Core Viewpoint - Maiwei Co., Ltd. is enhancing its product offerings in the semiconductor equipment sector, particularly focusing on high selectivity etching and hybrid bonding equipment for DRAM and high bandwidth memory (HBM) processes, which are critical for high-performance computing and AI training applications [1][3]. Group 1: Company Developments - The company has confirmed that its high selectivity etching and hybrid bonding equipment can meet some advanced storage process requirements, supporting clients in expanding production and technological upgrades in high-performance storage [1][3]. - Maiwei's etching and thin film deposition equipment are widely used in the manufacturing of storage and logic chips, achieving stable operation across various wafer production lines [3]. - The introduction of equipment capable of servicing DRAM and HBM processes highlights the company's product coverage capabilities in key semiconductor front-end processes [3]. Group 2: Industry Context - HBM, as a key storage product for high-performance computing and AI training, demands higher precision in processes, interconnects, and yield control, making the performance of etching and hybrid bonding equipment crucial for consistency and signal transmission efficiency [3]. - The entry of domestic semiconductor equipment companies into the DRAM and HBM process segments is expected to benefit from the trends of storage technology upgrades and domestic substitution [4]. - The release of orders for Maiwei's related equipment will be influenced by factors such as downstream capital expenditure cycles, validation periods, and the international competitive landscape [4].