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芯联集成(688469) - 芯联集成电路制造股份有限公司关于2025年度银行授信额度预计的公告
2025-04-28 16:08
证券代码:688469 证券简称:芯联集成 公告编号:2025-018 芯联集成电路制造股份有限公司 关于2025年度银行授信额度预计的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 以公司及公司子公司与金融机构实际发生的融资金额为准,实际融资金额及品种 将视公司业务发展的实际需求决定。 特此公告。 芯联集成电路制造股份有限公司董事会 2025 年 4 月 29 日 芯联集成电路制造股份有限公司(以下简称"公司")及公司子公司 2025 年度拟向国有银行、商业银行、融资租赁公司或政策性银行申请总额不超 过人民币 200 亿元的综合授信额度(最终以各银行及其他金融机构实际核准的信 用额度为准)。 本次银行授信事项已经公司第二届董事会第四次会议审议,尚需提交 公司股东大会审议。 公司于 2025 年 4 月 25 日召开了第二届董事会第四次会议,会议审议通过了 《关于公司 2025 年度向银行申请综合授信额度的议案》,同意公司及公司子公 司在 2025 年度向国有银行、商业银行、融资租赁公司或政策性银行申请总额不 超过人 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司关于续聘会计事务所的公告
2025-04-28 16:08
证券代码:688469 证券简称:芯联集成 公告编号:2025-016 芯联集成电路制造股份有限公司 关于续聘会计师事务所的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 拟聘任的会计师事务所名称:天职国际会计师事务所(特殊普通合伙) (以下简称"天职国际") 一、拟聘任会计师事务所的基本情况 (一)机构信息 1、基本信息 | 事务所名称 | 天职国际会计师事务所(特殊普通合伙) | | | | --- | --- | --- | --- | | 成立日期 | 1988 年 12 月 | 组织形式 | 特殊普通合伙 | | 注册地址 | 北京市海淀区车公庄西路 19 号 68 | 号楼 A-1 和 A-5 | 区域 | | 首席合伙人 | 邱靖之 | 上年度末合伙人数量 | 89 | | 上年末执业人员 | 注册会计师 | | 1165 | | 数量 | 签署过证券服务业务审计报告的注册会计师 | | 414 | | 2023 年业务收入 | 业务收入总额 审计业务收入 | 31.97 亿元 26.41 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司2024年度内部控制评价报告
2025-04-28 16:08
公司代码:688469 公司简称:芯联集成 芯联集成电路制造股份有限公司 2024年度内部控制评价报告 芯联集成电路制造股份有限公司全体股东: 根据《企业内部控制基本规范》及其配套指引的规定和其他内部控制监管要求(以下简称企业内部 控制规范体系),结合本公司(以下简称公司)内部控制制度和评价办法,在内部控制日常监督和专项 监督的基础上,我们对公司2024年12月31日(内部控制评价报告基准日)的内部控制有效性进行了评价。 一. 重要声明 按照企业内部控制规范体系的规定,建立健全和有效实施内部控制,评价其有效性,并如实披露内 部控制评价报告是公司董事会的责任。监事会对董事会建立和实施内部控制进行监督。经理层负责组织 领导企业内部控制的日常运行。公司董事会、监事会及董事、监事、高级管理人员保证本报告内容不存 在任何虚假记载、误导性陈述或重大遗漏,并对报告内容的真实性、准确性和完整性承担个别及连带法 律责任。 公司内部控制的目标是合理保证经营管理合法合规、资产安全、财务报告及相关信息真实完整,提 高经营效率和效果,促进实现发展战略。由于内部控制存在的固有局限性,故仅能为实现上述目标提供 合理保证。此外,由于情况的变 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司2024年年度股东大会会议资料
2025-04-28 16:03
证券代码:688469 证券简称:芯联集成 芯联集成电路制造股份有限公司 2024 年年度股东大会 会议资料 芯联集成电路制造股份有限公司 2024 年年度股东大会会议资料 2025 年 5 月 芯联集成电路制造股份有限公司 2024 年年度股东大会会议资料 | | | | 2024 | 年年度股东大会会议须知 | | 1 | | --- | --- | --- | --- | | 2024 | 年年度股东大会会议议程 | | 3 | | 2024 | 年年度股东大会会议议案 | | 5 | | 议案一:关于 | 2024 | 年度董事会工作报告的议案 | 5 | | 议案二:关于 | 2024 | 年度监事会工作报告的议案 | 12 | | 议案三:关于 | 2024 | 年度独立董事述职报告的议案 | 18 | | 议案四:关于 | 2024 | 年度财务决算报告的议案 | 19 | | 议案五:关于 | 2024 | 年年度报告及其摘要的议案 | 25 | | 议案六:关于 | 2024 | 年度利润分配预案的议案 | 26 | | 议案七:关于续聘会计师事务所的议案 | 27 | | | | 议案八: ...
