Group 1 - Company A (奥美森) announced a cash dividend of 5.00 RMB per 10 shares (including tax), with the record date on December 1, 2025, and the ex-dividend date on December 2, 2025 [1] - Company B (思特威-W) declared a cash dividend of 0.125 RMB per share (including tax), with the record date on December 2, 2025, and the ex-dividend date on December 3, 2025 [1] - Company C (江阴银行) will distribute a cash dividend of 1.0 RMB per 10 shares (including tax), with the record date on December 2, 2025, and the ex-dividend date on December 3, 2025 [1] Group 2 - Company D (山东威达) announced a cash dividend of 0.50 RMB per 10 shares (including tax), with the record date on December 3, 2025, and the ex-dividend date on December 4, 2025 [2] - The Low Volatility Dividend Index (红利低波) consists of 50 securities with good liquidity, continuous dividends, moderate payout ratios, positive growth in dividends per share, and low volatility, with a dividend yield of 4.12% as of November 26 [3] - The Dividend Quality Index (红利质量) includes 50 securities with continuous cash dividends and high payout ratios, showing a dividend yield of 3.44% as of November 26 [3]

Core Insights - The global automotive CMOS image sensor (CIS) market is projected to grow from $1.377 billion in 2020 to $2.499 billion in 2024, with a compound annual growth rate (CAGR) of 16.1% [7] - The Chinese automotive CIS market is expected to reach approximately 7.83 billion yuan in 2024, reflecting a year-on-year growth of 19.7% [7] - The automotive CIS industry is characterized by high technical barriers and market concentration, with the top three companies holding over 80% of the global market share in 2024 [7] Automotive CIS Industry Overview - CMOS image sensors (CIS) are semiconductor devices that convert optical images into digital signals, widely used in consumer electronics, security monitoring, and intelligent driving [2][4] - In automotive applications, CIS is a core component of camera modules, crucial for light perception and image quality [2][4] - The cost structure of automotive camera modules shows that CIS, packaging, and optical lenses account for nearly 75% of total costs, with CIS alone representing 40% [6][7] Market Dynamics - The demand for automotive cameras is increasing exponentially due to the trend of automotive intelligence, with CIS benefiting directly from this growth [7] - The number of cameras per vehicle is rising, alongside demands for higher resolution and enhanced low-light performance, which increases the average value of individual camera modules [7] Competitive Landscape - The automotive CIS market is dominated by a few key players, with OmniVision leading at a 32.9% market share, followed by ON Semiconductor and Sony [7] - Chinese companies like SmartSens and Geke Micro are also gaining market share, reflecting the increasing competitiveness of domestic firms [7] Future Trends - The automotive CIS industry is expected to continue benefiting from the trend of automotive intelligence, with leading companies likely to strengthen their positions through technological advancements and brand advantages [8] - Future developments in automotive CIS will focus on higher resolutions (over 8 million pixels), functional safety (ASIL-B/D), and multi-spectral integration (visible light + infrared) to meet diverse needs [8]

证券日报网讯思特威11月26日在互动平台回答投资者提问时表示，公司坚持"智慧安防+智能手机+汽车 电子"三足鼎立发展方向的同时，夯实多元业务战略，通过持续的技术创新和多元化产品布局实现全面 发展，公司对自身生产经营充满信心。 ...

Core Viewpoint - The company has achieved significant technological breakthroughs in high-end main cameras and ultra-telephoto products, recently launching a 200 million pixel CIS product for smartphones [1] Group 1 - The company has successfully developed a 200 million pixel CIS product [1]

（编辑 姚尧） 证券日报网讯 11月26日晚间，思特威发布公告称，2025年前三季度利润分配方案为每股现金红利0.125 元（含税），股权登记日为2025年12月2日，除权（息）日为2025年12月3日。 ...

Core Viewpoint - The company has successfully launched a 200 million pixel CIS product for smartphones, indicating its commitment to high-end imaging technology and addressing market demands for higher pixel sensors [1][4]. Group 1: Company Developments - The company has previously launched several 50 million pixel high-end smartphone CIS products and has developed the Lofic HDR® 2.0 technology to enhance dynamic range and low-light imaging capabilities [4]. - The recent launch of the 200 million pixel CIS product is a significant achievement in the company's independent research and development efforts [4]. - The company plans to gradually advance the rollout of its new products based on the integration pace of terminal brand customers [4][5]. Group 2: Industry Trends - High pixel CIS has become a crucial direction for upgrading smartphone imaging, with leading manufacturers adopting main camera solutions exceeding 100 million pixels in flagship and high-end models [4]. - Domestic CIS manufacturers are expected to gain more market opportunities through advancements in pixel specifications, HDR algorithms, and low-light performance, particularly in the context of domestic substitution and local supply chain collaboration [4]. Group 3: Future Outlook - The company will continue to increase R&D investment in high pixel sensors, HDR technology, and low-power architectures while expanding cooperation with domestic and international terminal brand customers [5]. - The company cautions that the timeline from R&D to mass production for high pixel new products is uncertain, and actual contributions to performance may vary [5].

