芯联集成电路制造股份有限公司 关于独立董事公开征集委托投票权的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要提示： 根据中国证券监督管理委员会颁布的《上市公司股权激励管理办法》（以下 简称"《管理办法》"）及《公开征集上市公司股东权利管理暂行规定》（以下 简称"《暂行规定》"）的有关规定，芯联集成电路制造股份有限公司（以下简 称"公司"或"本公司"）独立董事李生校先生受其他独立董事的委托作为征集 人，就公司拟于 2024 年 4 月 29 日召开的 2023 年年度股东大会审议的股权激励 计划相关议案向公司全体股东征集委托投票权。 证券代码：688469 证券简称：芯联集成 公告编号：2024-024 一、征集人的基本情况、对表决事项的表决意见及理由 （一）征集人的基本情况 1、本次征集委托投票权的征集人为公司现任独立董事李生校先生，其基本 情况如下： 李生校，男，1962 年 5 月出生，中国国籍，无境外永久居留权，硕士研究 生学历，教授。1987 年至 2013 年，历任绍兴文理学院经贸系党支部书记、经管 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-026 一、监事会会议召开情况 芯联集成电路制造股份有限公司（以下简称"公司"）第一届监事会第十三 次会议于 2024 年 4 月 13 日以通讯的方式召开。会议通知于 2024 年 4 月 8 日向 全体监事发出。会议应出席监事 5 人，实际出席监事 5 人，会议由监事会主席王 永先生主持。会议的召集和召开符合《中华人民共和国公司法》等法律法规和《公 司章程》的有关规定。 二、监事会会议审议表决情况 1、审议通过了《关于公司<2024 年限制性股票激励计划（草案）>及其摘 要的议案》 监事会认为：公司《2024 年限制性股票激励计划（草案）》及其摘要的内 容符合《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共 和国证券法》（以下简称"《证券法》"）、《上市公司股权激励管理办法》（以 下简称"《管理办法》"）、《上海证券交易所科创板股票上市规则》（以下简 称"《上市规则》"）、《科创板上市公司自律监管指南第 4 号——股权激励信 息披露》等有关法律、行政法规、规范性文件以及《公司章程》的规定。实施本 次限制性股票激励计划有利于公司 ...

海通证券股份有限公司 关于芯联集成电路制造股份有限公司 2023 年度持续督导现场检查报告 上海证券交易所： 经中国证券监督管理委员会《关于同意绍兴中芯集成电路制造股份有限公 司首次公开发行股票注册的批复》（证监许可〔2023〕548 号）批复，芯联集成 电路制造股份有限公司（以下简称"芯联集成"、"上市公司"、"公司"）首次公 开发行股票 194,580.00 万股，每股面值人民币 1 元，每股发行价格人民币 5.69 元，募集资金总额为人民币 1,107,160.20 万元，扣除发行费用后，实际募集资金 净额为人民币 1,078,341.70 万元。本次发行证券已于 2023 年 5 月 10 日在上海证 券交易所上市。海通证券股份有限公司（以下简称"海通证券"、"保荐机构"） 担任其持续督导保荐机构，持续督导期间为 2023 年 5 月 10 日至 2026 年 12 月 31 日。 根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市 规则》《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》等 有关法律、法规要求，海通证券作为持续督导保荐机构，于 2024 年 4 月 1 ...

海通证券股份有限公司 关于芯联集成电路制造股份有限公司 2023 年度持续督导年度跟踪报告 | 保荐机构名称：海通证券股份有限公司 | 被保荐公司简称：芯联集成 | | --- | --- | | 保荐代表人姓名：徐亦潇 宋轩宇 | 被保荐公司代码：688469 | 重大事项提示 芯联集成电路制造股份有限公司（以下简称"上市公司"、"公司"）上市 时未盈利且尚未实现盈利，2023 年度，公司归属于上市公司股东的扣除非经常 性损益的净利润为-226,168.58 万元，仍为负值。 在 2023 年 5 月 10 日至 2023 年 12 月 31 日持续督导期内（以下简称"本持 续督导期间"），保荐机构及保荐代表人按照《证券发行上市保荐业务管理办法》 （以下简称"保荐办法"）、《上海证券交易所科创板股票上市规则》等相关规 定，通过日常沟通、定期回访、现场检查、尽职调查等方式进行持续督导，现就 2023 年度持续督导情况报告如下： 2 项 目 工作内容 1、建立健全并有效执行持续督导工作制度，并 针对具体的持续督导工作制定相应的工作计划。 保荐机构已建立健全并有效执行持续督导 工作制度，并针对具体的持续督导工作制 ...

