华见早安之声 请各位听众升级为见闻最新版APP，以便成功收听以下音频。 市场概述 美国宏观经济数据持续真空，投资者担忧泡沫风险，获利了结的需求增强。美股开盘后下挫，尾盘因微软预测数据中心供应紧缺将持续到2026年，美股自低 位拉起，不过三大美股指仍收跌。 美股科技七巨头走势分化，Meta涨超2%，英伟达再新高，苹果则跌超1.5%。投资者抛售周期性板块，转向防御性板块。中概股指跌超2%。 美债同样遭到卖出，美债主要期限收益率普涨1-2基点。 美元涨0.72%，突破99、创两个多月新高。比特币较日高一度下挫约3.3%。以太坊震荡走低3.7%。强势美元叠加以色列哈马斯和谈，贵金属盘中转跌，黄 金跌1.70%、跌破4000美元；白银历史性突破51美元后回落超5.6%、随后反弹。 美油日内跌逾1.3%。 亚洲时段，沪指四季度开门红，时隔10年突破3900点，沪金、沪铜大涨逾4%，半导体产业链午后回落，港股收跌，医药股下挫。 《付鹏说 要闻 中国商务部连发四则公告，事关稀土、锂电池、超硬材料等出口管制。 美国政府关门难解：参院七次否决拨款案，特朗普威胁砍民主党项目，共和党领袖否认要动"大招"。 报道：美国劳工统计局准备在 ...

Superhard Materials - The Ministry of Commerce and the General Administration of Customs announced export control measures on superhard materials, rare earth equipment, and other related items, effective from November 8 [1] - The production and sales ratio of superhard materials in China remains high, indicating a balanced supply-demand relationship, with diamond wire and micro-powder products nearing 100% [1] - The market for CVD diamond films is expected to exceed 5 billion yuan by 2030, indicating significant growth potential [1] Semiconductor Industry - TSMC reported a September sales figure of 330.98 billion NTD, a year-on-year increase of 31.4%, with Q3 revenue reaching 989.9 billion NTD, surpassing analyst expectations [2] - The demand for high-end chips driven by AI investments from global tech giants is providing strong support for TSMC's performance [2] - The semiconductor industry is anticipated to experience a full recovery by 2025, with improved profitability for companies [2] Humanoid Robots - Cloud Deep Technology launched the DR02 humanoid robot, featuring IP66 protection for outdoor operations [3] - The industry is on the verge of mass production, with major companies like Tesla and domestic leaders receiving significant orders [3] - The humanoid robot sector is expected to enter mass production by 2026, driven by advancements from leading companies [3] Rare Earths - Export controls on certain rare earth items will be implemented starting November 8, 2025, expanding previous measures [4] - China holds a dominant position in the global rare earth market, with 68.57% of production and 39.21% of reserves [4] - The new export control measures are expected to strengthen China's competitive advantage in the entire rare earth supply chain [4] Physical AI - XPeng Motors announced significant breakthroughs in physical AI, enhancing its ability to simulate the physical world [5] - The development of a large-scale physical AI model is seen as crucial for advancing autonomous driving and robotics [5] - The commercialization of physical AI is accelerating, with practical applications emerging in various sectors [5] Two-Dimensional Semiconductors - Fudan University's research team developed the world's first two-dimensional-silicon hybrid architecture chip, which could revolutionize traditional storage architectures [6] - This technology is expected to provide new pathways for chip development in the post-Moore's Law era [6] - The two-dimensional semiconductor technology is recognized as a key solution to global semiconductor challenges [6] Hydrogen Energy - A research team from Tokyo University of Science developed a high-performance solid electrolyte capable of reversible hydrogen absorption at 90 degrees Celsius [7] - The magnesium-hydrogen battery constructed from this electrolyte shows promising hydrogen storage capacity, nearing theoretical limits [7] - This advancement is expected to play a significant role in renewable energy storage and fuel cell vehicles [7]

