证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-003 安徽铜冠铜箔集团股份有限公司 第二届董事会第十二次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假记载、误导 性陈述或重大遗漏。 一、董事会会议召开情况 安徽铜冠铜箔集团股份有限公司（以下简称"公司"）第二届董事会第十二 次会议于 2025 年 3 月 3 日以现场结合通讯方式召开。会议通知已于本次董事会 召开 5 日前发出。本次会议由董事长甘国庆先生召集并主持，会议应出席董事 9 名，实际出席董事 9 名，公司部分高管及监事列席了会议。会议的召集和召开符 合《中华人民共和国公司法》和《公司章程》的有关规定。 二、董事会会议审议情况 经与会董事认真审议，通过如下议案： 1、审议通过了《关于 2025 年度日常关联交易预计的议案》 根据 2024 年公司及子公司与关联人之间的日常关联交易情况，结合公司 2025 年业务发展和日常经营需要，公司将继续与控股股东铜陵有色金属集团股 份有限公司（以下简称"铜陵有色"）及其部分控股子公司，铜陵有色金属集团 控股有限公司(以下简称"有色控股")及所属部分企业开展交易，涉 ...

一、获取政府补助的基本情况 安徽铜冠铜箔集团股份有限公司（以下简称"公司"）于近日获得政府补助 资金 353.80 万元，占公司最近一个会计年度经审计的归属于上市公司股东的净 利润的 20.57%。该项政府补助与公司日常经营活动相关，不具备可持续性。 二、补助的类型及其对上市公司的影响 证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-002 安徽铜冠铜箔集团股份有限公司 关于获得政府补助的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 根据《企业会计准则第 16 号—政府补助》的规定，与资产相关的政府补助， 是指企业取得的、用于购建或以其他方式形成长期资产的政府补助；与收益相关 的政府补助，是指除与资产相关的政府补助之外的政府补助。公司本次披露的政 府补助属于与收益相关的政府补助。 2、补助的确认和计量 根据《企业会计准则第 16 号——政府补助》等相关规定，公司将上述收到 的与企业日常经营活动有关的政府补助计入"其他收益"，具体会计处理以会计 师事务所审计确认的结果为准。 3、补助对公司的影响 补助凭证。 特此公告。 1、补助的类型 上 ...

国泰君安证券股份有限公司 关于安徽铜冠铜箔集团股份有限公司 2024 年持续督导培训情况报告 深圳证券交易所： 国泰君安证券股份有限公司（以下简称"国泰君安"、"保荐机构"）作为安 徽铜冠铜箔集团股份有限公司（以下简称"铜冠铜箔"、"公司"）首次公开发 行股票并在创业板上市持续督导的保荐机构，依据《深圳证券交易所上市公司自 律监管指引第 13 号——保荐业务》《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》等国家有关法律、法规和规范性文件的要求和 行业公认的业务标准、道德规范，本着审慎和勤勉尽责的原则，于 2025 年 1 月 17 日对铜冠铜箔董事、监事、高级管理人员、部分中层以上管理人员及控股股东 代表等相关人员进行了培训，现将此次培训情况报告如下： 一、培训对象 在本次培训中，铜冠铜箔接受培训的人员包括：公司董事、监事、高级管理 人员、部分中层以上管理人员及控股股东代表等。 二、培训方式 2025 年 1 月 17 日，国泰君安持续督导小组通过线下和线上视频相结合的形 式对铜冠铜箔的相关人员进行了培训，现场培训地点为公司子公司铜陵铜冠电子 铜箔有限公司 3 楼会议室。 三、培训 ...

