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8点1氪:NIKE起诉陈冠希索赔90万,陈冠希发文;中国恒大8月25日退市;奔驰CEO警告没有燃油车的后果
36氪· 2025-08-14 00:00
Group 1 - Nike filed a lawsuit against Edison Chen for breach of contract, claiming that his company, Juice Los Angeles LLC, owes $126,000 (approximately 900,000 RMB) for goods provided by Nike [6] - Chen was a personal guarantor for Juice's account with Nike, which led to his inclusion in the lawsuit [6] - Chen's collaboration with Nike ended in October 2023, after which he became a creative partner with Adidas [6] Group 2 - China Evergrande Group announced its delisting from the Hong Kong Stock Exchange, effective August 25, 2025, due to failure to meet the exchange's resumption requirements [7][8] - The last trading day for Evergrande shares will be August 22, 2025, and the company has no intention to appeal the delisting decision [7] Group 3 - Mercedes-Benz CEO warned that the European automotive industry could face collapse if the EU insists on banning new fuel vehicles by 2035, emphasizing the need for a balanced approach to decarbonization [8] - The company had previously planned to transition fully to electric vehicles by the end of the century but has now reversed this stance [8] Group 4 - Tencent reported a revenue of 184.5 billion RMB for Q2 2025, marking a 15% year-on-year increase, with significant growth in value-added services and marketing services [25] - The company also increased its R&D investment by 17% to 20.25 billion RMB, reflecting its commitment to AI strategy [25] Group 5 - Xiaomi appointed several executives to strengthen its presence in the African market, with plans to increase investment in the region [13] - The company has already established operations in 16 African countries, including Egypt and South Africa [13] Group 6 - Didi invested in the autonomous vehicle company New Stone, expanding its logistics delivery capabilities [13] - New Stone has deployed over 7,500 autonomous vehicles across more than 280 cities [13] Group 7 - Gree Electric's public account underwent a name change, indicating a potential shift in branding strategy [12] - The company continues to adapt its marketing and product strategies in response to market dynamics [12]
8点1氪丨NIKE起诉陈冠希索赔90万,陈冠希发文;中国恒大8月25日退市;奔驰CEO警告没有燃油车的后果
3 6 Ke· 2025-08-14 00:00
Group 1 - Chipone Technology plans to issue H-shares and apply for listing on the Hong Kong Stock Exchange [1] - Wolong Electric submitted a listing application to the Hong Kong Stock Exchange with joint sponsors including CICC, Huatai International, and GF Securities [2] Group 2 - Nike filed a lawsuit against Edison Chen for breach of contract, claiming $126,000 in unpaid goods [3] - China Evergrande's listing status will be canceled on August 25 due to failure to meet the Hong Kong Stock Exchange's requirements [4] Group 3 - Mercedes-Benz CEO warned that the European automotive industry could face collapse without fuel vehicles [4] - Multiple video platforms have limitations on ad-free experiences for members, with some ads still appearing even for paid subscriptions [5] Group 4 - Li Auto aims to deliver over 8,000 units of the Li i8 by the end of September, with a challenge to reach 10,000 units [6] - Xiaomi appointed several executives for its African market to increase investment and operations [9] Group 5 - Tencent reported Q2 2025 revenue of 184.5 billion yuan, a 15% year-on-year increase, with significant growth in various service segments [20] - Youyan Silicon reported a net profit of 106 million yuan for the first half of 2025, a decline of 18.74% year-on-year [21] - Baolidi achieved a net profit of 63.8 million yuan in the first half of 2025, a 15.19% increase year-on-year [22] - Hatou Co. reported a net profit of 380 million yuan for the first half of 2025, a 233.08% increase year-on-year [23]
郭明錤:M5版MacBook Pro 将于2026年发布
Huan Qiu Wang Zi Xun· 2025-08-13 05:43
据悉,在一份研究报告中,郭明錤提到"2026年MacBook将搭载高端M5处理器",以及iPhone 18的A20芯 片将采用WMCM(晶圆级多芯片模块)技术进行封装。 来源:环球网 根据彭博社马克·古尔曼近期的报道,苹果正在考虑将搭载 M5 系列芯片的下一代 MacBook Pro 机型的 发布推迟到 2026 年。 【环球网科技综合报道】8月13日消息,继外媒预测苹果M5版MacBook Pro 将推迟发布日期,天风国际 证券分析师郭明錤近日也在一份报告中暗示了这一信息。 古尔曼表示,这并不令人意外。但这确实使得我们在年底前看到新款 MacBook Pro 的可能性比以往任 何时候都要小。(思瀚) ...
