Financial Performance - The company's operating revenue for Q1 2023 was ¥51,647,363.64, representing a decrease of 22.17% compared to the same period last year[5] - The net profit attributable to shareholders was ¥7,299,075.90, down 69.63% year-on-year[5] - The net profit after deducting non-recurring gains and losses decreased by 78.69%, amounting to ¥4,838,062.06[5] - Basic earnings per share were ¥0.13, a decrease of 71.74% compared to the previous year[5] - Total operating revenue for Q1 2023 was CNY 51,647,363.64, a decrease of 22.2% compared to CNY 66,358,242.51 in Q1 2022[20] - Net profit for Q1 2023 was CNY 7,299,075.90, down 69.6% from CNY 24,035,123.75 in Q1 2022[21] - Basic earnings per share for Q1 2023 was CNY 0.13, compared to CNY 0.46 in Q1 2022[21] Cash Flow and Investments - The net cash flow from operating activities was ¥6,718,029.62, reflecting a decline of 8.19%[5] - The net cash inflow from operating activities was $6,718,029.62, a decrease from $7,317,131.86 in the previous year, reflecting a decline of approximately 8.2%[25] - The total cash outflow from operating activities was $49,445,952.90, down from $66,493,140.40, reflecting a decrease of approximately 25.7%[25] - The company made significant investments totaling $680,000,000.00, compared to $100,000,000.00 in the previous year, indicating a substantial increase in investment activities[25] Assets and Liabilities - Total assets increased by 288.99% to ¥1,399,138,114.26, primarily due to the funds raised from the IPO[6] - Total current assets as of March 31, 2023, are ¥1,290,833,058.64, compared to ¥258,526,754.79 at the end of 2022[14] - Total liabilities increased to CNY 45,395,852.84 in Q1 2023 from CNY 43,525,181.04 in Q1 2022[16] - Non-current assets totaled CNY 108,305,055.62 in Q1 2023, an increase from CNY 101,160,624.52 in Q1 2022[16] Shareholder Information - Total number of common shareholders at the end of the reporting period is 4,978[12] - The largest shareholder, FENG CHEN, holds 25,947,884 shares, representing 37.47% of total shares[12] - Shareholders' equity rose to CNY 1,353,742,261.42 in Q1 2023, compared to CNY 316,162,198.27 in Q1 2022[16] Research and Development - R&D investment totaled ¥13,919,424.78, accounting for 26.95% of operating revenue, an increase of 10.85 percentage points year-on-year[6] - Research and development expenses for Q1 2023 were CNY 13,919,424.78, up from CNY 10,686,444.83 in Q1 2022, indicating a focus on innovation[20] Non-Recurring Gains and Other Income - The company reported non-recurring gains of ¥2,461,013.84, which included government subsidies and other income[8] Future Guidance and Developments - The company has not disclosed any new product or technology developments in the current report[13] - There are no significant mergers or acquisitions reported during the quarter[13] - The company has not provided specific future guidance or market expansion strategies in the current report[13]

证券代码：688486 证券简称：龙迅股份 公告编号：2023-012 龙迅半导体（合肥）股份有限公司 关于召开 2022 年度暨 2023 年第一季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 年 4 月 20 日在上海证券交易所网站（www.sse.com.cn）披露了《龙迅股份 2023 年第一季度报告》。为便于广大投资者更加全面深入地了解公司经营业绩、发展 战略等情况，公司定于 2023 年 4 月 27 日（星期四）上午 10:00-11:00 在"价值 在线"（www.ir-online.cn）召开公司 2022 年度暨 2023 年第一季度业绩说明会， 与投资者进行沟通和交流，广泛听取投资者的意见和建议。 二、说明会召开的时间、地点和方式 会议召开时间：2023 年 4 月 27 日（星期四）上午 10:00-11:00 会议召开地点：价值在线（www.ir-online.cn） 会议召开方式：网络互动方式 三、参加人员 重要内容提示： 一、说明会类型 公司已于 2023 年 4 月 1 ...

