Group 1 - The company Copper Crown Copper Foil (SZ 301217) announced that its 17th meeting of the second board of directors was held on October 23, 2025, to review the proposal for the "2025 Q3 Report" [1] - For the year 2024, the company's revenue composition is 100.0% from the manufacturing sector [1] - As of the report date, the market capitalization of Copper Crown Copper Foil is 25.1 billion yuan [1]

本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假记载、误导 性陈述或重大遗漏。 证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-057 安徽铜冠铜箔集团股份有限公司 第二届董事会第十七次会议决议公告 三、备查文件 1.第二届董事会第十七次会议决议。 一、董事会会议召开情况 安徽铜冠铜箔集团股份有限公司（以下简称"公司"）第二届董事会第十七 次会议于 2025 年 10 月 23 日以现场结合通讯方式召开。会议通知已于本次董事 会召开 10 日前发出。本次会议由董事长甘国庆先生召集并主持，会议应出席董 事 9 名，实际出席董事 9 名，公司部分高管列席了会议。会议的召集和召开符合 《中华人民共和国公司法》和《公司章程》的有关规定。 二、董事会会议审议情况 经与会董事认真审议，通过如下议案： 1、审议通过了《关于公司<2025 年第三季度报告>的议案》 公司严格按照《证券法》《深圳证券交易所创业板股票上市规则》等有关规 定，完成了 2025 年第三季度报告的编制工作。公司董事会认为：公司 2025 年第 三季度报告真实、准确、完整地反映了公司 2025 年 1-9 月份的财务状况 ...

安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-058 安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 重要内容提示： 1.董事会、监事会及董事、监事、高级管理人员保证季度报告的真实、准确、完整，不存在虚假记载、误导性陈述或重大 遗漏，并承担个别和连带的法律责任。 2.公司负责人、主管会计工作负责人及会计机构负责人(会计主管人员)声明：保证季度报告中财务信息的真实、准确、完 整。 3.第三季度财务会计报告是否经过审计 □是 否 1 安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 一、主要财务数据 （一） 主要会计数据和财务指标 单位：元 公司是否需追溯调整或重述以前年度会计数据 □是 否 | | 本报告期 | 本报告期比上年同期 | 年初至报告期末 | 年初至报告期末比上 | | --- | --- | --- | --- | --- | | | | 增减 | | 年同期增减 | | 营业收入（元） | 1,737,477,96 ...

Core Viewpoint - The company announced a cash dividend distribution plan for the first half of 2025, indicating a commitment to returning value to shareholders [1] Summary by Sections Dividend Distribution - The company will distribute a cash dividend of 0.200000 RMB per 10 shares to all shareholders, based on a total share capital of 829,015,544 shares, excluding 2,999,900 repurchased shares, resulting in a base of 826,015,644 shares [1] - The record date for the dividend is set for October 27, 2025, and the ex-dividend date is October 28, 2025 [1]

证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-056 安徽铜冠铜箔集团股份有限公司 2025年中期权益分派实施公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 特别提示： 1、截至本公告披露日，安徽铜冠铜箔集团股份有限公司（以下简称"公司"） 的回购专用证券账户股份数量 2,999,900 股，不参与本次权益分派。公司 2025 年中期权益分派方案为：以公司现有总股本剔除已回购股份 2,999,900 股后的 826,015,644 股为基数，向全体股东每 10 股派发现金红利 0.2 元（含税），预 计派发现金分红总额人民币 16,520,312.88 元（含税）不转增，不送股，剩余未 分配利润结转以后年度。 2、本次权益分派实施后计算除权除息价格时，按总股本（含回购股份）折 算的每 10 股现金股利（含税）=现金分红总额/总股本×10 股=16,520,312.88 元/829,015,544 股×10 股=0.199276 元（保留六位小数，最后一位直接截取， 不四舍五入）。本次权益分派实施后的除权除息参考价格=（除权除息日的前一 ...

