| 股票代码：688208 | 股票简称：道通科技 | 公告编号：2025-053 | | --- | --- | --- | | 转债代码：118013 | 转债简称：道通转债 | | 深圳市道通科技股份有限公司 关于不提前赎回"道通转债"的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 自 2025 年 6 月 9 日至 2025 年 7 月 1 日，深圳市道通科技股份有限公司（以 下简称"公司"）股票满足在连续三十个交易日中有十五个交易日的收盘价不低于"道 通转债"当期转股价格（22.55 元/股）的 130%（含 130%，即 29.32 元/股），已触 发"道通转债"的有条件赎回条款。 公司于 2025 年 7 月 1 日召开第四届董事会第二十三次会议，审议通过了《关 于不提前赎回"道通转债"的议案》，董事会决定本次不行使"道通转债"的提前赎 回权利，不提前赎回"道通转债"。 经上交所"自律监管决定书〔2022〕201 号"文同意，公司 128,000.00 万元可 转换公司债券于 2022 ...

中信证券股份有限公司 关于深圳市道通科技股份有限公司 1 （公告编号：2023-055）。 鉴于公司实施2023年年度权益分派，"道通转债"的转股价格由34.71元/股 调整为34.32元/股，调整后的转股价格自2024年5月20日起生效。具体内容详见公 司于2024年5月13日在上海证券交易所网站（www.sse.com.cn）披露的《关于实施 2023年年度权益分派调整"道通转债"转股价格的公告》（公告编号：2024-047）。 鉴于公司实施2024年半年度权益分派，"道通转债"的转股价格由34.32元/ 股调整为33.93元/股，调整后的转股价格自2024年9月9日起生效。具体内容详见 公司于2024年9月3日在上海证券交易所网站（www.sse.com.cn）披露的《关于实 施2024年半年度权益分派调整"道通转债"转股价格的公告》（公告编号：2024- 071）。 不提前赎回"道通转债"的核查意见 中信证券股份有限公司（以下简称"中信证券"或"保荐人"）作为深圳市 道通科技股份有限公司（以下简称"道通科技"或"公司"）2022 年科创板向不 特定对象发行可转换公司债券的保荐人，根据《中华人民共和国公 ...

一、董事会会议召开情况 | 股票代码：688208 | 股票简称：道通科技 | 公告编号：2025-052 | | --- | --- | --- | | 转债代码：118013 | 转债简称：道通转债 | | 深圳市道通科技股份有限公司 第四届董事会第二十三次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 与会董事就各项议案进行了审议，并表决通过以下事项： 1、《关于不提前赎回"道通转债"的议案》 自 2025 年 6 月 9 日至 2025 年 7 月 1 日，公司股票满足在连续三十个交易 日中有十五个交易日的收盘价不低于"道通转债"当期转股价格（22.55 元/股） 的 130%（含 130%，即 29.32 元/股），已触发"道通转债"的有条件赎回条款。 基于对公司未来发展前景与内在价值的信心，结合当前公司经营情况、市场 环境等因素，为维护广大投资者利益，董事会决定不行使"道通转债"的提前赎 回权利，且在未来六个月内（即 2025 年 7 月 2 日至 2026 年 1 月 1 日期间）， 若"道通转 ...

| 股票代码：688208 | 股票简称：道通科技 | 公告编号：2025-049 | | --- | --- | --- | | 转债代码：118013 | 转债简称：道通转债 | | 深圳市道通科技股份有限公司 关于可转换公司债券 2025 年付息的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 深圳市道通科技股份有限公司（以下简称"公司"或"道通科技"）于2022年 7月8日向不特定对象发行可转换公司债券（以下简称"道通转债"或"可转债"） 将于2025年7月8日开始支付自2024年7月8日至2025年7月7日期间的利息。根据 《深圳市道通科技股份有限公司向不特定对象发行可转换公司债券募集说明书》 （以下简称"《募集说明书》"）有关条款的规定，现将有关事项公告如下： 一、可转债发行上市概况 （一）可转债发行情况 经中国证券监督管理委员会"证监许可〔2022〕852号"文核准，公司向不特 定对象发行可转换公司债券1,280.00万张，每张面值100元，发行总额128,000.00 万元。本次发行的 ...