芯联集成(688469) - 芯联集成电路制造股份有限公司关于召开2024年年度股东大会的通知
2025-04-28 16:03
证券代码:688469 证券简称:芯联集成 公告编号:2025-022 芯联集成电路制造股份有限公司 关于召开2024年年度股东大会的通知 2024年年度股东大会 (二) 股东大会召集人:董事会 (三) 投票方式:本次股东大会所采用的表决方式是现场投票和网络投票相结 合的方式 (四) 现场会议召开的日期、时间和地点 召开日期时间:2025 年 5 月 19 日 14 点 00 分 召开地点:浙江省绍兴市越城区皋埠街道临江路 518 号芯联集成电路制造 股份有限公司会议室 (五) 网络投票的系统、起止日期和投票时间。 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 一、 召开会议的基本情况 (一) 股东大会类型和届次 网络投票系统:上海证券交易所股东大会网络投票系统 网络投票起止时间:自2025 年 5 月 19 日 至2025 年 5 月 19 日 股东大会召开日期:2025年5月19日 本次股东大会采用的网络投票系统:上海证券交易所股东大会网络投票 系统 采用上海证券交易所网络投票系统,通过交易系统投票平台 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司第二届监事会第四次会议决议公告
2025-04-28 16:02
证券代码:688469 证券简称:芯联集成 公告编号:2025-021 芯联集成电路制造股份有限公司 第二届监事会第四次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 一、 监事会会议召开情况 芯联集成电路制造股份有限公司第二届监事会第四次会议于 2025 年 4 月 25 日以现场结合通讯的方式召开。会议通知于 2025 年 4 月 15 日向全体监事发出。 会议应出席监事 5 人,实际出席监事 5 人,会议由监事会主席王永先生主持。会 议的召集和召开符合《中华人民共和国公司法》等法律法规和《公司章程》的有 关规定。 二、监事会会议审议情况 1、审议通过《关于 2024 年度监事会工作报告的议案》 监事会认为:2024 年度,监事会按照《公司法》《公司章程》等相关规定, 恪尽职守,认真履行监督职责,有效监督和审查了公司重大事项的决策和决议的 形成、表决程序,对公司的合规运作进行了审查,特别是对公司的经营情况、财 务状况以及董事、高级管理人员职责履行情况等方面实施了有效监督,保障了公 司全体股东以及公司的合法 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司关于2024年度利润分配预案的公告
2025-04-28 16:00
芯联集成电路制造股份有限公司 关于2024年度利润分配预案的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 证券代码:688469 证券简称:芯联集成 公告编号:2025-015 重要内容提示: 芯联集成电路制造股份有限公司(以下简称"公司")2024 年度利润 分配方案为不进行利润分配,不进行资本公积金转增股本或其他形式的分配。 本次利润分配方案已经公司第二届董事会第四次会议和第二届监事会 第四次会议审议通过,尚需提交公司股东大会审议。 一、利润分配方案内容 经天职国际会计师事务所(特殊普通合伙)审计,公司 2024 年度合并报表 实现归属于上市公司股东的净利润为-962,159,563.25 元,其中母公司净利润为 611,877,745.01 元。截至 2024 年 12 月 31 日,合并报表累计未分配利润为 -5,004,082,871.68 元,母公司累计未分配利润为-192,107,484.56 元。经董事 会决议,公司 2024 年度不进行利润分配,也不进行资本公积转增股本或其他形 式的分配。本次利润 ...