Core Viewpoint - The collaboration between Guoxuan High-Tech and Tongguan Copper Foil is significant, with Guoxuan High-Tech being a major customer for Tongguan Copper Foil, particularly in the lithium battery sector [2] Group 1 - Guoxuan High-Tech is the second-largest shareholder of Tongguan Copper Foil [2] - Tongguan Copper Foil supplies lithium battery copper foil to Guoxuan High-Tech [2] - A stable cooperative relationship has been established between the two companies in the battery field [2]

Group 1 - The core viewpoint of the news highlights the recent trading performance and financial metrics of Copper Crown Copper Foil, indicating a strong market presence and growth potential [1][2][3] Group 2 - On October 9, Copper Crown Copper Foil's stock rose by 1.63%, with a trading volume of 951 million yuan. The financing buy-in amount for the day was 91.14 million yuan, while the net financing buy-in was 3.74 million yuan, indicating active trading [1] - As of October 9, the total margin balance for Copper Crown Copper Foil was 342 million yuan, accounting for 1.30% of its market capitalization, which is above the 80th percentile of the past year [1] - The company reported a significant increase in revenue for the first half of 2025, achieving 2.997 billion yuan, a year-on-year growth of 44.80%, and a net profit of 34.95 million yuan, up 159.47% year-on-year [2] - The company has distributed a total of 257 million yuan in dividends since its A-share listing, with 133 million yuan distributed over the past three years [3] - As of June 30, 2025, the number of shareholders increased to 62,600, with an average of 13,253 circulating shares per person, reflecting a slight decrease [2][3]

Investment Rating - The report maintains a "Recommended" investment rating for the mechanical equipment industry [3] Core Viewpoints - The mechanical equipment industry is entering the "AI Era," which will create significant investment opportunities centered around AI infrastructure and AI empowerment [4][15] - The report highlights the historical performance of the mechanical equipment sector during previous five-year plans, indicating that each era has distinct characteristics that influence investment opportunities [6][10] Summary by Sections 1. Review of Five-Year Plans - The mechanical equipment industry has shown varying performance across the past four five-year plans, with significant growth during the Eleventh Five-Year Plan (642% increase) and a decline during the Thirteenth Five-Year Plan (-21% decrease) [6][7] - The industry ranked second among 28 sectors during the Eleventh Five-Year Plan and seventh during the Fourteenth Five-Year Plan, reflecting its evolving significance [7][8] 2. AI Infrastructure: Driving Demand for PCB Equipment, AIDC, Liquid Cooling, and Semiconductor Equipment - The AI computing revolution is expected to drive structural growth in PCB demand, with a projected annual growth rate of 16.3% for AI server-related HDI from 2023 to 2028 [19] - The report anticipates that the global PCB market will reach $73.565 billion in 2024, with a 5.8% year-on-year increase, and $94.661 billion by 2029 [19] - AI servers significantly increase the unit value of PCBs, with a single AI server PCB valued at $500-$800, compared to $200-$300 for traditional servers [20] - The report identifies challenges in capacity expansion, including long delivery times for high-end equipment and complex process validations [21] 3. AI Empowerment: The Rise of Embodied Intelligent Robots - The report discusses the practical applications of embodied intelligent robots in industrial logistics, elderly care, and specialized environments, emphasizing their potential to improve efficiency and safety [4][15] - It highlights the importance of technical feasibility and cost-effectiveness in the deployment of these robots [4] 4. Investment Recommendations - The report suggests focusing on AI infrastructure and AI empowerment as key investment directions for the mechanical equipment industry during the Fifteenth Five-Year Plan [4][15] - Specific recommendations include AI PCB equipment, AIDC power generation equipment, liquid cooling solutions, and semiconductor equipment [4][15] 5. Related Listed Companies - The report provides insights into key companies in the PCB equipment sector, such as Dazhu CNC, Chipbond Technology, and Dongwei Technology, highlighting their market performance and technological advancements [40][41]

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

安徽承义律师事务所 关于 关于安徽铜冠铜箔集团股份有限公司 召开 2025 年第三次临时股东会的法律意见书 (2025)承义法字第 00226 号 致：安徽铜冠铜箔集团股份有限公司 安徽铜冠铜箔集团股份有限公司 召开 2025 年第三次临时股东会的 法律意见书 安徽承义律师事务所 中国.合肥市政务区怀宁路 200 号栢悦中心 5 楼 邮编: 230022 电话（Tel）:（86-551）65609815 传真（Fax）:（86-551）65608051 网址（Website）:www.chengyi-law.com 电子信箱（E-mail）：chengyilawyer@163.com 安徽承义律师事务所 根据《中华人民共和国公司法》《中华人民共和国证券法》《上市公司股东 会规则》等法律法规和其他规范性文件的要求，安徽承义律师事务所接受安徽铜 冠铜箔集团股份有限公司（以下简称"公司"）的委托，指派束晓俊、方娟律师 （以下简称"本律师"）就公司召开 2025 年第三次临时股东会（以下简称"本 次股东会"）出具法律意见书。 一、本次股东会召集人资格和召集、召开的程序 经核查，本次股东会是由公司第二届董事会召集，公司 ...