Investment Rating - The report maintains a "Buy" rating for the company [1] Core Views - The company's performance in 2023 was slightly below expectations due to significant depreciation and R&D investments impacting profit. The total revenue for 2023 was 5.324 billion yuan, a year-on-year increase of 16%, while the net profit attributable to shareholders was -1.958 billion yuan, a year-on-year decrease of 80% [2][3] - The downturn in the new energy market has affected the growth of silicon-based business, but there is a long-term positive outlook for module packaging and analog IC expansion. In 2023, the automotive and industrial control sectors contributed 76% of the company's main business revenue [3] - The company is the domestic leader in SiC MOS shipments, with expected revenue from silicon carbide business to exceed 1 billion yuan in 2024. The 6-inch SiC MOS production line has achieved a monthly output of over 5,000 pieces, and plans are in place to establish the first domestic 8-inch SiC MOS experimental line [3] Summary by Relevant Sections Financial Performance - In 2023, the company achieved total revenue of 5.324 billion yuan, with a year-on-year growth of 16%. The net profit attributable to shareholders was -1.958 billion yuan, reflecting a year-on-year decline of 80% [2][3] - For 2024-2026, the projected revenues are 6.410 billion yuan, 7.774 billion yuan, and 9.797 billion yuan respectively, with growth rates of 20.38%, 21.29%, and 26.01% [2][3] Production Capacity and Market Position - The company has completed the design capacity for 12-inch wafers and is in the ramp-up phase for IGBT, SJ, HVIC, and BCD platforms. The 8-inch silicon wafer foundry line maintained an annual capacity utilization rate of over 80% [3] - The company has established partnerships with major new energy vehicle manufacturers, which is expected to drive growth in the silicon carbide business [3] Valuation Metrics - The current market capitalization corresponds to price-to-sales ratios of 5.3, 4.4, and 3.5 for the years 2024, 2025, and 2026 respectively [3]

证券代码：688469 证券简称：芯联集成 公告编号：2024-021 芯联集成电路制造股份有限公司 关于公司董事长提议公司回购股份的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 芯联集成电路制造股份有限公司（以下简称"公司"）董事会于 2024 年 3 月 27 日收到公司董事长丁国兴先生《关于提议芯联集成电路制造股份有限公司 回购公司股份的函》，具体内容如下： （二）回购股份的用途：本次回购的股份拟在未来适宜时机全部用于公司股 权激励及/或员工持股计划。若公司未能在股份回购实施结果暨股份变动公告日 后 3 年内使用完毕已回购股份，尚未使用的已回购股份将予以注销。如国家对相 关政策作调整，则按调整后的政策实行； （三）回购股份的方式：通过上海证券交易所交易系统以集中竞价交易方式 回购； （四）回购股份的价格区间：不超过董事会通过回购股份决议前 30 个交易 日公司股票交易均价的 150%，具体以董事会审议通过的回购方案为准； 一、提议人的基本情况及提议时间 （一）提议人：公司董事长丁国兴先生。 （ ...

Group 1: Company Strategy and Development - The main strategic direction for the company in 2023 focuses on silicon carbide (SiC) related businesses and the development of BCD technology [2][3] - The company is transitioning from a foundry service provider to a one-stop system-on-chip solution supplier [2] - The product line has expanded from IGBT, MOSFET, and MEMS to include analog IC, BCD, SiC MOS, and VCSEL, with ongoing R&D for MCU [2][3] Group 2: Financial Performance - In 2023, the company's main revenue reached 4.91 billion yuan, a year-on-year increase of 24.06% [3] - Operating cash flow for 2023 was 2.614 billion yuan, up 95.93% year-on-year [3] - Revenue from the automotive and industrial control sectors accounted for over 76% of total revenue, with automotive revenue growing by 128% year-on-year [3] Group 3: R&D Investment and Progress - The company invested over 1.5 billion yuan in R&D in 2023, representing 28.72% of total revenue [3] - Key technologies established include power, sensor signal chain, and mixed-signal high-voltage analog ICs, targeting new energy, smart technology, and IoT industries [3][4] - The company has achieved mass production of advanced SiC chips and modules, filling gaps in high-voltage, high-power digital-analog mixed-signal integrated circuits [4][5] Group 4: Market Expansion and Future Plans - The company plans to strengthen its technology layout and market expansion in the AI sector, focusing on smart power management and sensor chips for robotics [3][4] - In 2024, the company aims to accelerate product development in AI-related technologies, with multiple platforms expected to be released [5][6] - The company is also expanding its production capacity for SiC and BCD technologies based on market demand and technological advancements [6] Group 5: Challenges and Responses - The company faces challenges in the domestic BCD market, where it currently holds less than 10% of the market share [5] - Strategies to overcome these challenges include collaborating with design companies and enhancing production capabilities [5][6] - The company anticipates a significant reduction in losses for 2024 through cost structure optimization and increased revenue from new product introductions [6]