国泰君安证券股份有限公司 关于安徽铜冠铜箔集团股份有限公司 2024 年持续督导工作现场检查报告 | 保荐机构名称：国泰君安证券股份有限公司 被保荐公司简称：铜冠铜箔 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 保荐代表人姓名：朱哲磊 联系电话：021- | | | 38677994 | | | | | | 保荐代表人姓名：张翼 联系电话：021- | | | 38674773 | | | | | | 现场检查人员姓名：张翼、朱哲磊、邓超 | | | | | | | | | 年 现场检查对应期间：2024 | | | | | | | | | 现场检查时间：2025 年 1 月 16 日-2025 年 1 月 17 日 | | | | | | | | | 一、现场检查事项 | | | | | | | 现场检查意见 | | （一）公司治理 | | | | 否 | | 不适用 | | | 息披露文件，对三会召集程序、出席会议人员的资格、召集人资格、表决程序等事项进行核查， | | | | | | | | | 访谈管理层等。 ...

证券时报e公司讯，铜冠铜箔(301217)1月21日晚间发布业绩预告，预计2024年归母净利亏损1.46亿元— 1.8亿元，上年同期盈利1720.02万元。 报告期内，受行业市场竞争加剧等因素的影响，铜箔加工费收入大幅下降，产品价格持续承压，导致毛 利下降，影响公司利润。 ...

Financial Performance - The company expects a net loss of between 146 million and 180 million CNY for the fiscal year 2024, compared to a profit of 17.2 million CNY in the same period last year [3]. - The net profit after deducting non-recurring gains and losses is projected to be a loss of between 171 million and 205 million CNY, compared to a loss of 26.25 million CNY in the previous year [3]. Production and Sales - The company produced approximately 55,000 tons of various copper foil products during the reporting period [5]. Market Conditions - The main reasons for the performance decline include intensified market competition leading to a significant drop in processing fee income and continuous pressure on product prices, resulting in decreased gross profit [5]. Asset Management - The company has recognized impairment provisions for assets showing signs of impairment according to accounting standards due to the decline in processing fee income [6]. - Increased sales scale and accounts receivable have led to the recognition of credit impairment losses on receivables [6]. Future Reporting - The specific data for the 2024 annual performance will be disclosed in detail in the company's annual report [7].

Summary of Conference Call on Copper Foil Company Industry Overview - The conference call primarily discusses the copper foil industry, specifically focusing on PCB (Printed Circuit Board) and lithium battery products. Key Points and Arguments - **PCB Orders and Production**: In January 2024, PCB orders remain saturated, with plans to continue production during the Spring Festival to meet demand. Processing fees have seen a slight increase, contributing to overall gross margin improvement. Expected profit from February orders will be confirmed by late January [2][3][4]. - **Processing Fee Increases**: Processing fees for lithium battery products have risen due to successful bidding, while PCB processing fees have increased by approximately 1,000 to 2,000 yuan [4]. - **APPLP Product Development**: The company has transitioned from relying on Japanese, Korean, and Taiwanese technologies to developing its own APPLP products, with expected monthly shipments reaching 100 tons in the first half of 2024. These products are aimed at high-demand applications such as base station servers and data centers [5][6]. - **Production Challenges**: The production of APPLP products faces challenges including low roughness, high-temperature stability, and corrosion resistance, with a validation cycle of about two years [6]. - **SIP Product Supply**: The company is currently supplying first and second-generation SIP products primarily for server applications, with third-generation products in small batches and fourth-generation products expected to be certified by 2025 for advanced applications like millimeter-wave radar [7]. - **High-Frequency Copper Foil Projections**: High-frequency and high-speed copper foil is projected to account for 20%-25% of the company's total PCB copper foil in 2024, with expectations to exceed 30% by 2025 [8]. - **HVLP Market Position**: The global HVLP (High-Voltage Low-Power) copper foil market is dominated by Japanese companies, with the company being a significant domestic supplier. Major clients include well-known Taiwanese and domestic PCB manufacturers [9]. - **Direct Engagement with PCB Manufacturers**: The company plans to directly engage with some PCB manufacturers in 2025 to reduce the time taken to connect with end customers, moving away from reliance on CCL (Copper Clad Laminate) manufacturers [13]. - **2025 Shipment Goals**: The company aims to ship between 60,000 to 65,500 tons in 2025, with PCB copper foil expected to account for 35,000 tons, while the remainder will be lithium battery products [14]. - **Production Line Flexibility**: The company is prepared to switch production lines between lithium battery and PCB products based on market conditions, with a quick conversion process due to similar core operations [15]. Additional Important Information - **Application Areas for HS Copper Foil**: HS (High-Speed) copper foil is primarily used in base stations and server applications [17]. - **Roughness Comparison**: RTF (Roughness Transfer Function) surface roughness is similar to low-grade HVLP, but the two have different processes and application scenarios [16]. This summary encapsulates the key insights from the conference call, highlighting the company's strategic direction, market positioning, and product development initiatives within the copper foil industry.

