DuPont de Nemours, Inc. (DD) has unveiled a comprehensive portfolio of cutting-edge circuit materials and solutions at the 2025 International Electronic Circuits Exhibition in Shanghai, designed to push the boundaries of fine-line technology, signal integrity and thermal management.As artificial intelligence (AI), machine learning and 5G technologies progress, the growing need for high-performance devices is driving innovations in packaging substrates and advanced PCBs. DuPont is applying its decades of exp ...

SHANGHAI, March 24, 2025 /PRNewswire/ -- DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025. With a diverse portfolio of advanced circuit materials and solutions designed to push the limits of fine-line technology, signal integrity, and thermal management, DuPont will be exhibiting in Booth #8A31 at National Exhibition and Convention Center (NECC) from March 24-26. "As artificial intelligence (AI), machine learning, ...

Core Viewpoint - The article discusses the challenges and innovations in EUV lithography, particularly focusing on the balance of resolution, line width roughness, and sensitivity in photoresist materials, highlighting the need for advancements in photoresist technology to meet the demands of high NA EUV exposure [1][5][14]. Group 1: EUV Lithography Challenges - Balancing resolution, sensitivity, and line width roughness in high NA EUV lithography is increasingly difficult, as the final step between the mask and the patterned wafer is unpredictable [1][5]. - The RLS triangle (Resolution, Line width roughness, Sensitivity) defines the key parameters for evaluating lithography processes, where improving one often sacrifices the others [3][4]. - The sensitivity of photoresists limits the throughput of EUV exposure systems, significantly impacting overall process costs, with potential savings of up to $1 million per year per scanner by reducing exposure dose [3][4]. Group 2: Innovations in Photoresist Materials - Research is ongoing to enhance chemical amplification resists (CAR) by exploring alternative PAG molecules to improve EUV absorption rates, although initial findings indicate that higher electron affinity may not enhance sensitivity [4][8]. - Metal oxide photoresists are gaining interest due to their robustness and excellent etch selectivity, although they present challenges in solubility for positive photoresist applications [8][9]. - Dry photoresist processes, such as those developed by Lam Research, allow real-time adjustments of process chemistry, potentially optimizing the lithography process [11][12]. Group 3: Alternative Approaches - New concepts like multi-trigger photoresists aim to combine the advantages of chemical amplification and metal oxide resists, allowing for selective cross-linking based on exposure conditions [13][14]. - The development of next-generation photoresists that utilize acid to "unzip" polymer chains offers a promising alternative, enabling better optimization of solubility in developers [14].

Core Viewpoint - DuPont is on track to complete the spin-off of its Electronics business by November 1, 2025, with Jon Kemp appointed as CEO of the new independent company, which aims to be a leader in materials and technology solutions for the semiconductor and electronics industries [1][8]. Company Leadership - Jon Kemp, with over two decades at DuPont and experience leading the $6 billion Electronics & Industrial segment, will lead the new Electronics company [3]. - Michael Stubblefield, current President & CEO of Avantor, will serve as Chairman of the board for the new Electronics company, bringing extensive global management experience [4][2]. Strategic Focus - The new Electronics company will focus on driving innovations in advanced computing and connectivity, positioning itself as a vital partner for customers' growth strategies [2]. - DuPont plans to hire a Chief Financial Officer from outside the company, emphasizing the need for proven performance in publicly traded companies [2]. Spin-off Details - The spin-off will not require a shareholder vote and is subject to customary conditions, including final board approval and regulatory approvals [8]. - The intended separation is part of DuPont's strategy to create a pure-play public company that can drive shareholder value [2].

Core Viewpoint - DuPont de Nemours has experienced a decline of approximately 7.7% in share price over the past month, underperforming the S&P 500, raising questions about the potential for a continued negative trend or a breakout before the next earnings release [1]. Estimates Movement - Estimates for DuPont de Nemours have trended downward over the past month, indicating a negative shift in expectations [2]. VGM Scores - The company currently holds a Growth Score of B, a Momentum Score of D, and a Value Score of C, resulting in an aggregate VGM Score of C, which places it in the middle 20% for the investment strategy [3]. Outlook - The downward trend in estimates suggests a negative outlook for the stock, with a Zacks Rank of 3 (Hold), indicating expectations for an in-line return in the coming months [4].

Core Insights - DuPont's Pyralux® ML Series of double-sided metal-clad laminates has won the 2025 NPI Award in the Laminates category, recognizing its innovation in the electronics assembly industry [1][4]. Product Overview - Launched in April 2024, Pyralux® ML laminates are designed for flexible and rigid-flex printed circuit boards (PCBs), focusing on optimal thermal management for high-reliability markets such as aerospace, defense, electric vehicles (EVs), and AI-related networking [2][3]. - The laminates utilize metal alloy technology, including copper-nickel (CuNi) and Kapton® all-polyimide dielectric technology, which enhances resistivity, reduces thermal conductivity, and provides necessary thermoelectric properties [3]. Evaluation Criteria - The NPI Award evaluations considered various factors such as creativity, innovation, compatibility with existing technology, cost-effectiveness, design, reliability, flexibility, performance, user-friendliness, and speed/throughput [3]. Company Recognition - The recognition of Pyralux® ML laminates highlights the product's role in optimizing thermal management, which is crucial for industries with high-performance and high-reliability requirements [4].

