Investment Rating - The report indicates a positive outlook for the semiconductor and AI-related sectors, with strong revenue growth expected in 2026 [1][5]. Core Insights - The AI sector is experiencing robust demand, particularly in AI servers, HPC, and cloud data centers, contributing to a significant revenue increase for TSMC, which reported NT$401.26 billion in January 2026, a year-on-year growth of 36.8% [1][5]. - The report highlights that advanced packaging capacity remains tight, which is a critical factor supporting revenue growth [5]. - Companies like Xinxia and JY Electronics are also seeing substantial revenue increases due to the demand for AI-related applications and advanced testing requirements [1][8]. Summary by Sections AI Sector - TSMC's revenue in January 2026 reached NT$401.26 billion, driven by strong demand for AI servers and HPC, maintaining high utilization rates in advanced processes [1][5]. - Xinxia's revenue reached NT$9 billion, a year-on-year increase of 28.5%, reflecting the growing importance of server management chips in AI server architectures [7][8]. Advanced Packaging and Testing - JY Electronics reported NT$33.7 billion in revenue, a 41% year-on-year increase, driven by the complexity of next-generation GPU testing and increased demand for AI ASICs [8]. - Chroma ATE's revenue reached NT$38.3 billion, a 72.1% increase, supported by rising power testing demands and advanced packaging capacity expansion [8]. Semiconductor Manufacturing - UMC, VIS, and PSMC reported revenue increases of 5%, 18%, and 26% respectively, with PSMC achieving a 39-month revenue high due to rising memory wafer prices [15]. - Nanya Technology, Winbond, and Macronix reported significant revenue growth of 608%, 94%, and 51% respectively, driven by structural supply-demand imbalances in the memory market [16]. EMS Sector - Foxconn, Wistron, and Quanta reported revenues of NT$730.04 billion, NT$2,283.7 billion, and NT$2,308.3 billion respectively, with year-on-year growth rates of 36%, 152%, and 62% [12]. - Wistron's chairman emphasized that AI-related orders in 2026 will significantly exceed those of the previous year, indicating a strong outlook for the EMS sector [12]. Passive Components - YAGEO reported NT$130.3 billion in revenue, a 27% year-on-year increase, driven by strong demand from AI-related applications and pre-holiday stocking in Greater China [19].

Investment Rating - The report maintains a positive outlook on the semiconductor industry, particularly in the AI and HPC sectors, indicating a strong demand that supports revenue growth [2][5]. Core Insights - TSMC reported a record revenue of NT$401.26 billion in January 2026, a year-on-year increase of 36.8%, driven by strong demand in AI servers, HPC, and cloud data centers [2][5]. - The advanced packaging capacity remains tight, which is a key factor supporting revenue growth [5]. - The report highlights that the AI sector continues to drive demand, with companies like Xinxia and JY Electronics also reporting significant revenue increases [2][5][20]. Summary by Sections AI Sector - TSMC's revenue growth is attributed to the sustained demand for AI servers and advanced process technologies, maintaining high utilization rates [5]. - Xinxia's revenue reached NT$900 million in January 2026, up 28.5% year-on-year, reflecting the strong demand for server management chips [7]. - JY Electronics reported a revenue of NT$3.37 billion, a 41% increase year-on-year, driven by the rising complexity and demand for AI-related testing [8]. Mature Process - UMC, World Advanced, and PSMC reported revenues of NT$20.86 billion, NT$4.01 billion, and NT$4.62 billion respectively, with year-on-year growth rates of 5%, 18%, and 26% [16]. - PSMC's revenue reached a 39-month high, driven by rising prices in memory wafer foundry and increased demand for logic foundry [16]. Storage - Nanya Technology, Winbond, and Macronix reported revenues of NT$15.31 billion, NT$11.78 billion, and NT$3.02 billion respectively, with year-on-year growth rates of 608%, 94%, and 51% [17]. - Nanya indicated that various DRAM products may remain tight due to limited new capacity, particularly DDR4 and LPDDR4 [17]. End-Side Chips - MediaTek's revenue was NT$46.98 billion, down 8% year-on-year, with expectations of a significant decline in mobile terminal demand due to rising costs [18]. - The Smart Edge business is expected to grow, with data center ASIC revenue projected to exceed USD 1 billion in 2026 [20]. Passive Components - Yageo reported a revenue of NT$13.03 billion, a 27% year-on-year increase, driven by strong demand from AI-related applications [20].