成立多年的基金首次分红！公募基金"发红包"力度不断加大 Wind数据显示，截至10月8日，2025年全市场公募基金分红金额已达到1831.97亿元，为2022年以来同期 之最，距离"基金大年"2021年的1873.55亿元只差了40多亿元。其中，4只千亿级别的沪深300ETF分红金 额领衔全市场，华泰柏瑞沪深300ETF分红金额最多，达到83.94亿元；易方达沪深300ETF、华夏沪深 300ETF、嘉实沪深300ETF分红金额分别为55.58亿元、55.54亿元、24.35亿元。记者看到，年初至今分 红较多的基金，多为被动指数型基金、债券型基金，主动权益基金只有少数规模较大的基金名列前茅， 例如成立了17年的易方达科讯，年初至今净值接近翻倍，阔别3年再次发放分红；再比如成立了16年的 大成策略回报，在长期业绩稳健的同时，仍然保持了定期分红。（大河财立方） 东方财富证券客服确认：中芯国际、佰维存储两融折算率均调为零 今日下午，有投资者反映称，接东方财富证券短信告知，自10月9日起，信用账户持有的中芯国际 （688981）的折算率由0.70调整为0.00；佰维存储（688525）的折算率由0.50调整为0.00 ...

继今年4月在《自然》提出"破晓"二维闪存原型器件后，复旦大学科研团队又迎来新突破。北京时间10月8日晚，复旦大学在《自然》（Nature）上发 文，题目为《全功能二维-硅基混合架构闪存芯片》（"A full-featured 2D flash chip enabled by system integration"）， 相关成果率先实现全球首颗二 维-硅基混合架构芯片，攻克新型二维信息器件工程化关键难题。 面对摩尔定律逼近物理极限的全球性挑战，具有原子级厚度的二维半导体是目前国际公认的破局关键，科学家们一直在探索如何将二维半导 体材料应用于集成电路中。当前，国际上对二维半导体的研究仍在起步阶段，尚未实现大规模应用。 ...

Core Viewpoint - The future of microelectronics hinges on the miniaturization of chips, with a focus on developing smaller and more energy-efficient semiconductors to meet the demands of AI and smart devices [2][4]. Group 1: Emerging Technologies - Two-dimensional (2D) semiconductors are emerging as a groundbreaking technology that can surpass the limitations of traditional silicon, offering unprecedented speed, efficiency, and miniaturization [4][5]. - These materials, only a few atoms thick, allow for stacking chips like paper, enabling engineers to integrate more processing power in smaller spaces [4][5]. Group 2: Research and Development - The research team, led by Professor Tongay, is exploring atomic-scale materials to create, test, and optimize new semiconductor materials, aiming to prove that 2D materials can compete with and even exceed the performance of established silicon technologies [4][5]. - Advanced methods such as Pulsed Laser Deposition (PLD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) are being utilized to grow these ultra-thin materials with high precision [6]. Group 3: Industry Implications - The work being done addresses a critical industry challenge: how to expand advanced chip capabilities while reducing power consumption, with future AI processors potentially consuming over 10 kilowatts [5][6]. - The collaboration between Arizona State University and Applied Materials Inc. aims to bring these innovations from concept to practical application, potentially transforming the microelectronics industry [6].

Core Viewpoint - The article discusses the advancements made by the startup CDimension in the development of two-dimensional (2D) semiconductors, specifically focusing on their ability to grow molybdenum disulfide (MoS2) on silicon at low temperatures, which could revolutionize chip manufacturing and reduce power consumption significantly [3][5]. Group 1: CDimension's Technology - CDimension claims to have solved key challenges in the industrialization of 2D semiconductors, including wafer-level uniformity, device performance, and compatibility with silicon manufacturing processes [3][4]. - The proprietary process developed by CDimension allows for the growth of single-layer MoS2 at approximately 200°C, avoiding damage to the underlying silicon circuits, which is a significant improvement over traditional methods that require temperatures up to 1000°C [4]. - The startup is currently shipping silicon wafers with grown 2D materials for customer evaluation and integration into devices, showcasing the potential for 2D materials to be used in scalable logic devices [4][5]. Group 2: Industry Implications - Major chip manufacturers like Intel, Samsung, and TSMC are exploring the replacement of silicon nanosheets with MoS2 and other 2D semiconductors, indicating a shift in the semiconductor industry towards these advanced materials [4]. - The low-temperature synthesis demonstrated by CDimension's team can produce MoS2 transistors with multiple stacked channels, potentially meeting or exceeding the performance requirements of future 10A (1 nanometer) nodes [4]. - The motivation for adopting 2D semiconductors includes a significant reduction in power consumption, with devices made from CDimension's materials consuming only one-thousandth of the power of traditional silicon devices [5].