芯联集成(688469) - 2024 Q4 - 年度财报
2025-04-28 15:25
Financial Performance - The company reported an EBITDA of 2.146 billion yuan for 2024, representing a year-on-year growth of 131%[3]. - The company remains unprofitable as of the end of the reporting period, primarily due to high fixed asset investments and ongoing R&D expenditures[3]. - The company's operating revenue for 2024 reached approximately RMB 6.51 billion, representing a year-over-year increase of 22.25% compared to RMB 5.32 billion in 2023[24]. - The net loss attributable to shareholders decreased by 50.87% to approximately RMB 962.16 million in 2024 from RMB 1.96 billion in 2023[24]. - EBITDA for 2024 was approximately RMB 2.15 billion, reflecting a significant increase of 131.86% compared to RMB 925.42 million in 2023[24]. - The net cash flow from operating activities for 2024 was approximately RMB 1.90 billion, a decrease of 27.22% from RMB 2.61 billion in 2023[24]. - The company's net assets attributable to shareholders at the end of 2024 were approximately RMB 12.32 billion, a slight decrease of 1.30% from RMB 12.48 billion at the end of 2023[24]. - The revenue from core business operations, after excluding unrelated business income, was approximately RMB 6.28 billion, up 27.80% from RMB 4.91 billion in 2023[24]. - The net profit attributable to shareholders, after deducting non-recurring gains and losses, was approximately RMB -1.41 billion, a reduction in loss of 37.68% compared to RMB -2.26 billion in 2023[24]. Strategic Focus and Market Position - The company focuses on key technology platforms such as power, MEMS, BCD, and MCU, targeting sectors like automotive, AI, high-end consumer, and industrial control[3]. - The company plans to leverage opportunities in the AI era and aims for a new growth phase driven by innovations in analog ICs, power modules, SiC MOSFETs, and MEMS[4]. - The company emphasizes a dual-driven strategy of technology and market to establish a leading mixed-signal system foundry platform globally[4]. - The company is focusing on the development of new semiconductor technologies, including SiC and IGBT, to enhance its product offerings[16]. - The company plans to expand its market presence through strategic partnerships and potential acquisitions in the semiconductor sector[16]. - The company aims to improve its operational efficiency and reduce losses in the upcoming fiscal year through cost management strategies[24]. Revenue Growth and Sector Performance - Revenue from wafer foundry services increased by CNY 1.123 billion, a year-on-year growth of 25.11%[26]. - Module packaging revenue reached CNY 602 million, growing by 54.54% year-on-year, driven by strong demand in the automotive sector[26]. - The company achieved a 106% year-on-year revenue growth in high-power IGBT/SiC power module packaging technology in 2024[26]. - Revenue from the automotive sector accounted for 51.78% of total revenue, increasing by 40.87% year-on-year, while the high-end consumer sector saw a 66.02% increase[40]. - The company's wafer foundry revenue increased by 25.11% year-on-year, reaching 11.23 billion yuan[42]. Research and Development - The company achieved a total R&D investment of approximately ¥1.84 billion, representing a 20.45% increase compared to the previous year[82]. - Research and development expenses accounted for 28.30% of operating revenue, slightly down from 28.72% in 2023[26]. - The company successfully launched multiple new products in the automotive electronics sector, including SiC MOSFET chips and high-voltage BCD SOI integration solutions, which have been validated by major automotive clients[76]. - In the AI sector, the company has achieved mass production of 180nm BCD power management chips for AI servers and AI accelerator cards[77]. - The company has filed 259 new patent applications during the reporting period, with 118 patents granted, bringing the total to 1,025 applications and 416 granted patents[80]. Governance and Compliance - The company has received a standard unqualified audit report from Tianzhi International Accounting Firm[6]. - The company has not implemented any special governance arrangements[8]. - The company has held 4 shareholder meetings in 2024, ensuring compliance with governance regulations and protecting the rights of minority shareholders[148]. - The company published 4 regular reports and 90 temporary announcements, adhering to legal and regulatory requirements for information disclosure[149]. - The company’s governance practices comply with relevant laws and regulations, with no major discrepancies noted[149]. Environmental and Social Responsibility - The company has established an environmental protection mechanism[199]. - Environmental protection investment during the reporting period amounted to 116.17 million yuan[199]. - The company is classified as a key pollutant discharge unit by the environmental protection department[200]. - All pollutant emissions in 2024 have met standards[200]. Future Outlook and Growth Strategies - The company aims to achieve a revenue growth target of 15% year-over-year for the next fiscal year[157]. - New product lines are expected to contribute significantly to revenue in the upcoming quarters[157]. - The management team is committed to maintaining a strong financial position while pursuing aggressive growth strategies[157]. - The company is exploring partnerships to enhance its technological capabilities and market reach[157]. - The company plans to invest in research and development to support new product launches[157].