Financial Performance - The company reported an EBITDA of 925 million RMB for 2023, an increase of 116 million RMB, representing a year-on-year growth of 14.29%[3]. - The company's operating revenue for 2023 was approximately CNY 5.32 billion, representing a 15.59% increase compared to CNY 4.61 billion in 2022[17]. - The net profit attributable to shareholders for 2023 was approximately CNY -1.96 billion, compared to CNY -1.09 billion in 2022[17]. - The gross profit margin for 2023 was -6.81%, a decrease of 6.58 percentage points from -0.23% in 2022[18]. - The company reported a basic earnings per share of CNY -0.32 for 2023, compared to CNY -0.21 in 2022[18]. - The weighted average return on equity for 2023 was -22.44%, an improvement of 4.87 percentage points from -27.31% in 2022[18]. - The net cash flow from operating activities increased by 95.93% to approximately CNY 2.61 billion in 2023, up from CNY 1.33 billion in 2022[17]. - The company achieved an EBITDA of 9.25 billion yuan for the year, an increase of 1.16 billion yuan or 14.29% year-over-year, after excluding annual depreciation and amortization expenses of 3.451 billion yuan[42]. - Operating cash flow for 2023 was 2.614 billion yuan, up 1.280 billion yuan or 95.93% compared to the previous year[42]. Research and Development - Significant investments have been made in R&D for core chips and modules, including 8-inch IGBT power devices and HVIC (BCD) power drivers, to enhance international competitiveness[3]. - The research and development expenditure accounted for 28.72% of operating revenue in 2023, an increase of 10.50 percentage points from 18.22% in 2022[18]. - The company invested 15.29 billion yuan in R&D, representing 28.72% of its revenue, significantly exceeding the industry average[43]. - The company added 102 new patents during the reporting period, including 35 invention patents and 63 utility model patents[43]. - The company achieved mass production of SiC MOSFETs, with shipments exceeding 5,000 pieces per month by the end of the year[45]. - The company has achieved mass production of ultra-high voltage IGBT products for ultra-high voltage direct current transmission[60]. - The company has conducted three rounds of technological iterations for SiC MOSFET technology over two years[157]. Market and Product Development - The company has established a comprehensive platform covering automotive, industrial control, and consumer sectors, with a broad customer base including leading domestic and international chip and system design companies[3]. - The company is focusing on expanding its product lines, including silicon carbide products and 12-inch silicon wafers, to enhance its market presence and meet diverse customer needs[28]. - The company reported a significant increase in revenue from the automotive sector, driven by the growth in the new energy vehicle market, contributing to overall revenue growth[27]. - The company maintained a high growth rate in revenue, EBITDA, and operating cash flow despite the semiconductor industry's cyclical downturn[27]. - The company achieved a main business revenue of 4.911 billion yuan, an increase of 955 million yuan, representing a year-on-year growth of 24.06%[29]. - The wafer foundry revenue accounted for 91.07% of total revenue, with a year-on-year growth of 25.73%[31]. - The sales volume of automotive-grade 8-inch wafer foundry products increased by 111.75% year-on-year, contributing to a 158.16% growth in revenue from automotive and industrial applications[34]. - The company has established a strong market position in the consumer electronics sector with its sensor and battery management protection products[60]. Strategic Initiatives - The company plans to improve profitability as new capacity is rapidly released, revenue increases, and depreciation is gradually absorbed[3]. - The company aims to enhance its supply chain management to support its expansion in the global new energy core chip industry[42]. - The company is committed to supporting the development of smart grids and has introduced ultra-high voltage IGBT products for high-voltage direct current transmission[113]. - The company is expanding its market presence in the AI server and data center sectors with high-efficiency power management chips[113]. - The company is exploring potential acquisitions to strengthen its technology portfolio, with a budget of 500 million allocated for this purpose[126]. - The company has established a partnership to enhance vertical integration in the supply chain[157]. Corporate Governance and Compliance - The board of directors approved a profit distribution plan for 2023 that includes no profit distribution or capital reserve transfer to increase share capital[5]. - The company has not faced any non-operating fund occupation by controlling shareholders or related parties[6]. - The company has established a comprehensive quality management system, achieving multiple international certifications including ISO9001 and IATF16949[74]. - The company has established a remuneration and assessment committee to oversee the remuneration policies[131]. - The company has committed to long-term compliance with various promises related to competition and related transactions, with no violations reported[191]. - The company has implemented a share lock-up period of 36 months for major shareholders following the IPO[192]. Environmental and Social Responsibility - The company has invested approximately 132.6 million RMB in environmental protection during the reporting period[159]. - The company has implemented carbon reduction measures that resulted in a total reduction of 16,121 tons of CO2 equivalent, including 1,280 tons from clean energy photovoltaic installations and 12,181 tons from carbon reduction technologies[170]. - The company donated 50,000 yuan to a local charity for providing meals to those in need and contributed approximately 200,000 yuan in materials to support a local disabled persons' home[175]. - The company spent a total of 136,000 yuan on educational support through partnerships with three vocational colleges[175]. Workforce and Employee Engagement - The company has a workforce of 4,324 employees, with 662 R&D personnel, representing 15% of the total workforce[72]. - The total compensation for R&D personnel reached CNY 37,918.68 million, while the average salary decreased to CNY 57.28 million[68]. - The company has established a comprehensive salary and welfare system, including fixed salaries and bonuses, to ensure competitive compensation[146]. - The company has developed a comprehensive training system to support employee career development and enhance their professional skills[177]. - The company emphasizes the protection of employee rights, providing a fair and harmonious work environment, and ensuring full coverage of labor contracts and social insurance[177].

