Core Insights - The article emphasizes that while China is attempting to close the lithography gap using domestic tools related to Huawei, extreme ultraviolet (EUV) lithography technology remains a complex and globally collaborative field, with ASML holding a virtual monopoly in this area [1][11] - ASML's dominance is attributed not only to its technological leadership but also to a unique ecosystem that cannot be replicated overnight by any country [1][11] Group 1: ASML's EUV Technology - ASML's EUV lithography is likened to using a "nano-scale surgical knife" to etch circuits, utilizing a special 13.5 nm wavelength light that is 5,000 times thinner than a human hair [2] - The entire lithography process must occur in a vacuum to prevent the EUV light from being absorbed by air, requiring ultra-precise mirrors to capture and focus the light [2][3] - ASML's high NA EUV technology allows for extreme feature sizes to be created in a single exposure by compressing patterns in different directions [3] Group 2: Complexity of ASML's Machines - ASML's EUV machines consist of approximately 100,000 parts, and transporting a single unit is akin to a small military operation, involving 40 shipping containers, three cargo planes, and 20 trucks [6] - The latest High-NA EUV machines are priced over $350 million, highlighting their critical role in producing advanced chips [6] Group 3: Key Suppliers and Collaborations - Zeiss, a key optical partner, developed a mirror-based optical system that operates in a vacuum, with mirrors that have an astonishing precision of 0.1 mm over large areas [7] - ASML's collaboration with Cymer focuses on laser technology, where high-power lasers create plasma from tiny tin droplets to emit EUV light [8] - The immersion lithography breakthrough, which uses a layer of pure water to enhance resolution, was made possible through partnerships with Zeiss and Philips Research [9] Group 4: Competitive Landscape - ASML's CEO stated that China lags 10 to 15 years in chip manufacturing, with the gap potentially being larger due to the intricate technological ecosystem that supports ASML [11] - Even if competitors replicate the appearance of lithography machines, they cannot access the precision optics from Zeiss, the laser technology from Cymer, or the extensive operational data from companies like TSMC [11]

Core Viewpoint - The article discusses the current state and future directions of photomask manufacturing, emphasizing the importance of curved masks and advanced computational tools in extending the viability of non-EUV lithography technologies [1][3][4]. Group 1: Innovations in Photomask Technology - The use of curved photomasks is a significant innovation that leverages current writing technologies to create complex shapes previously unattainable [3]. - Advanced computational tools, such as Mask Process Correction (MPC) and high-level simulations, are increasingly used in the mask design flow, reducing the need for expensive experiments and pushing technological limits [3][6]. - The evolution of variable shape beam (VSB) writing technology to multi-beam writing technology has made curved mask shapes feasible without increasing writing time or costs [5]. Group 2: Challenges and Infrastructure Needs - There is a substantial need for infrastructure development to support the complexity of curved shapes, as traditional rectangular descriptions are simpler to manage [8]. - The transition to curved processes is seen as an exception rather than the norm, impacting economics and infrastructure, particularly in the reliance on GPU-based computing [9]. - Measurement technologies must evolve to handle the complexities of curved shapes, requiring higher resolution and faster measurement tools [11]. Group 3: EUV Masking Issues - EUV masks face challenges such as lower durability compared to 193i masks, necessitating frequent replacements that increase costs and complexity [13]. - The performance of EUV pellicles is currently suboptimal, leading to significant wafer throughput losses due to energy loss during transmission [13][15]. - The balance between using pellicles and the associated costs is contingent on the specific use case, with larger, high-value chips benefiting more from pellicles than smaller, redundant designs [16]. Group 4: Future Directions and Research - Research is ongoing into alternative materials for pellicles, such as carbon nanotube films, which could address current limitations but are not yet in mass production [17]. - The industry is exploring ways to improve the durability and transmission rates of EUV pellicles, which could lead to broader applications if successful [15][16].