Market Overview - The main board saw significant gains with notable stocks such as Huazhu Holdings (+10.11%), Huanrui Century (+10.05%), and Yanhua Intelligent (+10.04%) leading the charge [1] - The ChiNext board also performed well, with Sanwei Tiandi (+20.01%) and Saiwei Electronics (+16.27%) among the top gainers [1] - The Sci-Tech Innovation board experienced similar growth, highlighted by Mingwei Electronics (+20.01%) and Changguang Huaxin (+20.00%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+7.58%) and SW Printed Circuit Boards (+3.64%) [1] Domestic News - Chip-on-Micro's self-developed 350nm stepper lithography machine AST6200 has been shipped to clients after passing rigorous factory testing, tailored for advanced compound semiconductor manufacturing scenarios [1] - Tianfu Communication clarified that rumors regarding a $3 billion order from Google are untrue, emphasizing adherence to regulatory disclosure requirements for significant orders [1] - Hongtai Technology signed a memorandum of cooperation with ADI, integrating ADI's high-performance measurement chips into its new SoC testing platform [1] - ASE Group announced major real estate and expansion decisions, including a purchase of a new factory and collaboration on a technology park [1] Company Announcements - Demingli plans to raise up to 3.2 billion yuan through a private placement, with funds allocated for SSD expansion, DRAM expansion, and a new headquarters project [2] - SIRUI announced a suspension of trading due to plans for a major asset restructuring involving the acquisition of control over Ningbo Aola Semiconductor [2] - Sitaiwei declared a cash dividend of 1.25 yuan per 10 shares based on a total share count of 401,304,700 after accounting for repurchased shares [2] - Zongheng Communication reported the completion of a share reduction by major shareholders, decreasing their combined holding from 31.40% to 30.74% [2] Overseas News - Qualcomm launched its fifth-generation Snapdragon 8 mobile platform, featuring a custom Qualcomm Oryon CPU with a peak frequency of 3.8GHz, achieving a performance increase of 36% and a 76% improvement in web browsing response time [3] - JPR's Q3 2025 market report indicated a 145% quarter-on-quarter increase in global data center GPU shipments, while PC GPU shipments showed modest growth [3] - The ITC initiated a "337 investigation" into specific LCD devices and components, involving several Chinese companies and international firms [3] - GSMA's latest report warned that the mid-band spectrum required for 6G networks will be two to three times the currently available spectrum, urging governments to develop policies to avoid capacity bottlenecks in the 2030s [3]

Core Viewpoint - The company is actively pursuing opportunities in the high-end smartphone market by launching a series of 50 million pixel high-end mobile camera image sensor (CIS) products and innovating with Lofic HDR® 2.0 technology, enhancing imaging performance for smart imaging systems [1] Group 1 - The company has successfully launched a series of 50 million pixel high-end smartphone CIS products [1] - The introduction of Lofic HDR® 2.0 technology significantly improves imaging performance [1] - The company has achieved technological breakthroughs in high-end main cameras and ultra-telephoto products, recently launching a 200 million pixel CIS product [1]

思特威（688213.SH）11月26日在投资者互动平台表示，在智能手机领域，公司积极布局高端市场的发 展机遇，已成功推出一系列5000万像素高端手机CIS产品，并创新研发推出Lofic HDR® 2.0技术，为智 能影像系统带来出色的成像表现。同时，公司针对高端主摄、超长焦等产品持续实现技术突破，近期已 成功推出智能手机2亿像素CIS产品，这也是公司在自主研发道路上坚实前行的有力证明。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：豪威集团表示2亿像素（200Mp）手机图像传器已得到 客户认证导入，看报道，思特威只有5000万像素手机传感器，是不是比豪威落后一代产品了？公司有研 发2亿像素手机传感器吗？谢谢！ ...

格隆汇11月26日丨思特威(688213.SH)发布2025年前三季度权益分派实施公告,截至本公告披露日，公司 总股本为4.02亿股，扣除回购专用证券账户中股份数53.69万股，本次实际参与分配的股本数为4.01亿 股，以该股本为基数，向全体股东每10股派发现金红利1.25元（含税），以此计算合计拟派发现金红利 5016.31万元（含税）。本次利润分配不送红股，不进行资本公积转增股本。 （原标题：思特威(688213.SH)2025年前三季度权益分派：每股派利0.125元） 本次权益分派股权登记日为：2025年12月2日，除权除息日为：2025年12月3日。 ...