融资决策制度 第一条 为促进公司健康稳定发展，控制思特威（上海）电子科技股份有限 公司（以下简称"公司"）融资风险，使公司规范运作，根据《中华人民共和国 公司法》《思特威（上海）电子科技股份有限公司章程》（以下简称"公司章程"） 及相关法律法规的规定，特制定本制度。 第二条 本制度适用于公司下列融资行为的决策： 1、公司首次公开发行股票及发行新股（包括增发新股和配股）； 2、公司发行公司债券（含发行可转换公司债券）； 思特威（上海）电子科技股份有限公司 第七条 公司发生的融资事项应严格按照《中华人民共和国公司法》《上海 证券交易所科创板股票上市规则》等有关法律法规及公司章程、公司《信息披露 管理制度》等相关制度规定履行信息披露义务。 1 第八条 公司任何部门、任何机构以及个人违反本制度，越权审批进行融资 的，公司有权对其进行相应处分；给公司造成损失的，相关责任人应赔偿公司损 失。 第九条 本制度没有规定或与法律、法规、公司章程的规定不一致的，以法 律、法规、公司章程的规定为准。 第十条 本制度经股东会通过之日起生效，修改时亦同。 第十一条 本制度由董事会负责解释。 3、公司向银行或其他金融机构借款。 第三条 ...

Core Insights - The ISSCC 2026 conference, a leading event in the semiconductor and integrated circuit field, received a record 1,025 paper submissions, with a final acceptance rate of 25.1%, down 2.1 percentage points from ISSCC 2025, indicating increased competition [1][5] - The conference highlighted significant advancements in image sensors and displays, with only 30 papers accepted in these high-interest areas, suggesting a competitive submission landscape [2][5] Group 1: Conference Overview - ISSCC 2026 is recognized as the largest and most influential international conference in the semiconductor and integrated circuit sector, often referred to as the "Olympics of Chips" [1][4] - A total of 257 papers were accepted from 15 countries/regions and 108 institutions, with 169 papers from the Asia-Pacific region, including 107 from China [5] Group 2: Company Achievements - The company, Sitwei, successfully had a paper accepted in the image sensors and displays session, showcasing breakthroughs in ultra-high resolution, low noise imaging, and HDR technology [3][6] - The accepted paper details a 200MP CMOS image sensor designed for 8K video applications, featuring a pixel size of 0.61μm and a readout noise of less than 1e⁻, demonstrating the company's advanced R&D capabilities [3][7] - This recognition marks Sitwei's continued influence in the international arena since its first appearance at ISSCC in 2019, indicating its position among global leaders in core image sensor technology [4][7]

12月2日，思特威盘中下跌2.00%，截至13:30，报92.89元/股，成交1.88亿元，换手率0.62%，总市值 373.27亿元。 资金流向方面，主力资金净流出386.94万元，特大单买入840.75万元，占比4.48%，卖出1612.20万元， 占比8.59%；大单买入4102.16万元，占比21.86%，卖出3717.65万元，占比19.81%。 分红方面，思特威A股上市后累计派现1.76亿元。 机构持仓方面，截止2025年9月30日，思特威十大流通股东中，香港中央结算有限公司位居第五大流通 股东，持股1123.42万股，相比上期增加486.08万股。易方达上证科创板50ETF（588080）位居第六大流 通股东，持股1016.84万股，相比上期减少147.82万股。华夏上证科创板50成份ETF（588000）位居第七 大流通股东，持股995.30万股，相比上期减少564.12万股。嘉实上证科创板芯片ETF（588200）位居第 八大流通股东，持股639.05万股，相比上期减少29.19万股。南方中证500ETF（510500）位居第十大流 通股东，持股414.91万股，为新进股东。 责任编辑：小浪 ...

本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容的 真实性、准确性和完整性依法承担法律责任。 重要内容提示： 每股现金红利0.125元 一、通过分配方案的股东大会届次和日期 二、分配方案 1.发放年度：2025年前三季度 2.分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分公司（以下简 称"中国结算上海分公司"）登记在册的本公司全体股东。 3.差异化分红送转方案： （1）差异化分红方案 根据公司2025年第一次临时股东大会审议通过的《关于2025年前三季度利润分配预案的议案》，公司拟 以实施权益分派的股权登记日登记的公司总股本扣减公司回购专用证券账户中股份为基数，向全体股东 每10股派发现金红利1.25元（含税），不进行资本公积转增股本，亦不派送红股。 根据《中华人民共和国公司法》《中华人民共和国证券法》《上海证券交易所上市公司自律监管指引第 7号一一回购股份》等有关规定，上市公司回购专用账户中的股份，不享有利润分配、公积金转增股本 等权利。因此，公司回购专用证券账户中的股份将不参与公司本次权益分派。 截至本公告披露日，公司总股本 ...

