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芯联集成(688469.SH)发布半年度业绩,归母净亏损1.7亿元
智通财经网· 2025-08-04 10:17
归属于上市公司股东的净利润、归属于上市公司股东的扣除非经常性损益的净利润变动的主要原因:报 告期内,公司通过不断拓展市场、积极开拓应用领域,有效带动了销售规模的扩大;同时,公司积极推 行供应链管控与精益生产管理等降本增效措施,使整体盈利能力得到显著提升。 智通财经APP讯,芯联集成(688469.SH)披露2025年半年度报告,报告期实现营收34.95亿元,同比增长 21.38%;归母净利润亏损1.7亿元,同比减亏63.82%;扣非净利润亏损5.36亿元,同比减亏31.11%;基本每 股收益-0.02元。 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司关于2025年半年度募集资金存放与实际使用情况的专项报告
2025-08-04 10:15
证券代码:688469 证券简称:芯联集成 公告编号:2025-044 芯联集成电路制造股份有限公司 关于 2025 年半年度募集资金存放与实际使用情况 (一)实际募集资金金额和资金到账时间 根据中国证券监督管理委员会《关于同意绍兴中芯集成电路制造股份有限公 司首次公开发行股票注册的批复》(证监许可〔2023〕548号),同意公司首次 公开发行股票的注册申请。并经上海证券交易所同意,公司首次向社会公开发行 人民币普通股(A股)股票169,200.00万股(超额配售选择权行使前),本次发 行价格为每股人民币5.69元,募集资金总额为人民币962,748.00万元,扣除发行 费用人民币(不含增值税)25,471.45万元后,实际募集资金净额为人民币 937,276.55万元。本次发行募集资金已于2023年5月5日全部到位,并经天职国际 会计师事务所(特殊普通合伙)审验,于2023年5月5日出具了《验资报告》(天 职业字[2023]33264号)。 2023年6月8日,保荐人国泰海通证券股份有限公司(主承销商)全额行使超 额配售选择权,公司在初始发行169,200.00万股普通股的基础上额外发行 25,380.00 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司2025年度提质增效重回报专项行动方案的半年度评估报告
2025-08-04 10:15
芯联集成电路制造股份有限公司 关于公司 2025 年度提质增效重回报专项行动方案的 半年度评估报告 2025 年上半年,公司依托并强化"一站式芯片系统代工"模式,精准对接 重点客户的战略需求;同时,不断加大研发投入,持续推出具有稀缺性的工艺技 术平台,构筑技术领先性;升级精细化管控体系与优化战略性资源配置,全面提 升经营质量;强化股东权益保护机制,构建长期资本增值路径,转化企业成长动 能;将股权激励深度融入公司成长规划,实现风险共担、价值共创,为可持续发 展奠定坚实基础;全面启动并推进"提质增效重回报"专项行动,各项举措落地 见效。 一、强化芯片系统代工商业模式,打造特色代工优势 2025 年上半年,公司在晶圆代工模式的基础上,不断汲取市场需求的变化, 强化"一站式芯片系统代工"的经营模式,构建了覆盖多个关键技术平台的产品 矩阵,精准服务于高速增长的应用市场。 报告期内,公司实现主营收入 34.57 亿元,同比增长 24.93%;归母净利润 -1.70 亿元,同比减亏 63.82%,其中二季度归母净利润 0.12 亿元,首次实现单 季度转正;毛利率 3.54%,较上年同期增加 7.79 个百分点;息税折旧摊销 ...
芯联集成(688469) - 芯联集成电路制造股份有限公司第二届监事会第七次会议决议公告
2025-08-04 10:15
证券代码:688469 证券简称:芯联集成 公告编号:2025-045 芯联集成电路制造股份有限公司 第二届监事会第七次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 一、 监事会会议召开情况 芯联集成电路制造股份有限公司第二届监事会第七次会议于 2025 年 8 月 1 日以现场结合通讯的方式召开。会议通知于 2025 年 7 月 22 日向全体监事发出。 会议应出席监事 5 人,实际出席监事 5 人,会议由监事会主席王永先生主持。会 议的召集和召开符合《中华人民共和国公司法》等法律法规和《公司章程》的有 关规定。 监事会认为:公司 2025 年半年度报告的编制和审核程序符合法律、 行政法规、公司章程和公司内部管理制度的相关规定;公司 2025 年半年 度报告的内容和格式符合法律、行政法规、中国证券监督管理委员会和 上海证券交易所的相关规定,该报告内容真实、准确、完整反映了公司 的实际情况。 综上,监事会同意公司编制的 2025 年半年度报告。 具体内容详见公司于同日在上海证券交易所网站(www.sse.c ...
