证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 Q3、请介绍 2025 年第三季度 PCB 业务各下游领域经营拓展情况。 公司 PCB 业务产品下游应用以通信设备为核心，重点布局数据中心（含服务器）、汽车 电子等领域，并长期深耕工控、医疗等领域。2025 年第三季度，数据中心、有线通信业务收 入持续增长，各业务领域占比与上半年基本一致。 Q4、请介绍 2025 年第三季度封装基板业务经营拓展情况。 公司封装基板业务产品覆盖种类广泛多样，包括模组类封装基板、存储类封装基板、应 用处理器芯片封装基板等，主要应用于移动智能终端、服务器/存储等领域。2025 年第三季 度，封装基板营业收入环比增加，各下游领域产品需求均有增长，其中存储类封装基板增长 最为显著。 Q5、请介绍公司南通四期及泰国项目规划及当前建设进展。 公司新建工厂包括南通四期及泰国工厂，泰国工厂目前已连线试生产，南通四期在今年 四季度连线。南通四期和泰国工厂将具备高多层、HDI 等 PCB 工艺技术能力，其建设将助 力 PCB 业务产能进一步释放。 Q6、请介绍公司 2025 年第三季度工厂产能利用率较第二季度变化 ...

Financial Performance - In Q3 2025, the company achieved a revenue of CNY 6.301 billion, representing a year-on-year growth of 33.25% [2] - The net profit attributable to shareholders reached CNY 966 million, with a year-on-year increase of 92.87% [2] - The net profit excluding non-recurring items totaled CNY 916 million, reflecting a growth of 94.16% year-on-year [2] Business Growth Drivers - The growth was primarily driven by opportunities in AI computing power upgrades, structural growth in the storage market, and the acceleration of automotive electronics [2] - Increased demand for AI chips, servers, and related products contributed to the rise in main business revenue [2] Gross Margin and Cost Management - The overall gross margin showed improvement in Q3 2025, aided by increased demand for storage packaging substrates and enhanced production capacity utilization [2] - The company’s PCB business maintained a high capacity utilization rate, with significant improvements in the packaging substrate business due to rising demand [5] Product Development and R&D Investment - R&D investment in Q3 2025 amounted to approximately CNY 464 million, accounting for 7.37% of total revenue [7] - The company is advancing various R&D projects, including next-generation communication and data center-related PCB technologies [7] Capacity Expansion and New Projects - The company is constructing new factories, including the Nantong Phase IV and a facility in Thailand, which are expected to enhance PCB production capacity [4] - The Thailand factory has commenced trial production, while Nantong Phase IV is set to start operations in Q4 2025 [4] Raw Material Price Trends - In Q3 2025, prices for key raw materials such as gold salt and copper increased due to fluctuations in commodity prices [6] - The company is actively monitoring international commodity price changes and maintaining communication with suppliers and customers [6] Packaging Substrate Business - The packaging substrate business saw a sequential revenue increase in Q3 2025, with notable growth in storage packaging substrates [3] - The company’s FC-BGA packaging substrates have achieved mass production capabilities for products with 20 layers and below [9]