格隆汇9月11日丨温州宏丰（维权）(300283.SZ)公布，控股股东、实际控制人陈晓先生计划自本公告披 露之日起十五个交易日后的三个月内（2025年10月13日至2026年1月12日，窗口期不减持），通过集中 竞价和大宗交易相结合的方式减持不超过1,250万股公司股份，即不超过公司总股本的2.52%。其中，通 过集中竞价交易方式减持不超过490万股（占公司总股本的0.99%），通过大宗交易方式减持不超过760 万股（占公司总股本的1.53%）。 ...

证券代码：300283 证券简称：温州宏丰 编号：2025-103 温州宏丰电工合金股份有限公司 关于公司股东减持股份的预披露公告 公司控股股东、实际控制人陈晓先生保证向本公司提供的信息内容真实、 准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一 致。 特别提示：持有温州宏丰电工合金股份有限公司（以下简称"公司"）股份 168,636,292 股（占公司总股本的 33.93%）的控股股东、实际控制人陈晓先生计 划自本公告披露之日起十五个交易日后的三个月内（2025 年 10 月 13 日至 2026 年 1 月 12 日，窗口期不减持），通过集中竞价和大宗交易相结合的方式减持不 超过 1,250 万股公司股份，即不超过公司总股本的 2.52%。其中，通过集中竞价 交易方式减持不超过 490 万股（占公司总股本的 0.99%），通过大宗交易方式减 持不超过 760 万股（占公司总股本的 1.53%）。 公司于近日收到控股股东、实际控制人陈晓先生出具的《关于减持公司股份 计划的告知函》，现将有关情况公告如下： 一、减持主体的基本情况 1、减持主体：公 ...

Group 1 - The company, Wenzhou Hongfeng (300283), has stated that it is currently not producing nano-porous materials [1]

Group 1 - The company has participated in the World Youth Scientist Summit since its inception in 2019 [1] - The company is currently coordinating its participation in the 2025 World Youth Scientist Summit [1] - The company actively explores collaboration and communication opportunities related to its business development at various industry events [1]

Group 1 - The company, Wenzhou Hongfeng (300283.SZ), has stated on its interactive platform that it is currently not producing nanoporous materials [1]

Group 1 - The core viewpoint of the article is that Wenzhou Hongfeng (300283.SZ) has confirmed that its produced copper foil materials can be applied in solid-state batteries [1]

Group 1 - The company, Wenzhou Hongfeng (300283.SZ), has conducted research on silicon carbide projects and has developed one invention patent [1] - Currently, the company has not initiated mass production or application of the silicon carbide project [1]

Group 1 - The company has achieved mass production of self-developed specialized thermal materials, specifically metal matrix composites, which are crucial for electronic packaging due to their excellent thermal properties, high thermal conductivity, and low expansion [1] - The demand for related materials is expected to grow rapidly due to the increasing infrastructure needs driven by AI computing power, particularly in the optical module industry [1] - The company has established a diversified product system that includes electrical contact materials, integrated electrical contact components, hard alloy materials, lithium battery copper foil, and other businesses, positioning itself as a leading manufacturer in the domestic market [1] Group 2 - The company's electrical contact materials and functional composite materials are widely used across various sectors, including aerospace, medical materials, 5G, liquid cooling technology, industrial electrical appliances, consumer electronics, household appliances, automotive engineering, automation equipment, wind and solar power generation, and data centers [2] - The self-developed specialized thermal materials are now in mass production and are extensively applied in consumer electronics and 5G smart terminal devices [2] - The company emphasizes material science and has established collaborations with global electrical equipment manufacturers like Schneider and Siemens to enhance product development and quality standards, thereby strengthening customer loyalty and brand influence [2] Group 3 - The company's subsidiary, Zhejiang Hongfeng Semiconductor New Materials Co., Ltd., focuses on the research, development, manufacturing, and sales of etching lead frame materials, which are essential for integrated circuit chip packaging [3] - Lead frames serve as the core carrier for integrated circuit chips, playing a critical role in connecting internal and external circuits during the chip packaging process [3] - The company is actively advancing product certification and market development, aiming to contribute to the domestic chip industry in the future [3]

Key Points - The company issued 3,212,600 convertible bonds with a net face value of RMB 31,505.54 million on March 15, 2022, approved by the China Securities Regulatory Commission [1] - The bonds were listed on the Shenzhen Stock Exchange on April 8, 2022, under the name "宏丰转债" and code "123141" [1] - The initial conversion price was set at RMB 6.92 per share, which was adjusted to RMB 6.88 on June 29, 2022, following a cash dividend distribution [2] - The conversion price was further adjusted to RMB 5.39 on November 4, 2022, and then to RMB 5.37 on June 28, 2023, due to subsequent dividend distributions [3][4] - The conversion price was adjusted again to RMB 5.35 on June 18, 2024, as part of the 2023 dividend distribution [5][6] - The bonds have a conditional redemption clause, allowing the company to redeem them if the stock price exceeds 130% of the conversion price for a specified period [6][7] - The company plans to redeem all outstanding bonds on August 29, 2025, at a price of RMB 100.92 per bond, including accrued interest [8] - As of August 28, 2025, there were 7,998 bonds remaining unconverted, with a total redemption payment of RMB 807,158.16 [9] - The redemption will not significantly impact the company's financial status or cash flow, and the cumulative conversion has increased the total shares by 59,892,992 [9] - Following the redemption, the bonds will be delisted from the Shenzhen Stock Exchange on September 8, 2025 [9][10] - The total share capital will increase from 437,085,230 to 496,978,222 shares after the conversion [10]

Key Points Summary Core Viewpoint The company, Wenzhou Hongfeng Electric Alloy Co., Ltd., has issued convertible bonds known as "Hongfeng Convertible Bonds" with specific terms regarding issuance, conversion, and redemption, which are crucial for investors to understand the financial implications and future actions related to these bonds. Group 1: Convertible Bond Issuance - The company issued 3.2126 million convertible bonds on March 15, 2022, with a net face value of RMB 31,505.54 million per bond [1] - The bonds were listed for trading on the Shenzhen Stock Exchange starting April 8, 2022, under the name "Hongfeng Convertible Bonds" and code "123141" [1] Group 2: Conversion Terms - The conversion period for the bonds started on March 21, 2022, and will last until the maturity date [2] - The initial conversion price was set at RMB 6.92 per share, which was later adjusted to RMB 6.88 per share on June 29, 2022, following a cash dividend distribution [2] - Further adjustments were made to the conversion price, reducing it to RMB 5.39 per share on November 4, 2022, and subsequently to RMB 5.37 per share on June 28, 2023, and RMB 5.35 per share on June 18, 2024, due to additional dividend distributions [3][4][6] Group 3: Redemption Terms - The bonds have conditional redemption clauses, allowing the company to redeem the bonds if the stock price exceeds 130% of the conversion price for a specified period [7] - The redemption price is set at RMB 100.92 per bond, which includes accrued interest calculated based on a 2.0% annual interest rate [8] - The total redemption amount for 7,998 bonds is RMB 807,158.16, and the bonds will be delisted from the Shenzhen Stock Exchange on September 8, 2025, after full redemption [9]