芯联集成(688469) - 2025 Q1 - 季度财报
2025-04-28 15:20
Financial Performance - The company's revenue for Q1 2025 reached ¥1,733,684,310.68, representing a year-on-year increase of 28.14% compared to ¥1,352,995,972.16 in the same period last year[4] - The net profit attributable to shareholders improved to a loss of ¥182,289,864.64, a reduction of 24.71% from a loss of ¥242,117,693.08 in the previous year[4] - The EBITDA for the quarter was ¥443,734,011.30, reflecting a decrease of 7.87% from ¥481,619,248.91 in the same period last year[4] - Net profit for Q1 2025 was -¥549,904,618.36, an improvement from -¥650,028,206.01 in Q1 2024[19] - Total operating revenue for Q1 2025 reached ¥1,733,684,310.68, a 28.1% increase from ¥1,352,995,972.16 in Q1 2024[18] Cash Flow and Liquidity - The net cash flow from operating activities was ¥171,757,565.56, down 43.89% from ¥306,117,266.28 in the same period last year[4] - Operating cash flow for Q1 2025 was ¥171,757,565.56, down from ¥306,117,266.28 in Q1 2024[20] - The company's cash and cash equivalents decreased to RMB 2,835,101,036.78 from RMB 5,187,727,390.85, representing a significant drop of about 45.4%[13] - Cash and cash equivalents at the end of Q1 2025 totaled ¥2,817,511,036.78, a decrease from ¥5,764,657,714.89 at the end of Q1 2024[21] - The company experienced a net cash outflow from investing activities of -¥2,271,363,141.27 in Q1 2025, compared to -¥2,213,006,858.57 in Q1 2024[21] - Financing activities resulted in a net cash outflow of -¥248,252,913.69 in Q1 2025, contrasting with a net inflow of ¥3,777,490,913.41 in Q1 2024[21] Assets and Liabilities - The total assets at the end of the reporting period were ¥33,431,182,448.30, a decrease of 2.26% from ¥34,202,723,841.88 at the end of the previous year[5] - As of March 31, 2025, the total current assets amounted to RMB 9,970,064,568.44, a decrease from RMB 10,861,514,624.48 as of December 31, 2024, reflecting a decline of approximately 8.2%[14] - Total liabilities decreased to RMB 13,580,493,051.97 from RMB 14,255,904,411.99, indicating a reduction of approximately 4.7%[15] - The total assets as of March 31, 2025, were RMB 33,431,182,448.30, down from RMB 34,202,723,841.88, a decrease of about 2.2%[15] - The company's total equity decreased slightly to RMB 19,850,689,396.33 from RMB 19,946,819,429.89, reflecting a decline of approximately 0.5%[15] Shareholder Information - The total number of ordinary shareholders at the end of the reporting period was 142,903[10] - The top shareholder, Shaoxing Yuecheng Integrated Circuit Industry Fund, holds 16.30% of the shares, totaling 1,152,000,000 shares[10] - The company held 99,980,204 shares in its repurchase account, accounting for 1.41% of the total share capital[11] Research and Development - Research and development expenses totaled ¥458,261,601.71, accounting for 26.43% of revenue, a decrease of 8.32 percentage points from 34.75% in the previous year[5] - Research and development expenses for Q1 2025 were ¥458,261,601.71, slightly down from ¥470,149,903.00 in Q1 2024[18] Inventory and Receivables - The inventory increased to RMB 2,273,279,727.16 from RMB 2,180,581,121.29, marking an increase of about 4.3%[14] - The accounts receivable rose to RMB 1,455,900,162.54 from RMB 1,349,218,238.98, an increase of approximately 7.9%[13] Earnings Per Share - The company’s basic and diluted earnings per share remained at -¥0.03 for both Q1 2025 and Q1 2024[19]
芯联集成(688469) - 芯联集成电路制造股份有限公司募集资金年度存放与使用情况鉴证报告天职业字[2025]13528-4号
2025-04-28 15:19
芯 联 集 成 电 路 制 造 股 份 有 限 公 司 募 集 资 金 年 度 存 放 与 使 用 情 况 鉴 证 报 告 天 职 业 字 [2025]13528-4 号 目 募集资金年度存放与使用情况鉴证报告— 关于公司募集资金存放与实际使用情况的专项报告— -3 您可使用手机"扫一扣"或进入"注册会计师行业统一流管平台(http://ac.mof.gov.cn)"进行查询 "社行"扣"或近入"注册会计师行业统一流管平台(http://ac.mot.gov.cn)"进行查询 "" 天职业字[2025]13528-4 号 芯联集成电路制造股份有限公司全体股东: 我们审核了后附的芯联集成电路制造股份有限公司(以下简称"芯联集成")《关于公司募 集资金存放与实际使用情况的专项报告》。 一、管理层的责任 芯联集成电路制造股份有限公司的责任是按照中国证监会《上市公司监管指引第2号 -- 上市公司募集资金管理和使用的监管要求》(2022年修订)、上海证券交易所颁布的《上海证券 交易所科创板上市公司自律监管指引第1号 -- 规范运作》及相关格式指引规定编制《关于公 司募集资金存放与实际使用情况的专项报告》,并保证其内容的 ...