Group 1 - The first engineering verification demonstration line for two-dimensional semiconductors was launched in Shanghai in mid-June, with the potential to achieve mass production of the world's first two-dimensional material chip by 2029, indicating Shanghai's leading position in the global two-dimensional semiconductor industry [1] - The "Shanghai Plan" aims to promote research and layout of future non-silicon-based semiconductor materials, with two-dimensional semiconductors positioned as a strategic focus due to the limitations of silicon-based chips as they approach the physical limits of Moore's Law [2][3] - Two-dimensional materials are seen as a solution to the challenges faced by silicon-based chips, offering advantages such as atomic-level thickness and unique electronic transport properties, which can effectively suppress leakage current and facilitate the manufacturing of transistors at 1 nanometer and below [3][4] Group 2 - The global two-dimensional semiconductor market is projected to reach between $30 billion and $50 billion by 2035, accounting for 10% to 15% of the advanced semiconductor market, highlighting the significant potential for applications in high-performance computing, low-power computing, advanced sensors, and wearable devices [4][5] - Shanghai has successfully developed prototype products and established a complete process for two-dimensional integrated circuit manufacturing, including a 32-bit RISC-V architecture microprocessor named "Wuji," which integrates 5,900 transistors and achieves performance levels that are internationally competitive [6][7] - The company plans to build an internationally leading demonstration commercial production line for two-dimensional semiconductors within three years, aiming for the commercialization of two-dimensional semiconductor technology and the production of chips with 1-2 nanometer performance by 2029 [7][8]

Core Viewpoint - The article discusses the future of semiconductor technology, emphasizing the transition from traditional silicon-based materials to two-dimensional (2D) semiconductor materials as a key focus for innovation and development in the industry [2][12][53]. Group 1: Industry Trends and Predictions - IMEC predicts that by 2039, the second generation of 2D Field Effect Transistors (2DFET) will become mainstream, highlighting the growing importance of 2D materials in semiconductor technology [4][53]. - The global market for 2D semiconductor materials is expected to reach $1.8 billion in 2024, with graphene being the largest segment, accounting for 45% of the market share [16]. - The market is projected to grow at a compound annual growth rate (CAGR) of 24%-26.5% from 2025 to 2030, driven by demand in 5G communication, AIoT, and high-performance computing [16]. Group 2: Material Innovations - The transition to 2D semiconductor materials is seen as a solution to the challenges posed by traditional silicon-based devices, which face physical limitations such as quantum tunneling and short-channel effects [5][12]. - 2D materials, such as graphene and transition metal dichalcogenides (TMDs), offer unique electrical properties and the potential for higher integration densities, with vertical field-effect transistors (VFETs) achieving densities ten times that of FinFETs [6][14]. - Research has shown that 2D materials can be engineered to exhibit a wide range of electronic properties, making them suitable for various applications, including neuromorphic devices and quantum computing [9][12]. Group 3: Industrial Applications and Developments - Companies like TSMC, Intel, and Samsung are investing heavily in the research and integration of 2D semiconductor materials, pushing the industry from laboratory experiments to large-scale production [16]. - The first domestic engineering demonstration line for 2D semiconductors has been launched, aiming to develop commercial production lines within three years [17]. - Significant advancements have been made in the development of flexible integrated circuits based on 2D materials, with successful demonstrations of medium-scale circuits that integrate over 100 transistors [45][50]. Group 4: Challenges and Solutions - The integration of 2D materials into existing semiconductor processes presents challenges, including the need for compatible substrates and the management of high-temperature growth processes [54][57]. - Researchers are exploring various methods to overcome these challenges, such as using low-resistance source/drain contacts and alternative doping techniques to enhance the performance of 2D devices [58][59]. - The industry is also focusing on developing heterogeneously integrated chip technologies that leverage existing silicon ecosystems while incorporating 2D materials [59].