Core Points - The Shanghai Stock Exchange Science and Technology Innovation Board High-end Equipment Manufacturing Index (Sci-Tech High-end Equipment, 000687) opened lower but rose, increasing by 1.82% to 1039.86 points with a trading volume of 12.131 billion yuan [1] - Over the past month, the index has risen by 1.78%, but it has decreased by 5.77% over the past three months, and it has increased by 7.06% year-to-date [1] - The index consists of 50 large-cap stocks from sectors such as aerospace equipment, satellite applications, rail transportation equipment, marine engineering equipment, and intelligent manufacturing equipment, reflecting the overall performance of representative high-end equipment manufacturing companies listed on the Sci-Tech Board [1] Index Composition - The top ten weighted stocks in the index are: - Zhongwei Company (10.02%) - Ninebot Company (9.06%) - Stone Technology (8.8%) - Bochao Electronics (4.11%) - Daotong Technology (3.86%) - Green Harmonics (3.71%) - China Tonghao (3.61%) - Bolite (3.48%) - Times Electric (3.0%) - Zhong UAV (2.73%) [1] Market Sector Breakdown - The index is fully composed of stocks listed on the Shanghai Stock Exchange, with the following sector allocations: - Industrial: 70.37% - Consumer Discretionary: 17.86% - Information Technology: 11.10% - Healthcare: 0.68% [2] Index Adjustment Mechanism - The index samples are adjusted quarterly, with adjustments occurring on the next trading day after the second Friday of March, June, September, and December [2] - Weight factors are generally fixed until the next scheduled adjustment, with special circumstances allowing for temporary adjustments [2]

其 他 报 告 2025年06月30日 晨会纪要 | 国内市场 | | 涨跌幅（%） | | | --- | --- | --- | --- | | 指数 | 收盘 | 1日 | 上周 | | 上证综合指数 | 3424 | -0.70 | -0.51 | | 深证成份指数 | 10379 | 0.34 | -1.16 | | 沪深300指数 | 3922 | -0.61 | -0.45 | | 创业板指数 | 2124 | 0.47 | -1.66 | | 上证国债指数 | 226 | 0.03 | 0.21 | | 上证基金指数 | 6931 | -0.03 | -0.11 | | | | 资料来源:同花顺iFinD | | | 海外市场 | | 涨跌幅（%） | | | --- | --- | --- | --- | | 指数 | 收盘 | 1日 | 上周 | | 中国香港恒生指数 | 24284 | -0.17 | -1.52 | | 中国香港国企指数 | 8762 | -0.47 | -1.48 | | 中国台湾加权指数 | 22580 | 0.39 | -0.12 | | 道琼斯指数 | 4381 ...

债券简称： 道通转债 债券代码： 118013 深圳市道通科技股份有限公司 可转换公司债券受托管理事务报告 （2024 年度） 发行人 深圳市道通科技股份有限公司 （广东省深圳市南山区西丽街道松坪山社区高新北六道 36 号彩虹科技大楼二层） 债券受托管理人 中信证券股份有限公司 （广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座） 2025 年 6 月 重要声明 中信证券股份有限公司（以下简称"中信证券"或"受托管理人"）编制本 报告的内容及信息均来源于发行人对外公布的《深圳市道通科技股份有限公司 2024年年度报告》等相关公开信息披露文件、深圳市道通科技股份有限公司 （以下简称"道通科技"、"发行人"或"公司"）提供的证明文件以及第三方中 介机构出具的专业意见。 本报告不构成对投资者进行或不进行某项行为的推荐意见，投资者应对相 关事宜做出独立判断，而不应将本报告中的任何内容据以作为中信证券所作的 承诺或声明。 2 | 目 录 | | --- | | 重要声明 | ···································································· ...