Financial Performance - The company achieved operating revenue of CNY 240,937,598.29 in 2022, a year-on-year increase of 2.61%[21]. - The net profit attributable to shareholders was CNY 69,205,460.39, representing a decrease of 17.68% compared to the previous year[21]. - The net profit attributable to shareholders after deducting non-recurring gains and losses was CNY 56,770,204.57, down 20.08% year-on-year[21]. - The net cash flow from operating activities decreased by 59.33% to CNY 37,427,044.09, primarily due to increased procurement expenses[23]. - The company's total assets at the end of 2022 were CNY 359,687,379.31, an increase of 8.56% from the previous year[21]. - The net assets attributable to shareholders increased by 14.80% to CNY 316,162,198.27 at the end of 2022[21]. - The basic earnings per share decreased to CNY 1.33, down 17.90% from the previous year[22]. - The total revenue for the year reached 18,429.50 million RMB, with a net profit of 10,589.41 million RMB[86]. - The total revenue for the year 2022 reached 26,646.015 million, reflecting a significant growth compared to previous years[157]. Dividend Policy - The company plans to distribute a cash dividend of 3.00 RMB per 10 shares, totaling approximately 20.78 million RMB, which represents 30.02% of the net profit attributable to shareholders for 2022[5]. - The cash dividend distribution plan has been approved by the board and the supervisory board, pending approval from the annual general meeting[189]. - The proposed cash dividend is CNY 3.00 per 10 shares (including tax), totaling CNY 20,777,658.60 (including tax), which represents 30.02% of the net profit attributable to shareholders[188][192]. - The company has established a differentiated cash dividend policy based on its development stage, with a minimum cash dividend ratio of 80% for mature companies without major capital expenditures[186]. - The cash dividend amount will remain unchanged even if the total share capital changes before the dividend distribution date[188]. Research and Development - The R&D expenditure accounted for 22.99% of operating revenue, an increase of 1.76 percentage points compared to the previous year[22]. - The total R&D investment for the year was ¥55,401,406.48, representing an increase of 11.14% compared to the previous year[71]. - The company has developed several core technologies, including high-speed mixed-signal circuit technology and high-speed data transmission chip technology, both of which are at a leading level domestically[67]. - The company has achieved significant advancements in its core technologies, with high-speed interface transmission protocol processing technology and high-bandwidth digital content protection technology reaching international advanced levels[66]. - The company is actively developing new products to meet the growing demand in downstream markets such as security monitoring and AR/VR, focusing on high-definition video bridging and processing chips[35]. Market Position and Competition - The semiconductor industry is experiencing a structural demand shift, with strong demand in automotive and high-performance computing sectors, while consumer electronics face inventory pressure[33]. - The company ranks sixth in global sales of video bridge chips and eighth in high-speed signal transmission chips as of 2020, indicating strong market presence[92]. - The company has successfully entered the supply chains of renowned domestic and international companies, including Foxconn, Cisco, and Facebook[39]. - The company faces risks related to technology iteration and potential R&D failures, which could impact its market competitiveness[95]. - The company is exposed to foreign exchange risks due to overseas procurement and sales, which could lead to substantial exchange rate losses if currency fluctuations occur[105]. Governance and Compliance - The company has established a governance structure including a general meeting of shareholders, a board of directors, independent directors, a supervisory board, and senior management to ensure effective and stable operations[149]. - The company has developed various governance rules, including those for shareholder meetings, board meetings, and related party transactions, to enhance operational transparency and accountability[149]. - The company has not reported any significant differences in governance practices compared to regulations set by the China Securities Regulatory Commission[150]. - The company has implemented a robust internal control system to ensure compliance with laws and regulations, enhancing operational efficiency and risk management[194]. - The company has not faced any penalties from securities regulatory authorities in the past three years[168]. Risks and Challenges - The company faces high customer concentration risk, with the top five customers accounting for a significant portion of total revenue, which could negatively impact operations if any major customer changes their purchasing strategy[99]. - The company operates under a Fabless model, relying heavily on a few key suppliers for wafer production and packaging, leading to high supplier concentration risk[98]. - The company is at risk of intensified market competition as domestic chip design capabilities improve, potentially impacting its market position and performance[98]. - The company has a large inventory balance with a turnover rate lower than industry peers, posing a risk of significant inventory write-downs if market demand decreases[102]. - The company may face legal risks related to intellectual property, which could affect its competitive advantage and operational stability if infringements occur[107]. Employee and Management - The company has a total of 114 R&D personnel, accounting for 67.85% of total employees, with an average salary of 37.17 thousand[89]. - The company emphasizes employee training and development, implementing annual training plans to improve overall employee competence and support long-term growth[181]. - The total remuneration for core technical personnel at the end of the reporting period amounted to 847,600 RMB[167]. - The company has a competitive salary system and provides various benefits, including welfare holidays and training development, to enhance employee motivation and creativity[180]. - The company has a diverse board with a mix of independent and executive directors, ensuring balanced governance[156]. Future Outlook - Future guidance indicates a projected revenue increase of 35% for the upcoming fiscal year, driven by new product launches and market expansion strategies[157]. - The company aims to enhance product performance and maintain technological advancement by upgrading existing products and pursuing AEC-Q100 certification for automotive applications[35]. - The company plans to enhance new product promotion and optimize product and customer structure in response to market challenges[111]. - The company aims to establish a global R&D center and customer service network to support its internationalization strategy[142]. - The company is focusing on the automotive electronics sector, with several products already available for in-vehicle display control and video transmission chips under development[143].