Summary of Conference Call Notes Company and Industry Involved - The discussion primarily revolves around the PCB (Printed Circuit Board) industry, specifically focusing on high-frequency and high-speed copper foil products such as RTF (Reverse Transfer Foil) and HVLP (High Voltage Low Profile) [1][2][3][10]. Core Points and Arguments 1. **Production Capacity and Orders** - The company is currently operating at full capacity, with a significant number of orders, particularly for the 70 billion unit orders, which are expected to continue into 2024 [1]. - There is an expectation of a slight loss in 2024, but a return to profitability is anticipated in 2025 due to increased demand and production efficiency [1]. 2. **Profit Margins and Cost Increases** - The overall profit margins are expected to improve despite a slight increase in processing fees, which are still manageable [2]. - The company has noted that the processing fees for HVLP products are significantly higher due to the limited number of manufacturers capable of producing them [10]. 3. **Product Development and Market Position** - The HVLP product line is positioned as a leader in the domestic market, with a strong focus on high-performance applications such as data centers and radar systems [3][4]. - The company has been collaborating with downstream manufacturers to develop products that meet specific technical requirements, enhancing their market position [9][12]. 4. **Technical Challenges** - The production of HVLP products faces several technical challenges, including high-temperature stability, signal interference resistance, and overall production complexity [4][5]. - The company has developed a robust process to address these challenges, ensuring high-quality output [4]. 5. **Market Dynamics and Competition** - The HVLP market is currently dominated by Japanese companies, with significant competition from domestic players [8]. - The company is focusing on expanding its customer base, particularly among well-known Taiwanese and mainland manufacturers [8]. 6. **Future Strategies** - The company plans to enhance its engagement with PCB manufacturers to better align with market demands, especially in the context of AI and high-performance computing [11][12]. - There is a consideration to shift some production capacity from lithium electronic copper foil to PCB copper foil, depending on market conditions [13][14]. Other Important but Possibly Overlooked Content - The company is actively involved in R&D collaborations with upstream suppliers to ensure that their products meet the evolving needs of high-end applications [9]. - The processing costs for RTF and HVLP products vary significantly, with RTF being more widely produced and utilized in various applications, including servers [15]. - The company is aware of the competitive landscape and is taking steps to maintain its market share while exploring new opportunities in high-end product segments [13][14].