Core Insights - DuPont Water Solutions has launched WAVE PRO, an advanced online modeling tool for ultrafiltration water treatment applications, enhancing the design process for drinking water, industrial utility water, wastewater, and seawater desalination [1][2] Group 1: Product Features - WAVE PRO is the next generation of the Water Application Value Engine (WAVE), designed to guide water professionals through the ultrafiltration design process with high accuracy [2] - The tool allows users to simulate specific process conditions and evaluate various scenarios to determine optimal configurations, incorporating project-specific economics [3] - WAVE PRO is web-based, enabling secure access from any device and facilitating collaboration among teams, with automatic updates for new features and technologies [4] Group 2: Industry Impact - Ultrafiltration is crucial for water purification across various sectors, effectively excluding particles as small as 0.02 to 0.05 microns, including bacteria and viruses, thus meeting stringent water-quality standards [5] - The use of ultrafiltration supports sustainability goals by eliminating the need for pretreatment chemicals and reducing operating costs when used as a pretreatment for reverse osmosis [6] - DuPont's technologies are currently purifying over 50 million gallons of water per minute in 112 countries, addressing challenges in water treatment for municipalities and industrial users [7]

Group 1: Company Developments - DuPont de Nemours, Inc. will showcase its advanced circuit materials at Intelligent Asia Thailand 2025, highlighting solutions for fine-line technology, signal integrity, and thermal control [1] - The company is positioned to meet the increasing demand for device downsizing and high computational performance through its diverse product portfolio and strategic partnerships [1][3] - DuPont's product offerings include high-performance materials for flexible, stiff-flex, and rigid PCBs, addressing industry challenges with advanced reliability and signal integrity [3][4] Group 2: Market Trends - Innovations in printed circuit boards (PCBs) are accelerating, driven by the need for high-density interconnects in sectors like automotive and consumer electronics [2] - The automotive industry's shift towards electrification and automation, along with the expansion of 5G infrastructure, necessitates improvements in multilayer boards and high-density interconnects [2] Group 3: Financial Outlook - DuPont anticipates full-year 2025 net sales between $12,800 million and $12,900 million, with operating EBITDA projected at $3,325 million to $3,375 million [5] - For Q1 2025, the company forecasts net sales of approximately $3,025 million and adjusted earnings of around 95 cents per share [5] Group 4: Stock Performance - DuPont's shares have increased by 11.7% over the past year, contrasting with an 11.8% decline in the industry [4]

Core Insights - DuPont is showcasing advancements in circuit materials at Intelligent Asia Thailand 2025, focusing on solutions for fine-line technology, signal integrity, and thermal management [1] - The electronics industry is undergoing significant transformation due to artificial intelligence, which is accelerating innovation in printed circuit boards (PCBs) essential for intelligent devices [2] - DuPont's product portfolio includes state-of-the-art materials for flexible, rigid-flex, and rigid PCBs, addressing industry challenges such as fine pitch and advanced reliability requirements [3] Product Offerings - DuPont™ Copper Gleam™ PPR-II/III is a new electroplating solution designed for advanced multilayer boards and AI server applications, offering superior throwing power for through-hole plating [4] - DuPont™ Circuposit™ 6800W and Copper Gleam™ PS-100 are designed for enhanced reliability in multi-stack micro-via designs, providing a more efficient single process solution [5] - DuPont™ Riston® DI9500M & DI8600 and FD3000M dry film photoresist are ideal for applications in electrified automotive and AI server stations, improving overall yield for manufacturers [6] - DuPont™ Microfill™ EVF-III acid copper is a new via-filling technology for fine-line HDI applications, particularly effective for automotive applications [7] - DuPont™ Pyralux® AP flexible copper-clad laminate offers exceptional reliability and reduced transmission loss, fulfilling high-speed and high-frequency signal transmission requirements [8] Industry Trends - The automotive industry is transitioning towards electrification and automation, requiring advancements in multilayer boards and high-density interconnects [2] - The expansion of 5G infrastructure and server technologies is driving the need for technology advancements in the electronics sector [2]

Core Insights - DuPont's Kevlar® EXO™ has been recognized as a finalist for the Edison Awards in the Critical Safety Materials Advancement category, highlighting its innovative approach to ballistic protection [1][3]. Company Overview - DuPont is a global leader in technology-based materials and solutions, focusing on transforming industries and everyday life through diverse scientific expertise [7]. - The company operates in key markets including electronics, transportation, construction, water, healthcare, and worker safety [7]. Product Innovation - Kevlar® EXO™ offers enhanced ballistic protection while maintaining mobility and comfort for military and law enforcement personnel, addressing real-world challenges in protective equipment [2][3]. - The material is designed to be strong, comfortable, flexible, and lightweight, making it suitable for demanding environments such as law enforcement, military operations, and space exploration [3]. Recognition and Awards - The Edison Awards recognize excellence in new product and service development, with this year's finalists selected from thousands of submissions based on concept, value, and impact [4][8]. - The winners of the Edison Awards will be announced at a gala event on April 3, 2025, in Fort Myers, Florida [4].