Core Viewpoint - Jiangfeng Electronics (300666) emphasizes its comprehensive product line covering advanced processes, mature processes, and specialty processes, establishing a leading and complete sputtering target solution system in the industry [1] Group 1 - The company focuses on technological innovation as its foundation and continuously increases R&D investment [1] - Jiangfeng Electronics leverages its independent innovation advantages to keep pace with the most advanced integrated circuit technologies globally [1] - The company maintains a core competitive advantage in the semiconductor field by adapting market strategies and responding flexibly to the evolving technical requirements of downstream customers [1]

Core Viewpoint - Jiangfeng Electronics (300666.SZ) emphasizes its comprehensive product line covering advanced processes, mature processes, and specialty processes, establishing a leading and complete sputtering target solution system in the industry [1] Group 1: Product and Technology - The company has developed a complete sputtering target solution system that is at the forefront of the industry [1] - Jiangfeng Electronics focuses on technological innovation as its foundation, continuously increasing R&D investment [1] - The company leverages its independent innovation advantages to keep pace with the most advanced integrated circuit technologies globally [1] Group 2: Market Adaptability - Jiangfeng Electronics possesses the ability to timely adjust market strategies and flexibly adapt to the evolving technical routes of downstream customers [1] - The company is prepared to meet various challenges brought by market changes [1]

Core Viewpoint - The 2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT 2026) will be held from October 27 to 30, 2026, in Hangzhou, China, focusing on advancements in solid-state devices and integrated circuits [4]. Conference Overview - ICSICT 2026 is co-sponsored by various academic and professional organizations, making it one of the largest and most influential international conferences in the field of solid-state devices and integrated circuits [4][5]. - The conference aims to promote the advancement of integrated circuit technology and foster deep integration between industry and academia [4]. Themes and Tracks - The conference will cover multiple themes including Digital & System Level IC, Analog, Devices, and Process & Technologies, with specific tracks dedicated to various aspects such as digital architectures, RF & wireless, and semiconductor process technologies [9][19][22]. - Each track will have designated chairs and co-chairs from prominent universities and institutions, ensuring a high level of expertise and discussion [9][19][22]. Submission and Important Dates - Authors are required to submit a minimum of three pages of English papers by June 25, 2026, with acceptance notifications sent out by July 25, 2026 [31]. - The conference committee invites experts to organize special sessions to showcase advanced research results, with proposals due by February 1, 2026 [31]. Location and Cultural Significance - Hangzhou, known for its picturesque scenery and rich cultural heritage, will host the conference, with notable attractions such as West Lake, a UNESCO World Heritage site [31].

Core Viewpoint - The 2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT 2026) will be held from October 27 to 30, 2026, in Hangzhou, China, focusing on advancements in solid-state devices and integrated circuits [4]. Group 1: Conference Overview - ICSICT 2026 is co-sponsored by various academic and professional organizations, making it one of the largest and most influential international conferences in the field of solid-state devices and integrated circuits [4][5]. - The conference aims to promote the advancement of integrated circuit technology and foster deep integration between industry and academia, with over 500 distinguished representatives expected to attend [4]. Group 2: Themes and Tracks - The conference will cover multiple themes, including Digital & System Level IC, Analog, Devices, and Process & Technologies, with various tracks dedicated to specific areas such as digital architectures, RF & wireless, and semiconductor process technologies [9][19][22]. - Each track will have designated chairs and co-chairs from leading universities and institutions, ensuring a high level of expertise and discussion [9][19][22]. Group 3: Submission and Important Dates - Authors are required to submit a minimum of three pages of English papers following the provided template, with the submission deadline set for June 25, 2026 [28][31]. - Notification of acceptance will be communicated by July 25, 2026, allowing authors to prepare for the conference [31]. Group 4: Location and Cultural Significance - Hangzhou, known for its picturesque scenery and rich cultural heritage, will host the conference, with notable attractions such as West Lake, a UNESCO World Heritage site [31]. - The city is also recognized for its emerging e-commerce industry, adding a modern dimension to its historical significance [31].