Group 1 - The core focus is on the active development of the domestic AI industry chain, with the Huabao AI ETF (589520) showing a price increase of over 1.4% at one point, currently up 0.47%, indicating a positive market sentiment [1] - Key stocks in the AI sector include Stone Technology, which rose over 4%, and Lexin Technology, which increased by more than 2%, along with Daotong Technology, Lingyun Light, and Fudan Microelectronics, all rising over 1% [1] - The People's Bank of China and six other departments issued guidelines to enhance financial support for consumption, aiming to stimulate high-quality consumption supply and meet diverse financing needs [3] Group 2 - The semiconductor industry is expected to maintain high growth, with May's integrated circuit production and export volumes increasing, and Q2 retail sales of communication equipment showing sustained growth [3] - The emergence of the Harmony Smart Body Framework (HMAF) enhances the native support capabilities of Harmony OS, promoting the integration of AI capabilities into operating systems and driving upgrades in edge AI applications [3] - Investment opportunities are recommended in the Huawei terminal industry chain due to the anticipated growth in AI applications and hardware upgrades [3] Group 3 - Guojin Securities suggests focusing on sectors with confirmed growth in the first half of the year, including AI-PCB, computing power hardware, and the semiconductor industry [4] - The Huabao AI ETF (589520) is positioned to benefit from the acceleration of AI integration in edge chips and software, with a balanced index covering application software, terminal applications, terminal chips, and cloud chips [5] - The electronic ETF (515260) tracks the electronic 50 index, heavily investing in the semiconductor and consumer electronics sectors, covering popular industries such as AI chips, automotive electronics, 5G, and cloud computing [6]

| 股票代码：688208 | 股票简称：道通科技 | 公告编号：2025-048 | | --- | --- | --- | | 转债代码：118013 | 转债简称：道通转债 | | 深圳市道通科技股份有限公司 关于"道通转债"预计满足赎回条件的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 鉴于公司实施 2023 年年度权益分派，"道通转债"的转股价格由 34.71 元/股调 整为 34.32 元/股，调整后的转股价格自 2024 年 5 月 20 日起生效。具体内容详见公 司于 2024 年 5 月 13 日在上海证券交易所网站（www.sse.com.cn）披露的《关于实 施 2023 年年度权益分派调整"道通转债"转股价格的公告》（公告编号：2024-047）。 鉴于公司实施 2024 年半年度权益分派，"道通转债"的转股价格由 34.32 元/股 调整为 33.93 元/股，调整后的转股价格自 2024 年 9 月 9 日起生效。具体内容详见 公司于 2024 年 9 月 3 日在 ...

Core Viewpoint - Huawei is advancing its embodied intelligence strategy through the launch of the CloudRobo platform, focusing on software and hardware ecosystem development while partnering with various companies to enhance industrial applications and market reach [1][26][27]. Group 1: CloudRobo Platform and Technology - The CloudRobo platform is based on the Pangu large model, featuring multi-modal capabilities and a "cloud-network-end" collaborative architecture, which includes the "robotic three-piece set" [2]. - The "embodied brain" (planning model) can perform complex task planning with over 10 steps, ensuring smooth production processes in manufacturing environments [2]. - The "embodied small brain" (execution model) specializes in high-precision control, achieving over 90% success rates in complex tasks [2]. - The "digital universe workshop" generates 80% of training data through simulated environments, requiring only 20% real data for validation [2]. Group 2: Strategic Partnerships - Huawei Cloud emphasizes a "be integrated" strategy, focusing on providing cloud-based intelligence while leaving the physical robot development to partners, aiming to integrate intelligence into various industries [3]. - Efort Robotics showcased a voice-interactive sorting workstation, developed in collaboration with Huawei Cloud, enhancing task execution efficiency [5][6]. - Daotong Technology presented a smart inspection solution that integrates drones and ground robots, achieving nearly 90% accuracy in oilfield inspections [8]. - Yijiahe Group introduced a humanoid robot for healthcare, leveraging Huawei Cloud's AI capabilities for enhanced service delivery [10][11]. - XCMG highlighted its autonomous platform robot, which can operate in various intelligent modes for complex environments [13]. Group 3: Industry Applications and Innovations - TuoStar is developing humanoid robots for logistics, integrating Huawei's AI technology to improve operational efficiency [15]. - Leju Robotics launched the first 5G-A embodied intelligent robot, demonstrating capabilities in high-concurrency scenarios [17]. - Qianxun Intelligent showcased its humanoid robot Moz1, which utilizes a multi-modal model for real-time task execution [19]. - Youai Zhihui presented solutions for semiconductor manufacturing, achieving significant efficiency improvements in logistics and operations [22]. - Xinghai Map demonstrated a teleoperation platform that enhances data collection and training for embodied intelligence applications [24]. Conclusion - The launch of the CloudRobo platform marks a significant step in Huawei's embodied intelligence strategy, focusing on collaboration with partners to drive the robotics industry towards larger-scale implementation [26].