Summary of Conference Call on Tongguan Copper Foil Company Overview - **Company Name**: Tongguan Copper Foil - **Parent Company**: Tongling Nonferrous Metals Group - **Business Focus**: Primarily engaged in electronic copper foil production, with a total capacity of 80,000 tons, including 45,000 tons for lithium battery copper foil and over 3,000 tons for PCB copper foil [2][12][30]. Production and Operational Insights - **2024 Production Volume**: Expected to be around 55,000 tons, aligning with capacity, with several projects ramping up in the second half of the year [1][14]. - **2025 Production Forecast**: Anticipated production to exceed 60,000 tons, driven by order demand, with PCB orders performing well due to national subsidies and a recovery in consumer electronics [3][14]. - **Copper Foil Types**: - **High-Speed Copper Foil**: Expected to see significant growth, with its share in PCB copper foil rising from over 20% in 2023 to over 30% in 2025 [6][17]. - **PCB Copper Foil**: The most significant volume comes from HT high-temperature high-extension copper foil, primarily serving the consumer electronics sector [5][25]. Customer and Market Dynamics - **PCB Customer Base**: Established relationships with domestic companies like Shengyi and Taiwanese firms such as Taisun Materials, with new engagements with notable PCB manufacturers [2][18]. - **Lithium Battery Customer Base**: Major clients include BYD and Guoxuan, with ongoing efforts to develop new customers, including those in solid-state battery sectors [2][33]. - **Market Demand Drivers**: The rapid development of 5G, high base station servers, and radar data centers is driving demand for high-frequency and high-speed copper foil [6][16]. Financial Performance and Profitability - **Profitability Outlook**: PCB copper foil has consistently maintained a gross profit margin, with processing fees expected to rise in 2025, contributing positively to net profit [7][26]. - **Processing Fees**: Average processing fee for PCB copper foil is around 15,000 RMB, with a slight increase expected in 2025 [26][54]. - **Lithium Battery Copper Foil**: Currently facing challenges with profitability due to high processing costs, but new projects are expected to improve cost efficiency [42][43]. Production Capacity and Adjustments - **Actual Capacity**: The effective capacity for lithium battery copper foil is approximately 25,000 to 30,000 tons, lower than the designed capacity of 45,000 tons [12][32]. - **Flexibility in Production**: The company can quickly switch between lithium battery and PCB copper foil production, with a switching cycle of about one month [29][30]. Competitive Advantages - **Raw Material Sourcing**: Proximity to Tongling Nonferrous Metals ensures quality copper supply and minimizes transportation costs, enhancing cost control [47]. - **Market Position**: Established since 2007, the company has built strong relationships with customers and has a competitive edge in the PCB copper foil market due to its production capabilities and customer engagement [49]. Future Outlook - **Growth Projections**: Anticipated growth in high-frequency and high-speed copper foil is expected to be around 50% in 2025, driven by increasing demand and domestic substitution efforts [51]. - **Investment in Capacity**: Plans for future capacity expansion and strategic adjustments based on market conditions are in place, focusing on balancing production between lithium battery and PCB copper foil [46]. Additional Insights - **Customer Engagement**: The company is actively engaging with several domestic PCB manufacturers to expand its customer base [18]. - **Price Stability**: The pricing for HVLP copper foil remains stable, with a favorable outlook for profitability due to limited competition in the domestic market [21][40]. This summary encapsulates the key points discussed during the conference call, providing a comprehensive overview of Tongguan Copper Foil's current status and future prospects.

安徽铜冠铜箔集团股份有限公司 会计师事务所选聘制度 二〇二四年十二月 第一章 总 则 第一条 为规范安徽铜冠铜箔集团股份有限公司（以下 简称"公司"）选聘（含续聘、改聘，下同）会计师事务所 行为，切实维护股东利益，提升审计工作质量，根据《中华 人民共和国公司法》《国有企业、上市公司选聘会计师事务所 管理办法》《上市公司治理准则》《深圳证券交易所股票上市 规则》等相关法律法规、规范性文件及《公司章程》的有 关规定，结合公司实际情况，制定本制度。 第二条 本制度所称选聘会计师事务所，是指公司根据 相关法律法规要求及本制度规定，聘任会计师事务所对公 司财务会计报告及内部控制发表审计意见、出具审计报告 的行为。公司聘任会计师事务所从事除财务会计报告及内 部控制审计之外的其他法定审计业务的，按照公司其他相 关制度组织实施。 第三条 公司选聘会计师事务所应当由董事会审计委 员会（以下简称"审计委员会"）审议同意后，提交董事会 审议，并由股东会决定。公司不得在股东会审议批准前聘请 会计师事务所开展审计业务。 第二章 会计师事务所执业质量要求 第四条 公司选聘的会计师事务所应当具备下列条件： （一）具有独立的法人资格，具备国 ...