Core Viewpoint - The company has launched a new silicon carbide G2.0 technology platform that utilizes advanced 8-inch manufacturing technology, achieving a globally leading level [1] Group 1: Technology and Innovation - The new technology platform is optimized through both device structure and process technology to achieve core goals of "high efficiency, high power density, and high reliability" [1] - This platform covers two major application scenarios: electric drive and power supply [1] Group 2: Market Applications - The technology can be widely applied in the markets of new energy vehicle main drives, onboard power supplies, and AI data center power supplies [1]

Core Insights - The company Xilinx Integrated Circuit Manufacturing Co., Ltd. (stock code: 688469.SH) has officially launched its new Silicon Carbide G2.0 technology platform, which utilizes advanced 8-inch manufacturing technology and has reached a globally leading level [1] - This technology platform achieves the core goals of "high efficiency, high power density, and high reliability" through dual optimization of device structure and process technology, covering two main application scenarios: electric drive and power supply [1] - The G2.0 electric drive version enhances power density by 20% due to lower conduction losses and excellent switching softness, significantly improving the power output and energy efficiency of electric vehicle drive systems, thus supporting vehicle range [1] - In the power supply scenario, the G2.0 power version optimizes parasitic capacitance design and enhances heat dissipation through packaging optimization, reducing switching losses by up to 30%, while achieving significant improvements in power conversion efficiency and system power density [1] - The platform is expected to help customers seize opportunities in new energy electrification and AI computing power construction, establishing a leading differentiated competitive advantage [2]

Core Viewpoint - A significant block trade occurred for ChipLink Integrated-U on November 13, with a transaction volume of 2.6 million shares and a transaction value of 17.264 million yuan, indicating a discount of 1.48% compared to the closing price of the day [2] Group 1: Trading Activity - The block trade price was 6.64 yuan, while the closing price for ChipLink Integrated-U on the same day was 6.74 yuan, reflecting a 4.33% increase [2] - The trading volume for the day was 2.6 million shares, with a total transaction value of 17.264 million yuan [2] - The buyer was an institutional proprietary trading department, and the seller was China International Capital Corporation's Shanghai Xuhui District Huaihai Middle Road Securities Department [2] Group 2: Market Performance - The stock had a turnover rate of 4.92% and a total trading volume of 1.463 billion yuan for the day [2] - Net outflow of main funds for the day was 52.31 million yuan, with a cumulative increase of 7.32% over the past five days [2] - The latest margin financing balance for the stock was 1.255 billion yuan, showing a decrease of 39.999 million yuan, or 3.09%, over the past five days [2]

Group 1 - The core transaction involved 2.6 million shares of Xilinx Integrated, with a total transaction value of 17.264 million yuan, accounting for 1.17% of the total transaction volume on that day [1] - The transaction price was 6.64 yuan per share, which represents a discount of 1.48% compared to the market closing price of 6.74 yuan [1] - The transaction occurred on November 13, 2025, and was executed by institutional trading departments [2]

Core Viewpoint - The company has achieved mass production of its 8-inch SiC MOSFET production line, with a current capacity of 2,000 wafers per month, indicating a positive growth trajectory in demand for SiC products as customer validation continues [1] Group 1 - The 8-inch SiC MOSFET production line has reached a capacity of 2,000 wafers per month [1] - The company plans to expand production capacity in response to increasing market demand as more customers are onboarded and validated [1]

Core Viewpoint - The company reported a third-quarter revenue of 1.927 billion yuan, representing a year-on-year growth of 15.52% [1] - The company anticipates a full-year revenue of 8 billion to 8.3 billion yuan, which indicates a growth of 23% to 28% compared to the previous year [1] Group 1 - The company's revenue growth is driven by industry development, increasing demand, and ongoing domestic substitution [1] - The company is deepening cooperation and accelerating customer acquisition to maintain revenue expansion [1]

Core Viewpoint - The company has commenced mass production of its third-generation microphones used in high-end consumer electronics and new energy vehicles, while the fourth-generation dual-diaphragm microphone is currently in the design iteration phase [1] Group 1 - The company's high-performance microphones hold over 50% market share in a leading international smartphone terminal market [1]

Core Viewpoint - Company focuses on the continuous development of high-voltage, high-power, and high-density BCD process for analog IC chips, with accelerated customer adoption of high-voltage and integrated solution process platforms, currently covering over 70% of domestic design companies [1] Group 1 - Company is engaged in the development of analog IC chips [1] - Company emphasizes high-voltage, high-power, and high-density BCD process technology [1] - Customer adoption of high-voltage and integrated solution process platforms is accelerating [1] Group 2 - Company has achieved coverage of over 70% of domestic design companies [1]

Core Viewpoint - The company is actively expanding its presence in the AI server power supply market and has developed a comprehensive chip system OEM solution that covers over 50% of the AI server power supply value [1] Group 1: AI Server Power Supply - The company has laid out a system OEM solution for AI server power supplies, which includes first-level, second-level, and third-level power supplies [1] - The product offerings encompass power devices, driver ICs, magnetic components, MCUs, and current sensors [1] - The company is focusing on the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power supply systems for data centers [1] Group 2: Robotics Applications - The company has developed a miniaturized drive module for robotic dexterous hands, which has been adopted by leading domestic enterprises [1] - This solution aims to provide a one-stop chip system OEM solution for clients seeking lightweight and compact designs [1]

Core Viewpoint - The company, ChipLink Integrated, has established an efficient digital automotive-grade smart factory, providing one-stop system OEM services for various clients [1] Group 1: Company Overview - ChipLink Integrated's production lines are all automotive-grade, ensuring high standards for manufacturing [1] - The company has a significant market share in domestic MEMS sensors and LiDAR chips [1]