技术升级方面，iPhone 18 Pro系列有望搭载基于台积电2nm工艺的A20芯片，其性能较前代预计提升 15%，功耗降低30%。同时，该系列将首次采用全新封装工艺（WMCM技术），将RAM直接集成于芯 片晶圆上，以提升散热效率并释放内部空间。影像系统也将迎来革新，主摄或将支持手动可变光圈功 能。 （来源：CNMO科技） 【CNMO科技消息】近日，有数码博主爆料称，苹果iPhone 18系列将于今年12月启动生产线架设及量 产验证流程，预计2026年第二季度初期正式投入量产，并于第三季度初期完成产能爬坡。CNMO注意 到，这一生产规划与苹果供应链的常规节奏吻合，但具体机型配置和发布时间仍存在变数。 iPhone 17 根据供应链消息，苹果计划从iPhone 18系列开始调整产品发布策略，采用秋季与春季交替发布的模 式。高端机型（包括Pro、Pro Max及折叠屏版本）将优先于2026年秋季发布，而标准版iPhone 18和 iPhone 18e则可能延期至2027年春季亮相。 iPhone 18 Pro概念图 产业链动向表明，iPhone 18系列的量产筹备已进入关键阶段。若计划顺利，新机有望在2026年9 ...

Core Viewpoint - The article highlights the advancements in semiconductor technology, particularly focusing on TSMC's 2nm process and its implications for major clients like Apple, indicating a strong demand and production capacity despite challenges in the market [2][4]. Group 1: TSMC's 2nm Process - TSMC is set to enhance its 2nm process capacity in the upcoming quarter, with a wafer price reaching $30,000, marking a historical high [4]. - Apple is projected to account for nearly half of TSMC's 2nm production capacity, with Qualcomm following as a significant client [4]. - The new facilities in Hsinchu and Kaohsiung are crucial for the 2nm process, expected to commence mass production in 2025 [4]. Group 2: Market Demand and Competition - Despite concerns about competitors potentially capturing TSMC's orders, the company continues to follow its planned technological roadmap without significant disruptions [4]. - The initial adoption scale of the 2nm process is anticipated to surpass that of the 3nm and 5nm processes in their early stages [4]. - TSMC's profitability is expected to exceed expectations, even amidst challenges such as tariffs, currency fluctuations, and rising costs [4].

Market Overview - The main board saw significant gains with stocks like Changshan Beiming (+10.02%), Dongshan Precision (+10.00%), and others reaching the maximum increase of 10.00% [1] - The ChiNext board led with Mankun Technology (+20.01%) and Jinxi Modern (+20.00%) showing strong performance [1] - The Sci-Tech Innovation board also performed well, with Shengyi Electronics (+13.86%) and Suochen Technology (+12.70%) among the top gainers [1] - Active sub-industries included SW Printed Circuit Boards (+7.56%) and SW Communication Network Equipment and Devices (+4.57%) [1] Domestic News - Coray, a brand under Chengdu Guangyu High Dimension, launched its flagship product, Coray Air2 smart AR glasses, featuring a full-color silicon carbide etched waveguide supplied exclusively by Guangna Siwei [1] - TSMC announced a consolidated revenue of NT$933.79 billion and a net profit of NT$398.27 billion for Q2 2025, driven by the ramp-up of 3nm processes and explosive growth in HPC demand [1] - Zhiyuan Robotics received strategic investment from Charoen Pokphand Group, marking a new phase in promoting the globalization of domestic robotics [1] - Jiangxi Zhaochi Integrated, a subsidiary of Zhaochi Co., held a ceremony for its optical laser epitaxy and chip product line, aiming for mass production of 25G DFB laser chips and planning to launch 50G DFB and 100G VCSEL chips by 2026 [1] Company Announcements - State Grid Information Communication announced that its subsidiary, Jiyuan Software, won a major contract for the State Grid's 2025 procurement, totaling approximately CNY 966.01 million [3] - Tuojing Technology projected Q2 2025 revenue between CNY 1.21 billion and CNY 1.26 billion, representing a year-on-year growth of 52% to 58%, with net profit expected to grow by 101% to 108% [3] - Yunsai Zhili announced a cash dividend of CNY 0.045 per share for A-shares and USD 0.006275 for B-shares, totaling CNY 61.55 million [3] - Dianguang Media revealed a profit distribution plan for 2024, proposing a total cash distribution of CNY 28.35 million [3] International News - Lumus, a manufacturer of reflective waveguide technology for AR glasses, expanded its partnership with Quanta Computer to enhance its supply chain infrastructure [2] - Marvell announced plans to collaborate with TSMC on advanced processes below 3nm, further solidifying TSMC's dominance in the chip foundry market [2] - ASML announced the shipment of the world's first second-generation High NA EUV lithography machine, which offers higher wafer throughput compared to its predecessor [2] - Counterpoint Research reported a 2% year-on-year increase in global smartphone shipments for Q2 2025, driven by strong performance in North America, Japan, and Europe [2]

Core Viewpoint - Google is accelerating its upgrade of the Tensor G6 chip to TSMC's 2nm process, aiming to keep pace with competitors in the semiconductor industry [2][3]. Group 1: Chip Development Timeline - The first Tensor chip, launched in 2021 with the Pixel 6, was manufactured using Samsung's 5nm process, and the Tensor G2 followed suit the next year [2]. - The Tensor G3 was the first to utilize a 4nm process, while the current Tensor G4 is also based on this technology [2]. - Google plans to transition the Tensor G5 to TSMC's 3nm process later this year, marking a significant shift in its manufacturing strategy [2]. Group 2: Future Plans for Tensor G6 - According to reports, Google intends to use TSMC's 2nm process for the Tensor G6 in the Pixel 11 series, which is set to launch in 2026 [3]. - This move could position Google ahead of competitors, as the next Snapdragon 8 Elite chipset may still be using a 3nm process at that time [3]. - There are indications that Qualcomm may produce a 3nm version of its upcoming flagship products, while Samsung is expected to manufacture a 2nm version specifically for Galaxy devices [3]. Group 3: Features and Enhancements - Limited information is available about the Tensor G6, but a report suggests it may include AI-enhanced features [4]. - Leaks from Google's gChips division indicate that the Pixel 11 series could feature video editing tools powered by "Video Generation ML" [4]. - Additionally, there are rumors that the Tensor G6 will focus on health-related functionalities, such as monitoring breathing, sleep apnea, and gait analysis [4].