Core Viewpoint - Company focuses on the continuous development of high-voltage, high-power, and high-density BCD process for analog IC chips, with accelerated customer adoption of high-voltage and integrated solution process platforms, currently covering over 70% of domestic design companies [1] Group 1 - Company is engaged in the development of analog IC chips [1] - Company emphasizes high-voltage, high-power, and high-density BCD process technology [1] - Customer adoption of high-voltage and integrated solution process platforms is accelerating [1] Group 2 - Company has achieved coverage of over 70% of domestic design companies [1]

Core Viewpoint - The company is actively expanding its presence in the AI server power supply market and has developed a comprehensive chip system OEM solution that covers over 50% of the AI server power supply value [1] Group 1: AI Server Power Supply - The company has laid out a system OEM solution for AI server power supplies, which includes first-level, second-level, and third-level power supplies [1] - The product offerings encompass power devices, driver ICs, magnetic components, MCUs, and current sensors [1] - The company is focusing on the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power supply systems for data centers [1] Group 2: Robotics Applications - The company has developed a miniaturized drive module for robotic dexterous hands, which has been adopted by leading domestic enterprises [1] - This solution aims to provide a one-stop chip system OEM solution for clients seeking lightweight and compact designs [1]

（编辑 任世碧） 证券日报网讯 芯联集成11月12日在互动平台回答投资者提问时表示，公司建设有高效的数字化车规级 智慧工厂，所有产线均为车规级产线，可以为各类客户提供一站式系统代工服务。目前公司MEMS传感 器、激光雷达等芯片已占据国内主要市场份额。 ...

Group 1 - The core viewpoint of the article highlights the successful fundraising of 1.25 billion yuan for the first main fund of ChipLink Capital, with an expected total scale exceeding 1.5 billion yuan, focusing on hard technology sectors such as semiconductors, artificial intelligence, robotics, and new energy [2] - The fund was raised in less than a year, featuring a highly market-oriented LP structure that includes a mix of industry, capital, and policy backgrounds, with notable investors such as ChipLink Integrated, Shanghai Lingang New Area Fund, and various leading market-oriented mother funds and financial institutions [2] - The founder of ChipLink Capital, Yuan Feng, emphasized that the successful fundraising reflects investors' confidence in the long-term development of China's hard technology and strategic emerging industries, indicating a commitment to supporting companies through different development stages [2] Group 2 - ChipLink Capital operates as a corporate venture capital (CVC) institution, leveraging deep industry resources from its parent company, ChipLink Integrated, to drive investment strategies that combine capital and industry, aiming to expand the industrial chain and build an ecosystem for hard technology companies [3] - The institution has invested in several well-known companies within the semiconductor and new energy sectors, including ShuoKe ZhongKe Xin, ChipLink Power, and Junyuan Electronics, and has also begun investments in emerging application fields such as robotics and AI [3]

Core Viewpoint - The company has achieved mass production of its 8-inch SiC MOSFET production line, with a current capacity of 2,000 pieces per month, indicating a strong position in the SiC market as demand is expected to grow with customer adoption and validation [1] Group 1 - The 8-inch SiC MOSFET production line has reached a capacity of 2,000 pieces per month [1] - The company plans to expand production capacity in response to market demand as customer validation progresses [1] - Continuous growth in demand for 8-inch SiC is anticipated as more customers are onboarded [1]

Core Viewpoint - Company is focusing on AI server power applications and has developed a comprehensive system OEM solution that covers over 50% of the AI server power value [1] Group 1: AI Server Power Applications - Company has laid out a system OEM solution for AI server power, which includes a one-stop chip system solution from primary power, secondary power, to tertiary power [1] - The solution encompasses power devices, driver ICs, magnetic components, MCUs, and current sensors [1] - Company is actively expanding into the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power supply systems for data centers [1] Group 2: Robotics Applications - Company has independently developed a miniaturized drive module for robotic dexterous hands, which has been designated by leading domestic enterprises [1] - This solution aims to provide a one-stop chip system OEM solution for clients seeking lightweight and compact designs [1]

Group 1 - The company has commenced mass production of its third-generation microphones used in high-end consumer products and new energy vehicles [1] - The design iteration for the fourth-generation dual-diaphragm microphone is currently underway [1] - The company's high-performance microphones hold over 50% market share in a leading international smartphone terminal market [1]

Group 1 - The company has commenced mass production of its third-generation microphones used in high-end consumer electronics and new energy vehicles [1] - The design iteration for the fourth-generation dual-diaphragm microphone is currently underway [1] - The company's high-performance microphones hold over 50% market share in a leading international smartphone terminal market [1]

Core Viewpoint - The company has achieved mass production of its 8-inch SiC MOSFET production line, with a current capacity of 2,000 wafers per month, indicating a strong position in the SiC market as demand is expected to grow with customer adoption and validation [1] Group 1 - The 8-inch SiC MOSFET production line has reached a capacity of 2,000 wafers per month [1] - The company plans to expand production capacity in response to increasing market demand [1] - Continuous customer onboarding and successful validation processes are driving the growth in demand for 8-inch SiC products [1]

Core Insights - The Fourth China Power Electronics and Energy Conversion Conference (CPEEC & CPSSC 2025) was successfully held in Shenzhen from November 7 to 10, 2025, with ChipLink Integrated making its debut as a wafer foundry, showcasing core products and solutions in automotive electronics and AI power [2] - The demand for AI computing power is driving rapid advancements in data center power supply systems towards high power density, high efficiency, and high voltage [2] - ChipLink Integrated offers a comprehensive range of high-performance and reliable devices and system solutions for AI server power, leveraging its extensive power device platform and process technology [2] Power Device Developments - In the silicon carbide (SiC) sector, ChipLink Integrated has mass-produced mature devices across a voltage range of 650V to 3300V and developed a new G2.0 high-frequency SiC platform to enhance power efficiency and density [4] - The company is also developing high-voltage devices rated at 4500V and 6500V to meet the infrastructure demands of next-generation high-voltage direct current (HVDC) and solid-state transformers (SST) [4] - In the gallium nitride (GaN) area, ChipLink Integrated has introduced devices ranging from 40V to 650V using mainstream P-GaN technology and has developed optimized driver chips to address reliability issues in high-speed switching applications [4] Comprehensive Solutions - ChipLink Integrated has achieved a full range of low-voltage MOSFET products from 25V to 200V, outperforming mainstream manufacturers in Europe and the US, and has developed specialized devices for unique applications like server hot-swapping [4] - The company continues to innovate in packaging technology, offering advanced forms such as surface cooling and multi-in-one integration to meet high-density power design needs [4] - In addition to power devices, ChipLink Integrated provides supporting magnetic device solutions, starting with high-frequency magnetic materials to offer customized inductors and transformers for high-frequency and miniaturized power systems [4] Digital Control and Customer Solutions - On the chip level, ChipLink Integrated operates 55nm and 40nm MCU production lines to support the development of customized digital control chips for power management systems [5] - The company emphasizes its commitment to providing "one-stop" power solutions to assist customers in achieving autonomous, efficient, and green transformations in AI server power [5] - As the demand for AI computing power continues to rise, ChipLink Integrated aims to keep pace with technological advancements and collaborate with industry partners to enhance power electronics technology and energy conversion efficiency [5]