Core Viewpoint - The article discusses the future of semiconductor technology, emphasizing the transition from traditional silicon-based materials to two-dimensional (2D) semiconductor materials as a key focus for innovation and development in the industry [2][11][63]. Group 1: Semiconductor Industry Trends - The evolution of advanced process nodes and transistor architectures is leading to a growing interest in 2D semiconductor materials, as traditional silicon-based technologies face physical limitations and increasing costs [2][4][11]. - IMEC predicts that by 2039, 2D materials will become mainstream in semiconductor applications, particularly in the development of the second generation of 2D field-effect transistors (2DFETs) [3][52]. Group 2: Advantages of 2D Materials - 2D materials, such as graphene and transition metal dichalcogenides (TMDs), offer unique electrical properties and the potential for significantly higher transistor densities compared to traditional silicon [5][13]. - The introduction of 2D materials can address challenges related to size scaling and energy efficiency, making them ideal candidates for next-generation integrated circuits [11][12]. Group 3: Market Potential and Growth - The global market for 2D semiconductor materials is projected to reach $1.8 billion by 2024, with graphene accounting for 45% of this market due to its superior conductivity and mechanical strength [15]. - The market is expected to grow at a compound annual growth rate (CAGR) of 24%-26.5% from 2025 to 2030, driven by demand in sectors such as 5G communication, AIoT, and high-performance computing [15]. Group 4: Research and Development Initiatives - Major companies like TSMC, Intel, and Samsung are investing heavily in 2D semiconductor research and development, aiming to transition from laboratory experiments to large-scale production [15][16]. - Research teams are making significant breakthroughs in the fabrication and application of 2D materials, including the development of the first domestically produced 2D semiconductor integrated circuit demonstration line in China [16][19]. Group 5: Challenges in Industrialization - The transition to 2D materials presents several challenges, including the need for compatible substrates, high-temperature growth processes, and maintaining device reliability and consistency [52][58]. - The industry faces hurdles in integrating 2D materials with existing CMOS technology, particularly in achieving low-resistance contacts and effective doping methods [59][60]. Group 6: Future Outlook - The rise of 2D semiconductor materials is not just a technological advancement but also a restructuring of the semiconductor supply chain, with China positioned to leverage its policy support and technological capabilities [63]. - The integration of 2D materials is expected to lead to a new era of electronic systems characterized by high heterogeneity, impacting various fields including information processing and energy conversion [63].

Group 1 - The semiconductor materials ETF (562590) closely tracks the CSI Semiconductor Materials and Equipment Theme Index, which selects 40 listed companies deeply involved in the semiconductor materials and equipment sectors [2] - The index includes leading companies that have shown significant performance in the domestic substitution process, such as North Huachuang and Zhongwei Company in the etching equipment field, and Hushi Silicon Industry and Nanda Optoelectronics in key materials [2] - The sample selection reflects the trend of self-reliance and upgrading in the semiconductor industry chain, showcasing the overall performance of listed companies in semiconductor materials and equipment [2] Group 2 - As of June 20, 2025, the CSI Semiconductor Materials and Equipment Theme Index (931743) rose by 1.01%, with component stocks such as Jingrui Electric Materials up by 6.68% and Sanjia Technology up by 4.14% [1] - Yuanjiwei Technology (Shanghai) Co., Ltd. has recently completed several million yuan in seed and Pre-A financing, which will help accelerate its industrialization efforts [1] - The launch of the first fully autonomous two-dimensional semiconductor integrated circuit engineering demonstration line in Shanghai marks a significant step in the domestic semiconductor industry chain's maturity and completeness [1]