芯联集成:2025年半年度净利润约-1.7亿元
Mei Ri Jing Ji Xin Wen· 2025-08-04 10:05
Group 1 - The company, ChipLink Integrated, reported a revenue of approximately 3.495 billion yuan for the first half of 2025, representing a year-on-year increase of 21.38% [1] - The net profit attributable to shareholders for the same period was a loss of approximately 170 million yuan, with a basic earnings per share loss of 0.02 yuan [1] - In comparison, the revenue for the first half of 2024 was approximately 2.88 billion yuan, with a net profit loss of about 471 million yuan and a basic earnings per share loss of 0.07 yuan [1] Group 2 - As of the report date, the market capitalization of ChipLink Integrated is 36.6 billion yuan [1]
芯联集成(688469) - 2025 Q2 - 季度财报
2025-08-04 10:05
芯联集成电路制造股份有限公司 2025 年半年度报告 公司代码:688469 公司简称:芯联集成 芯联集成电路制造股份有限公司 2025 年半年度报告 1 / 197 芯联集成电路制造股份有限公司 2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确性、 完整性,不存在虚假记载、误导性陈述或重大遗漏,并承担个别和连带的法律责任。 二、 重大风险提示 公司已在本报告中详细阐述公司在经营过程中可能面临的风险,敬请查阅本报告第三节"管 理层讨论与分析"中"四、风险因素"相关的内容。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 五、 公司负责人赵奇、主管会计工作负责人王韦及会计机构负责人(会计主管人员)张毅声明: 保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 无 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本报告中涉及的公司未来发展计划、发展战略、经营计划等前瞻性描述,不构成公司对投资 者的实质性承诺,敬请 ...
芯联集成(688469.SH):上半年净亏损1.7亿元
Ge Long Hui A P P· 2025-08-04 09:58
Core Viewpoint - ChipLink Integrated (688469.SH) reported a revenue of 3.495 billion yuan for the first half of the year, representing a year-on-year growth of 21.38%, but incurred a net loss of 170 million yuan [1] Financial Performance - The company achieved a net profit attributable to the parent company that reduced its losses by 63.82% year-on-year for the first half of 2025, with a second-quarter net profit of 12 million yuan, marking the first time it turned positive in a single quarter [1] - Gross margin stood at 3.54%, an increase of 7.79 percentage points year-on-year [1] - Earnings Before Interest, Taxes, Depreciation, and Amortization (EBITDA) reached 1.101 billion yuan, with an EBITDA margin of 31.51% [1]
芯联集成:上半年净利润亏损1.7亿元 同比减亏
Core Viewpoint - ChipLink Integrated (688469) reported a significant increase in revenue for the first half of 2025, achieving 3.495 billion yuan, which represents a year-on-year growth of 21.38%. However, the company recorded a net loss attributable to shareholders of 170 million yuan, an improvement from a loss of 471 million yuan in the same period last year [1]. Group 1 - The company expanded its market presence and actively explored new application areas, which effectively drove sales growth [1]. - The implementation of supply chain management and lean production practices contributed to cost reduction and efficiency improvements, leading to a notable enhancement in overall profitability [1].
芯联集成:2025年上半年净亏损1.7亿元,同比减亏63.82%
Xin Lang Cai Jing· 2025-08-04 09:50
芯联集成公告,2025年上半年营业收入34.95亿元,同比增长21.38%。归属于上市公司股东的净亏损1.7 亿元,同比减亏63.82%。 ...
AI算力设施需求驱动,SiC/GaN打开成长空间
Orient Securities· 2025-08-02 14:50
Investment Rating - The report maintains a "Positive" investment rating for the electronic industry in China [4] Core Viewpoints - The demand for AI computing facilities is expected to drive the growth of SiC/GaN power devices, opening up new growth opportunities in the industry [2][24] - The report emphasizes that the application potential of SiC/GaN in AI computing facility power supply systems has not been fully explored, and future demand is likely to continue increasing [7][24] Summary by Sections Investment Recommendations and Targets - AI server and data center demand is anticipated to create growth opportunities for SiC/GaN power devices. Key companies to watch include: - GaN industry leader Innoscience - Major power device manufacturers such as Wingtech Technology, China Resources Microelectronics, New Clean Energy, Star Semiconductor, and Tianyue Advanced - Wafer foundry company Chipone Integrated Circuits focusing on SiC power devices - Passive component companies like Farah Electronics and Jianghai Co., Ltd. - Companies in the third-generation semiconductor equipment market like Zhongwei Company [2][29] Industry Dynamics - The report highlights that AI computing facilities will increase the demand for SiC/GaN devices, particularly in high-voltage direct current (HVDC) and power module applications [7][8] - The transition from traditional power supply architectures to higher voltage systems (800V DC) is expected to enhance power transmission efficiency, thus driving the adoption of SiC/GaN devices [10][14] - The report notes that the penetration rate of SiC in global power semiconductors is projected to reach 4.9% by 2024, while GaN's penetration is at 0.5% in 2023, indicating room for growth [21][22] Company Insights - Innoscience is recognized as the global leader in the GaN industry, with a revenue of 830 million yuan in 2024, reflecting a year-on-year growth of 39.8% [30][34] - Wingtech Technology is focusing on semiconductor business growth, with a revenue of 58.4 billion yuan in 2024, and is strategically transforming to enhance its position in the power semiconductor industry [40][44] - China Resources Microelectronics is experiencing steady revenue growth, achieving 10.12 billion yuan in 2024, with a focus on enhancing its SiC/GaN product capabilities [50][51]