| 证券代码：688711 | 证券简称：宏微科技 | 公告编号：2025-042 | | --- | --- | --- | | 转债代码：118040 | 债券简称：宏微转债 | | 江苏宏微科技股份有限公司 可转债转股结果暨股份变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 累计转股情况：截至 2025 年 6 月 30 日，"宏微转债"累计有人民币 22,000 元已转换为江苏宏微科技股份有限公司（以下简称"公司"）股票，转股数量为 710 股，占"宏微转债"转股前公司已发行股份总额的 0.00047%。 未转股可转债情况：截至 2025 年 6 月 30 日，"宏微转债"尚未转股的可 转债金额为 429,978,000 元，占"宏微转债"发行总量的 99.99488%。 本季度转股情况："宏微转债"自 2024 年 1 月 31 日开始转股。自 2025 年 4 月 1 日至 2025 年 6 月 30 日期间，"宏微转债"共有人民币 0 元已转换为公司 股票，转股数量为 0 股，占"宏 ...

Core Viewpoint - The chairman of Hongwei Technology, Zhao Shanqi, emphasizes that maintaining the original intention is the key to overcoming challenges in the power semiconductor industry, which is currently undergoing significant adjustments [2]. Group 1: Market Position and Strategy - Hongwei Technology aims to capture the high-end market, which still has 90% of its potential untapped in China, despite short-term price wars causing pain [2]. - The company has established a solid technological moat through years of deep cultivation in core areas such as chip design, manufacturing, packaging, and testing of power semiconductors like IGBT and FRD [3]. - In 2024, Hongwei Technology plans to double the production volume of its automotive modules and has already achieved stable supply of photovoltaic modules to the market [4]. Group 2: Technological Advancements - The company has made significant breakthroughs in key technologies, including the completion of 12-inch wafer mass production processes in collaboration with partners like Huahong Hongli [3]. - Hongwei Technology is focusing on the development of third-generation semiconductor materials, particularly SiC and GaN, which are reshaping the power semiconductor landscape [5][6]. - The company has successfully validated its first 1200V 40mohm SiC MOSFET chip and is accelerating the verification and delivery of its SiC automotive modules [6]. Group 3: Market Expansion and Partnerships - Hongwei Technology is expanding its presence in emerging markets such as data centers and servers, having established long-term partnerships with several international clients [4]. - The company is also increasing its efforts to penetrate high-end overseas markets, including partnerships with companies like Hitachi Energy and Siemens [7]. - The dual strategy of technological positioning and deep market cultivation is seen as the core strategy for seizing opportunities in the industry's recovery [7].

Core Points - The company maintains its credit rating at "A" with a stable outlook for both its main entity and the convertible bond "宏微转债" [1][2] - The credit rating was conducted by 中证鹏元, which assessed the company's operational status and industry conditions [2] Summary by Sections - **Previous Rating**: The previous credit rating for the company was "A" with a stable outlook, and the same rating applies to "宏微转债" [1] - **Current Rating**: The current credit rating remains "A" for the company and "宏微转债," with a stable outlook confirmed by 中证鹏元 [2] - **Rating Report Disclosure**: The credit rating report was disclosed on the Shanghai Stock Exchange website on the same day it was issued [2]

