| 公布日 | 投资方 | 交易全额 | 融资轮次 | | --- | --- | --- | --- | | 2025-11-23 | 清源投资 | 未披露 | A+轮 | | 2024-11-11 | 哈工大资产 | 未披露 | A轮 | 证券之星消息，根据天眼查APP于11月23日公布的信息整理，哈尔滨市博众泰达光学精密机械有限公司 A+轮融资，融资额未披露，参与投资的机构包括清源投资。 以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成 投资建议。 博众泰达是一家专门从事超精密加工及检测装备的设计、制造、销售和超精密加工工艺开发及相关技术 服务的企业，旨在为用户提供尖端超精密加工及检测的解决方案。 数据来源：天眼查APP ...

Core Viewpoint - The semiconductor packaging process is critical, with semiconductor cutting, grinding, and polishing equipment being an essential part of this field. The cutting and grinding stage is at the beginning of the packaging process, primarily responsible for thinning the back of completed wafers and then flipping and separating them into individual chips [1]. Group 1: Industry Insights - The cutting and grinding stage is high-risk and involves processing the most valuable materials, where even a 0.1% difference in yield can significantly impact customer brand choice [1]. - Japanese companies have established a first-mover advantage in semiconductor cutting and grinding equipment due to long-term technical accumulation and deep cooperation with international giants, creating a scale effect [1]. - Chinese companies, represented by He Yan Technology, are beginning to break through the technological and market "encirclement" established by Japanese firms [1]. Group 2: Company Developments - He Yan Technology focuses on high stability and consistency in mass production equipment, with the entire company participating in quality improvement, which is crucial for the application of cutting and grinding equipment [2]. - The company has transitioned from being a single equipment supplier to a process solution provider, forming a complete product portfolio that surpasses overseas competitors [2]. - He Yan Technology has developed multiple product lines, including dicing machines, film-less cutting equipment, grinders, and cutting fixtures, with the dicing machine gaining widespread recognition and leading market share among domestic suppliers [2].