Core Insights - Bitdeer Technologies Group reported significant revenue growth in Q4 2025, with a year-over-year increase of 225.8% to $224.8 million, driven by self-mining and AI infrastructure initiatives [4][7] - Despite the revenue surge, gross profit fell to $10.6 million, reflecting a gross margin of 4.7%, down from 24.1% in the previous quarter, primarily due to lower Bitcoin prices, increased electricity costs, and a change in depreciation methodology [3][7] Financial Performance - The company posted an adjusted EBITDA of $31.2 million for Q4 2025, down from $39.6 million in Q3 2025 [3] - Self-mining revenue reached $168.6 million, significantly up from $41.5 million in Q4 2024 and $130.9 million in Q3 2025, attributed to a higher average operating hash rate [8] - Bitdeer reported a net operating cash outflow of $599.5 million, driven by supply chain costs, electricity expenses, and corporate overhead [5][17] Operational Developments - Bitdeer is expanding its self-mining capacity, exiting 2025 with over 55 EH/s and reaching over 63 EH/s in January 2026 [6][9] - The company commenced mass production of the SEALMINER A3 series and plans to begin production of SEAL04-1 in Q1 2026, with a focus on improving energy efficiency [10][12] - Bitdeer is prioritizing colocation services for AI and HPC at larger sites, with over 1.66 GW of capacity online and a total pipeline of 3 GW [12][14] Strategic Focus - The firm is pivoting towards AI/HPC colocation and GPU-as-a-Service, with plans to expand its cloud platform in Malaysia and the U.S. [5][14] - Management emphasized that significant U.S. GPU deployments will be backed by committed revenue from enterprise contracts, avoiding speculative capacity [15] - The company plans to switch to GAAP reporting in Q1 2026, moving away from IFRS [20]

Q4 '25 Su p p le m e n ta l In ve s tor Pre s e n ta tion A le a d in g te c h c om p a n y for th e b loc kc h a in & a c c e le ra te d c om p u te c om m u n itie s Fe b ru a ry 20 26 NASDAQ: BTDR Dis c la im e r & Forwa rd - Lookin g Sta te m e n ts This presentation and the accompanying oral presentation have been prepared by Bitdeer Technologies Group (the "Company") solely for information purpose, and has not been independently verified. By viewing or accessing the information contained in this prese ...

Group 1 - Samsung Electronics has begun mass production of its latest HBM4 chips and has shipped commercial products to customers [1] - HBM4 is a sixth-generation high-bandwidth memory solution designed for AI and high-performance computing (HPC) applications [1] Group 2 - The announcement was made on February 12, 2026, indicating a significant milestone for Samsung in the semiconductor industry [1] - The development of HBM4 chips is expected to enhance performance in AI and HPC sectors, reflecting the growing demand for advanced memory solutions [1]

Financial Data and Key Metrics Changes - Q4 2025 revenue was $1.89 billion, down 5% sequentially but up 16% year-on-year, with full year revenue growing 6% to $6.7 billion [12][14] - EPS for Q4 was $0.69, with net income of $172 million, and full year net income was $374 million, resulting in EPS of $1.50 [14][15] - Gross profit for Q4 was $315 million, with a gross margin of 16.7%, while full year gross profit was $939 million, with a gross margin of 14% [13][15] Business Line Data and Key Metrics Changes - Communications revenue grew 28% year-on-year in Q4, and 1% for the full year, driven by strong demand in iOS [12][14] - Computing revenue increased 6% year-on-year in Q4 and 16% for the full year, supported by AI-related PC devices [12][14] - Automotive and industrial revenue rose 25% year-on-year in Q4 and 8% for the full year, driven by advanced automotive content [12][14] - Consumer revenue declined 10% year-on-year in Q4 but grew 9% for the full year [12][14] Market Data and Key Metrics Changes - The computing segment is expected to grow over 20% in 2026, with strong contributions from AI and HPC [10][11] - Communications, computing, and automotive markets are projected to see strong year-on-year growth in Q1 2026 [16] - The automotive market is expected to remain flat in unit sales, but increased semiconductor content per vehicle is anticipated [40] Company Strategy and Development Direction - The company aims to elevate technology leadership, expand geographic footprint, and enhance strategic partnerships [8][10] - Focus on advanced packaging platforms, including HDFO and Flip Chip, critical for next-generation AI and HPC [9][10] - Construction of the Arizona campus is underway, with significant capital expenditures planned for facility expansion and advanced packaging capacity [17] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in navigating market shifts and geopolitical challenges, emphasizing strong customer engagements [5][11] - The company anticipates a strong start to 2026, with revenue guidance for Q1 between $1.6 billion and $1.7 billion, reflecting a 25% year-on-year increase [16][17] - Management is monitoring export control and trade policies, which are factored into Q1 guidance [11] Other Important Information - Capital expenditures for 2026 are expected to increase to $2.5 billion-$3 billion, with a significant portion allocated for facility expansion [17] - The company held $2 billion in cash and short-term investments at year-end, with total liquidity of $3 billion, a 30% increase from the prior year [16] Q&A Session Summary Question: CapEx guidance and its implications - The CapEx projection includes 65%-70% for facilities, with significant spending on the Arizona project expected to peak in 2026 [19][21] - Customer commitments for HDFO projects are contributing to the high CapEx numbers [20][23] Question: Growth expectations in computing - Computing is expected to show 20% year-on-year growth, with data center HDFO programs anticipated to ramp significantly [27][29] Question: Margin outlook and impacts - Q1 margins are impacted by a one-time asset sale, but the company expects to achieve a 30% incremental flow-through for the full year [41][43] Question: Partnership with TSMC - The partnership with TSMC is ongoing, focusing on technology and manufacturing needs in the U.S., with increasing customer interest [49][51]