Core Viewpoint - The credit rating report indicates that Jiangsu Hongwei Technology Co., Ltd. has maintained its credit rating at AA, with a stable outlook, despite facing challenges such as increased competition and fluctuating demand in the photovoltaic and industrial control sectors [2][7]. Company Overview - Jiangsu Hongwei Technology primarily focuses on the design, research, production, and sales of power semiconductor chips, including IGBT and FRD, with applications in industrial control, new energy generation, and electric vehicles [10][19]. - As of March 2025, the company's major shareholder holds 17.75% of the shares, with no changes in the controlling structure [9]. Financial Performance - The company's total assets for 2024 are reported at 25.66 billion, with total liabilities at 10.24 billion, reflecting a slight increase from previous years [2][8]. - Revenue for 2024 is projected to decline by 11.52% year-on-year, with net profit turning from profit to loss due to market pressures [5][6]. Market Environment - The global power semiconductor market is expected to recover in the second half of 2024, driven by demand from electric vehicles and renewable energy sectors, despite a projected decline in sales of 8% for 2024 [11][12]. - The domestic market remains highly dependent on imports, with local manufacturers gradually closing the technology gap with international leaders [12][18]. Competitive Landscape - The company faces intense competition in the power semiconductor sector, particularly in the IGBT market, where it holds a relatively small market share [5][11]. - The concentration of customers remains high, with the top five customers accounting for 66.75% of sales, which poses risks if demand from these customers fluctuates [20][24]. Operational Challenges - The company is expanding its production capacity, but faces pressure to utilize this capacity effectively due to fluctuating downstream demand [6][21]. - The reliance on external chip suppliers for certain products increases operational risks, especially if supplier relationships deteriorate [24][25]. Future Outlook - The company is expected to continue its focus on technological advancements in power semiconductor products, particularly in SiC technology, which is gaining traction in high-voltage applications [17][21]. - The stable credit rating outlook suggests confidence in the company's ability to navigate current challenges and maintain operational sustainability [7][8].

Group 1 - The company Jiangsu Macmic Science & Technology Co., Ltd. issued convertible bonds totaling 4.3 million units at a price of 100 RMB per unit, raising a total of 430 million RMB, with a net amount of 423.2769 million RMB after deducting issuance costs [1][10][17] - The bonds have a maturity of six years, with an annual interest rate starting at 0.50% in the first year and increasing to 3.00% in the sixth year, with a redemption price of 115.00 RMB [1][10][11] - The initial conversion price for the bonds is set at 62.45 RMB per share, subject to adjustments based on various corporate actions [2][3][4] Group 2 - The company reported a net loss of 22.941 million RMB for the year 2024, a significant decrease compared to a profit of 114.209 million RMB in 2023, attributed to reduced customer procurement plans and pressure on product pricing [10][13] - Total assets increased by 4.52% to 2.601 billion RMB, while total liabilities rose by 13.20% to 1.524 billion RMB, resulting in a decrease in equity by 5.71% [11][12] - The company has no credit enhancement measures in place for the bonds, and the credit rating for the issuer and the bonds is rated A with a stable outlook [10][19] Group 3 - The funds raised from the bond issuance will be used for the development of automotive-grade power semiconductor discrete devices [10][14] - The company has established a special account for the management and use of the raised funds, ensuring compliance with regulatory requirements [10][19] - The company has maintained its obligations regarding interest payments, with the first interest payment made on July 25, 2024, at the agreed rate [10][11][12]

Company official website：www.macmicst.com Contact Number：0519-85163738 Email：xxpl@macmicst.com Address：No. 18, Huashan Road, Xinbei District, Changzhou City, Jiangsu Province Environmental, Social, and Governance (ESG) Report Macmic Science & Technology Co., Ltd. Stock Code :688711 2024 Environmental, Social, and Governance (ESG) Report CONTENTS | Sustainable Development Governance | 15 | 01 | | --- | --- | --- | | Governance Framework for Sustainable Development | 15 | | | Communications with Stakeholders ...

债券简称：宏微转债 债券代码：118040 股票简称：宏微科技 股票代码：688711 江苏宏微科技股份有限公司 可转换公司债券受托管理事务报告 （2024年度） 债券受托管理人 中信证券股份有限公司 （广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座） 二〇二五年六月 1 声明 中信证券股份有限公司（以下简称"中信证券"）编制本报告的内容及信息均来源 于发行人对外公布的《江苏宏微科技股份有限公司 2024 年年度报告》等相关公开信息 披露文件、江苏宏微科技股份有限公司（以下简称"宏微科技""发行人"或"公司"） 提供的证明文件以及第三方中介机构出具的专业意见。 本报告不构成对投资者进行或不进行某项行为的推荐意见，投资者应对相关事宜做 出独立判断，而不应将本报告中的任何内容据以作为中信证券所作的承诺或声明。 2 第一节 可转换公司债券概况 一、发行人基本信息 | 中文名称 | 江苏宏微科技股份有限公司 | | --- | --- | | 中文简称 | 宏微科技 | | 外文名称 | Macmic Science & Technology Co., Ltd. | | 外文简称 | MACMIC | | ...