Group 1 - Company A (奥美森) announced a cash dividend of 5.00 RMB per 10 shares (including tax), with the record date on December 1, 2025, and the ex-dividend date on December 2, 2025 [1] - Company B (思特威-W) declared a cash dividend of 0.125 RMB per share (including tax), with the record date on December 2, 2025, and the ex-dividend date on December 3, 2025 [1] - Company C (江阴银行) will distribute a cash dividend of 1.0 RMB per 10 shares (including tax), with the record date on December 2, 2025, and the ex-dividend date on December 3, 2025 [1] Group 2 - Company D (山东威达) announced a cash dividend of 0.50 RMB per 10 shares (including tax), with the record date on December 3, 2025, and the ex-dividend date on December 4, 2025 [2] - The Low Volatility Dividend Index (红利低波) consists of 50 securities with good liquidity, continuous dividends, moderate payout ratios, positive growth in dividends per share, and low volatility, with a dividend yield of 4.12% as of November 26 [3] - The Dividend Quality Index (红利质量) includes 50 securities with continuous cash dividends and high payout ratios, showing a dividend yield of 3.44% as of November 26 [3]

Core Insights - The global automotive CMOS image sensor (CIS) market is projected to grow from $1.377 billion in 2020 to $2.499 billion in 2024, with a compound annual growth rate (CAGR) of 16.1% [7] - The Chinese automotive CIS market is expected to reach approximately 7.83 billion yuan in 2024, reflecting a year-on-year growth of 19.7% [7] - The automotive CIS industry is characterized by high technical barriers and market concentration, with the top three companies holding over 80% of the global market share in 2024 [7] Automotive CIS Industry Overview - CMOS image sensors (CIS) are semiconductor devices that convert optical images into digital signals, widely used in consumer electronics, security monitoring, and intelligent driving [2][4] - In automotive applications, CIS is a core component of camera modules, crucial for light perception and image quality [2][4] - The cost structure of automotive camera modules shows that CIS, packaging, and optical lenses account for nearly 75% of total costs, with CIS alone representing 40% [6][7] Market Dynamics - The demand for automotive cameras is increasing exponentially due to the trend of automotive intelligence, with CIS benefiting directly from this growth [7] - The number of cameras per vehicle is rising, alongside demands for higher resolution and enhanced low-light performance, which increases the average value of individual camera modules [7] Competitive Landscape - The automotive CIS market is dominated by a few key players, with OmniVision leading at a 32.9% market share, followed by ON Semiconductor and Sony [7] - Chinese companies like SmartSens and Geke Micro are also gaining market share, reflecting the increasing competitiveness of domestic firms [7] Future Trends - The automotive CIS industry is expected to continue benefiting from the trend of automotive intelligence, with leading companies likely to strengthen their positions through technological advancements and brand advantages [8] - Future developments in automotive CIS will focus on higher resolutions (over 8 million pixels), functional safety (ASIL-B/D), and multi-spectral integration (visible light + infrared) to meet diverse needs [8]

证券日报网讯思特威11月26日在互动平台回答投资者提问时表示，公司坚持"智慧安防+智能手机+汽车 电子"三足鼎立发展方向的同时，夯实多元业务战略，通过持续的技术创新和多元化产品布局实现全面 发展，公司对自身生产经营充满信心。 ...

Core Viewpoint - The company has achieved significant technological breakthroughs in high-end main cameras and ultra-telephoto products, recently launching a 200 million pixel CIS product for smartphones [1] Group 1 - The company has successfully developed a 200 million pixel CIS product [1]

（编辑 姚尧） 证券日报网讯 11月26日晚间，思特威发布公告称，2025年前三季度利润分配方案为每股现金红利0.125 元（含税），股权登记日为2025年12月2日，除权（息）日为2025年12月3日。 ...

Core Viewpoint - The company has successfully launched a 200 million pixel CIS product for smartphones, indicating its commitment to high-end imaging technology and addressing market demands for higher pixel sensors [1][4]. Group 1: Company Developments - The company has previously launched several 50 million pixel high-end smartphone CIS products and has developed the Lofic HDR® 2.0 technology to enhance dynamic range and low-light imaging capabilities [4]. - The recent launch of the 200 million pixel CIS product is a significant achievement in the company's independent research and development efforts [4]. - The company plans to gradually advance the rollout of its new products based on the integration pace of terminal brand customers [4][5]. Group 2: Industry Trends - High pixel CIS has become a crucial direction for upgrading smartphone imaging, with leading manufacturers adopting main camera solutions exceeding 100 million pixels in flagship and high-end models [4]. - Domestic CIS manufacturers are expected to gain more market opportunities through advancements in pixel specifications, HDR algorithms, and low-light performance, particularly in the context of domestic substitution and local supply chain collaboration [4]. Group 3: Future Outlook - The company will continue to increase R&D investment in high pixel sensors, HDR technology, and low-power architectures while expanding cooperation with domestic and international terminal brand customers [5]. - The company cautions that the timeline from R&D to mass production for high pixel new products is uncertain, and actual contributions to performance may vary [5].