, reflecting a year-to-date decline of 24.28% [2] - China Electric Huada Technology's stock fell by 3.79%, with a latest price of 1.270 and a total market value of 2.578 billion, showing a year-to-date increase of 9.48% [2] - ZTE Corporation's stock decreased by 3.45%, with a latest price of 26.860 and a total market value of 128.486 billion, reflecting a year-to-date increase of 13.42% [2] - Huahong Semiconductor's stock fell by 2.60%, with a latest price of 65.550 and a total market value of 113.795 billion, showing a year-to-date increase of 202.77% [2] - Jingmen Semiconductor's stock decreased by 2.27%, with a latest price of 0.430 and a total market value of 1.074 billion, reflecting a year-to-date decline of 13.13% [2] - ASMPT's stock fell by 2.06%, with a latest price of 73.650 and a total market value of 30.77 billion, showing a year-to-date decline of 0.90% [2] - Hongguang Semiconductor's stock decreased by 2.02%, with a latest price of 0.485 and a total market value of 0.455 billion, reflecting a year-to-date decline of 27.61% [2]

Group 1 - The Hong Kong chip stocks experienced a general decline, with notable drops in companies such as Hua Hong Semiconductor, Tianyu Semiconductor, and InnoGrit, all falling over 3% [1] - ASMPT saw a decrease of over 2%, while Hongguang Semiconductor and SMIC dropped more than 1% [1] Group 2 - Hua Hong Semiconductor (01347) decreased by 3.73%, with a latest price of 69.700 and a total market value of 120.999 billion, showing a year-to-date increase of 221.94% [2] - Tianyu Semiconductor (02658) fell by 3.19%, with a latest price of 44.300 and a market value of 17.422 billion, reflecting a year-to-date decline of 23.62% [2] - InnoGrit (02577) dropped by 3.23%, with a latest price of 76.350 and a market value of 69.868 billion, showing a year-to-date increase of 144.32% [2] - ASMPT (00522) decreased by 2.22%, with a latest price of 77.100 and a market value of 32.209 billion, reflecting a year-to-date increase of 3.74% [2] - Hongguang Semiconductor (06908) fell by 1.96%, with a latest price of 0.500 and a market value of 0.0469 billion, showing a year-to-date decline of 25.37% [2] - SMIC (00981) decreased by 1.64%, with a latest price of 66.050 and a market value of 528.42 billion, reflecting a year-to-date increase of 107.70% [2] - Shanghai Fuzhi (01385) dropped by 1.29%, with a latest price of 39.920 and a market value of 32.791 billion, showing a year-to-date increase of 165.56% [2] - ZTE Corporation (00763) decreased by 1.16%, with a latest price of 27.180 and a market value of 130.016 billion, reflecting a year-to-date increase of 14.77% [2] - Beike Micro (02149) fell by 0.14%, with a latest price of 43.720 and a market value of 2.754 billion, showing a year-to-date increase of 60.74% [2]