| 证券代码：688711 | 证券简称：宏微科技 | 公告编号：2025-040 | | --- | --- | --- | | 转债代码：118040 | 债券简称：宏微转债 | | 江苏宏微科技股份有限公司 关于"宏微转债"跟踪信用评级结果的公告 本次信用评级报告已于同日在上海证券交易所网站（www.sse.com.cn）披露。 1 特此公告。 ● 本次债券评级：公司主体信用等级为"A"，评级展望为"稳定"，"宏微 转债"的信用等级为"A"。 根据《上市公司证券发行注册管理办法》《上海证券交易所科创板股票上市 规则》等有关规定，江苏宏微科技股份有限公司（以下简称"公司"）委托信用 评级机构中证鹏元资信评估股份有限公司（以下简称"中证鹏元"）对公司向不 特定对象发行的可转换公司债券（以下简称"宏微转债"）进行了跟踪信用评级。 公司前次主体信用等级为"A"，评级展望为"稳定"，"宏微转债"的信用 等级为"A"，评级机构为中证鹏元，评级时间为 2024 年 6 月 13 日。 评级机构中证鹏元在对公司经营状况、行业相关情况进行综合分析与评估的 基础上，于 2025 年 6 月 13 日出具了《2023 年江苏 ...

2023 年江苏宏微科技股份有限公 司向不特定对象发行可转换公司 债券 2025 年跟踪评级报告 中鹏信评【2025】跟踪第【169】号 01 信用评级报告声明 除因本次评级事项本评级机构与评级对象构成委托关系外，本评级机构及评级从业人员与评级对象不存 在任何足以影响评级行为独立、客观、公正的关联关系。 本评级机构与评级从业人员已履行尽职调查义务，有充分理由保证所出具的评级报告遵循了真实、客观、 公正原则，但不对评级对象及其相关方提供或已正式对外公布信息的合法性、真实性、准确性和完整性 作任何保证。 本评级机构依据内部信用评级标准和工作程序对评级结果作出独立判断，不受任何组织或个人的影响。 本评级报告观点仅为本评级机构对评级对象信用状况的个体意见，不作为购买、出售、持有任何证券的 建议。本评级机构不对任何机构或个人因使用本评级报告及评级结果而导致的任何损失负责。 本次评级结果自本评级报告所注明日期起生效，有效期为被评证券的存续期。同时，本评级机构已对受 评对象的跟踪评级事项做出了明确安排，并有权在被评证券存续期间变更信用评级。本评级机构提醒报 告使用者应及时登陆本公司网站关注被评证券信用评级的变化情况。 本评 ...

江苏宏微科技股份有限公司监事会 （以下简称《公司法》） 《中华人民共和国证券法》 （以下简称《证券 关于公司 2025 年限制性股票激励计划首次授予激励对象名 单（首次授予日）的核查意见 江苏宏微科技股份有限公司（以下简称"公司"）监事会依据《中华人民共 和国公司法》 （4）具有《公司法》规定的不得担任公司董事、高级管理人员情形的； （5）法律法规规定不得参与上市公司股权激励的； 法》）《上市公司股权激励管理办法》（以下简称《管理办法》）《上海证券交易所 科创板股票上市规则》（以下简称《上市规则》）《科创板上市公司自律监管指南 第 4 号——股权激励信息披露》等相关法律、法规及规范性文件和《江苏宏微科 技股份有限公司章程》（以下简称《公司章程》）的有关规定对公司 2025 年限制 性股票激励计划（以下简称"本次激励计划"）首次授予激励对象名单（首次授 予日）进行审核，发表核查意见如下： 定的不得成为激励对象的情形： （1）最近 12 个月内被证券交易所认定为不适当人选； （2）最近 12 个月内被中国证监会及其派出机构认定为不适当人选； （3）最近 12 个月内因重大违法违规行为被中国证监会及其派出机构行政 ...