股票简称：龙迅股份 股票代码：688486 龙迅半导体（合肥）股份有限公司 Lontium Semiconductor Corporation （安徽省合肥市经济技术开发区宿松路3963号智能装备科技园B3栋） 首次公开发行股票科创板上市公告书 保荐机构（主承销商） （北京市朝阳区建国门外大街 1 号国贸大厦 2 座 27 层及 28 层） 二〇二三年二月二十日 0 特别提示 龙迅半导体（合肥）股份有限公司（以下简称"龙迅股份"、"本公司"、"发行 人"或"公司"）股票将于 2023 年 2 月 21 日在上海证券交易所上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上市 初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 1 第一节 重要声明与提示 一、重要声明 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真实、准确、 完整，承诺上市公告书不存在虚假记载、误导性陈述或重大遗漏，并依法承担法律责任。 上海证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均不表明对 本公司的任何保证。 本 公 司 提 醒 广 大 投 资 者 认 真 阅 读 刊 载 于 上 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司具有研发投入 大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充 分了解科创板市场的投资风险及公司所披露的风险因素，审慎作出投资决定。 龙迅半导体（合肥）股份有限公司 Lontium Semiconductor Corporation （住所：安徽省合肥市经济技术开发区宿松路 3963 号智能装备科技园 B3 栋） 首次公开发行股票并在科创板上市 招股说明书 保荐机构（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 龙迅半导体（合肥）股份有限公司 招股说明书 发行人声明 中国证监会、上海证券交易所对本次发行所作的任何决定或意见均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的盈 利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反的声明均 属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发行人自 行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承担股票依法发 行后因发行人经营 ...

龙迅半导体（合肥）股份有限公司 首次公开发行股票并在科创板上市 发行结果公告 保荐机构（主承销商）：中国国际金融股份有限公司 龙迅半导体（合肥）股份有限公司（以下简称"龙迅股份"、"发行人"或"公 司"）首次公开发行人民币普通股（A 股）（以下简称"本次发行"）并在科创板 上市的申请已经上海证券交易所（以下简称"上交所"）科创板股票上市委员会 审议通过，并已经中国证券监督管理委员会同意注册（证监许可〔2023〕6 号）。 发行人的股票简称为"龙迅股份"，扩位简称为"龙迅股份"，股票代码为"688486"。 中国国际金融股份有限公司（以下简称"中金公司"或"保荐机构（主承销 商）"）担任本次发行的保荐机构（主承销商）。 本次发行采用向战略投资者定向配售（以下简称"战略配售"）、网下向符合 条件的投资者询价配售（以下简称"网下发行"）、网上向持有上海市场非限售 A 股股份和非限售存托凭证市值的社会公众投资者定价发行（以下简称"网上发行"） 相结合的方式进行。 发行人与保荐机构（主承销商）根据初步询价结果，综合发行人基本面、市 场情况、同行业上市公司估值水平、募集资金需求及承销风险等因素，协商确定 本次发行价格为 ...

龙迅半导体（合肥）股份有限公司 首次公开发行股票并在科创板上市 发行公告 保荐机构（主承销商）：中国国际金融股份有限公司 扫描二维码查阅公告全文 重要提示 龙迅半导体（合肥）股份有限公司（以下简称"龙迅股份"、"发行人"或"公 司"）根据中国证券监督管理委员会（以下简称"中国证监会"、"证监会"）颁布 的《关于在上海证券交易所设立科创板并试点注册制的实施意见》（证监会公告 〔2019〕2 号）、《证券发行与承销管理办法》（证监会令〔第 144 号〕）（以下简 称"《管理办法》"）、《科创板首次公开发行股票注册管理办法（试行）》（证监会 令〔第 174 号〕），上海证券交易所（以下简称"上交所"）颁布的《上海证券交 易所科创板股票发行与承销实施办法》（上证发〔2021〕76 号）（以下简称"《实 施办法》"）、《上海证券交易所科创板发行与承销规则适用指引第 1 号——首次公 开发行股票》（上证发〔2021〕77 号）（以下简称"《承销指引》"）、《上海市场首 次公开发行股票网上发行实施细则》（上证发〔2018〕40 号）（以下简称"《网上 发行实施细则》"）、《上海市场首次公开发行股票网下发行实施细则》（上证发 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司具有研发投入 大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充 分了解科创板市场的投资风险及公司所披露的风险因素，审慎作出投资决定。 龙迅半导体（合肥）股份有限公司 Lontium Semiconductor Corporation （住所：安徽省合肥市经济技术开发区宿松路 3963 号智能装备科技园 B3 栋） 首次公开发行股票并在科创板上市 招股意向书 保荐机构（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 龙迅半导体（合肥）股份有限公司 招股意向书 发行人声明 中国证监会、上海证券交易所对本次发行所作的任何决定或意见均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的盈 利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反的声明均 属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发行人自 行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承担股票依法发 行后因发行人经营 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司具有研发投入 大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充 分了解科创板市场的投资风险及公司所披露的风险因素，审慎作出投资决定。 龙迅半导体（合肥）股份有限公司 Lontium Semiconductor Corporation （住所：安徽省合肥市经济技术开发区宿松路 3963 号智能装备科技园 B3 栋） 首次公开发行股票并在科创板上市 招股说明书 （注册稿） （框架稿） 公司的发行申请尚需经上海证券交易所和中国证监会履行相应程序，本招股说明书（注册稿）不 具有据以发行股票的法律效力，仅供预先披露之用，投资者应当以正式公告的招股说明书全文作 为投资决定的依据。 保荐机构（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 龙迅半导体（合肥）股份有限公司 招股说明书（注册稿） 发行人声明 中国证监会、上海证券交易所对本次发行所作的任何决定或意见均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的盈 利能力、投资价值或者对投资者的收益作出 ...