Financial Data and Key Metrics Changes - Q4 2025 revenue was $1.89 billion, down 5% sequentially but up 16% year-on-year, with EPS at $0.69, outperforming guidance [11][4] - Full year 2025 revenue grew 6% to $6.7 billion, with gross profit of $939 million and gross margin at 14% [14][13] - Net income for 2025 was $374 million, resulting in EPS of $1.50, with EBITDA at $1.16 billion and EBITDA margin at 17.3% [14][13] Business Line Data and Key Metrics Changes - Communications revenue grew 28% year-on-year in Q4, with a 1% increase for the full year, driven by iOS demand [11] - Computing revenue increased 6% year-on-year in Q4 and 16% for the full year, supported by AI-related PC devices [11] - Automotive and industrial revenue rose 25% year-on-year in Q4 and 8% for the full year, driven by advanced automotive content [11] - Consumer revenue declined 10% year-on-year in Q4 but grew 9% for the full year, reflecting product lifecycle impacts [12] Market Data and Key Metrics Changes - The computing segment is expected to grow over 20% in 2026, with strong contributions from AI and HPC [10] - Communications, computing, and automotive markets are projected to see strong year-on-year growth in Q1 2026 [15] - The automotive market is gradually recovering, with mainstream automotive showing three consecutive quarters of growth [11] Company Strategy and Development Direction - The company aims to elevate technology leadership, expand geographic footprint, and enhance strategic partnerships [6] - Focus on advanced packaging platforms, including HDFO and test, critical for AI and high-performance computing [6] - Construction of the Arizona campus is underway, with significant investments planned for 2026 [10][15] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in navigating market shifts and geopolitical challenges, emphasizing strong execution [4] - The company anticipates continued growth in advanced packaging and computing, with a focus on margin improvement [9] - Management highlighted the importance of customer commitments and partnerships in supporting capacity investments [21][30] Other Important Information - Capital expenditures for 2025 were $905 million, with expectations for 2026 CapEx to increase to $2.5 billion-$3 billion [14][15] - The company held $2 billion in cash and short-term investments at year-end, with total liquidity at $3 billion [15] Q&A Session Summary Question: CapEx guidance and investment changes - Management clarified that the high CapEx guidance includes significant spending for facilities and equipment, with a focus on supporting advanced packaging growth [18][19] Question: Government incentives and CapEx - Management indicated that government incentives would come in on a lag, with minimal offsets in the 2026 guidance [24] Question: Computing segment growth and data center programs - Management expects data center HDFO programs to ramp significantly, contributing meaningfully to revenue [26][28] Question: Communication segment outlook - Management noted relative strength in iOS and a stable outlook for Android, with expectations for premium tier benefits [44] Question: Partnership with TSMC and CapEx impact - Management confirmed ongoing discussions with TSMC regarding U.S. manufacturing and emphasized strong customer interest in the Arizona project [45][48] Question: Balance sheet management and cash needs - Management stated that the company can operate comfortably with $500 million on the balance sheet and expects a decrease in interest expense despite potential debt increases [54]

Q4 2025 Financial Results February 2026 © 2026 Amkor Technology, Inc. Presenter Introductions Disclaimer Non-GAAP Measures This presentation contains certain measures that are not defined terms under U.S. generally accepted accounting principles ("GAAP"). These non-GAAP measures should not be considered in isolation or as a substitute for, or superior to, measures of liquidity or performance prepared in accordance with U.S. GAAP and may not be comparable to calculations of similarly titled measures by other ...

Bitcoin mining stocks faced a sea of red Monday as a sharp decline in cryptocurrency prices collided with analyst skepticism regarding the sector’s expensive transition to AI. Stock prices have dropped alongside bitcoin’s 10% correction over the last week despite a flurry of announcements regarding data center expansions. HIVE dropped 8.2% to $2.56 on Monday’s open. The miner recently announced plans to grow its Paraguay operations by 100 megawatts in 2026 and launched a new high-performance computing b ...

Core Viewpoint - The global AI and HPC chip competition has officially entered the 2nm era, with TSMC initiating a "preparation mode" for advanced process technology [2] Group 1: 2nm Process Development - TSMC's 2nm (N2) process represents a significant shift from FinFET to GAAFET architecture, with strong demand from clients exceeding expectations [2] - Major clients for the 2nm process include Apple and Qualcomm, with general-purpose GPUs and ASICs expected to ramp up production starting next year [2][3] - TSMC's N2 family is projected to have a larger scale and longer lifecycle than the 3nm process, with mass production expected to ramp up in 2026 [3] Group 2: Advanced Packaging Technologies - TSMC is simultaneously upgrading its advanced packaging systems to meet the demands of AI chips, which are moving towards multi-chiplet and large package sizes [3] - The company is expected to increase its CoWoS monthly capacity by over 70% this year, while also validating next-generation technologies like CoWoP and CPO [3] - The ability to produce high-yield large system-level packages is critical for the semiconductor ecosystem's resilience [3]