芯 联 集 成 电 路 制 造 股 份 有 限 公 司 审计报告 天 职 业 字 [2024]191 号 目 录 __ 审计报告 - 2023 年度财务报表 2023 年度财务报表附注 -- -- --- 19 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mof.gov.cn) 审计报告 天职业字[2024]191 号 二、形成审计意见的基础 我们按照中国注册会计师审计准则的规定执行了审计工作。审计报告的"注册会计师对 财务报表审计的责任"部分进一步阐述了我们在这些准则下的责任。按照中国注册会计师职 业道德守则,我们独立于芯联集成,并履行了职业道德方面的其他责任。我们相信,我们获 取的审计证据是充分、适当的,为发表审计意见提供了基础。 三、关键审计事项 关键审计事项是我们根据职业判断,认为对报告期财务报表审计最为重要的事项。这些 事项的应对以对财务报表整体进行审计并形成审计意见为背景,我们不对这些事项单独发表意见。 芯联集成电路制造股份有限公司全体股东: 一、审计意见 我们审计了芯联集成电路制造股份有限公司(以下简称"芯联集成")财务报表,包括 2023 年 12 月 31 ...

报告导读 3 发布周期 本报告为年度报告，也是芯联集 成电路制造股份有限公司发布的 第五份企业社会责任报告。 时间范围 2023 年 1 月 1 日至 2023 年 12 月 31 日，部分内容由于考虑项目连 续性或重大影响的因素，会向前 追溯或向后延伸。 报告边界 本报告涉及的内容与芯联集成电路制造股份有限公司的业务覆盖区域一 致，包括了公司的企业社会责任理念、战略和具体实践，以及在报告期 内的企业运营状况。 编制依据 报告参考全球可持续发展标准委员会（GSSB）发布的《GRI 可持续发 展报告标准》（GRI Standards）和中国社会科学院《中国企业社会责 任报告指南（CASS-ESG5.0）》和《社会责任报告编写指南》（GB/T 36001-2015）、《上海证券交易所上市公司环境信息披露指引》等要求 编写。 数据说明 本报告所引用数据均来自公司正式文件和统计数据。本报 告所引用数据，除另有说明，度量衡均为公制，货币单位 均为人民币。 指代说明 | 巩固环境管理 | 42 | | --- | --- | | 推进节能减排 | 44 | | 实施绿色运营 | 51 | | 应对气候变化 | 53 | ...