台积电泄密风波引关注 全球2纳米工艺规模量产在即
Group 1: TSMC's 2nm Process Leak Incident - TSMC announced a leak of confidential information related to its 2nm chip process, resulting in the dismissal of involved employees and the initiation of legal proceedings [2] - TSMC's 2nm process is expected to enter mass production in the second half of this year, with the A20 chip for the iPhone 18 series being one of its first applications [2] - TSMC's 2nm process has achieved a yield rate exceeding 80%, which is sufficient for mass production and revenue generation [2][3] Group 2: Competitive Landscape - TSMC holds a significant market share of approximately 67.6%, while Samsung has about 7.7%, highlighting the competitive gap [3] - Samsung plans to start mass production of its 2nm process in the first half of 2026, despite initial yield rates being lower than TSMC's [3][5] - Intel aims to disrupt the market with its 18A process, which is equivalent to 1.8nm, but faces challenges with yield rates and production timelines [6][7] Group 3: Market Outlook and Applications - The global market for 2nm and similar processes is projected to exceed $50 billion by 2025, with an annual growth rate of over 20% [5] - The introduction of 2nm technology is expected to benefit downstream applications, particularly in consumer electronics, AI, and IoT [8][9] - Companies like Apple and NVIDIA are anticipated to leverage 2nm chips for enhanced performance in their next-generation products [8][9]
杨德龙:AMD和英伟达恢复对华出口芯片 利好中美高科技产业
Xin Lang Ji Jin· 2025-07-16 03:39
Group 1 - AMD plans to resume exports of MI308 chips to China following substantial progress in US-China negotiations, marking a shift in high-end chip export controls [1] - Nvidia's CEO announced approval to sell A20 chips to China and introduced RX Pro GPU tailored for the Chinese market, with many Chinese companies queuing for orders [1] - The US stock market saw a significant surge in the semiconductor sector, with Nvidia's market value increasing by $161.8 billion to $4.17 trillion on July 15 [1] Group 2 - The US Treasury Secretary indicated flexibility regarding the suspension of tariffs on China, suggesting a possible extension of the 90-day tariff truce [1] - China's GDP grew by 5.3% year-on-year in the first half of the year, with industrial output increasing by 6.4% and high-tech manufacturing growing by 8.7% [2] - The real estate investment in China declined by 11.2%, while manufacturing investment rose by 9.5% [2] Group 3 - The upcoming political bureau meeting is expected to enhance the "proactive fiscal + stable monetary" policy combination, with potential acceleration in special bond issuance [3] - The humanoid robot sector has seen significant growth, with stocks like Estun and Huichuan Technology rising over 15% in a week, indicating a potential new pillar industry [3] - Three main investment themes are suggested: beneficiaries of eased US-China tech tensions, accelerated domestic semiconductor equipment, and policy-driven humanoid robot core components [3]
分析师称苹果首款折叠iPhone锁定三星方案 2026年量产铰链供应商或成最大赢家
Huan Qiu Wang Zi Xun· 2025-07-15 08:02
Group 1 - Apple has officially decided to abandon its self-developed folding screen technology and will adopt Samsung Display's "no crease" display solution, with plans to mass-produce its first folding iPhone in the second half of 2026 [1] - The core goal of this technology shift is to address the long-standing "crease" issue associated with folding screens. Samsung's solution includes a metal support plate hinge designed by Fine M-Tec, which utilizes laser drilling technology to achieve micron-level structural design, controlling the crease width to within 0.01 millimeters [1] - Fine M-Tec is expected to start mass production of the hinge in the first quarter of 2026, with an estimated annual shipment volume of 13 to 15 million units. The actual demand for this component will be significantly higher than the terminal sales of the folding iPhone due to assembly yield and after-sales service needs [1] Group 2 - The first folding iPhone is reported to feature a horizontal "book-style" design, with an 8-inch display that boasts a 4K resolution, comparable to the display quality of the iPad mini [2] - The device will be equipped with the same TSMC 2nm A20 chip as the iPhone 18 Pro, a 5000mAh battery, and will integrate a Touch ID sensor into the power button to save internal space [2] - The starting price of the folding iPhone is predicted to exceed 15,000 RMB, making it the most expensive smartphone in Apple's history [2]
苹果2026年MacBook Pro升级计划曝光:OLED显示屏与M6芯片齐亮相
Huan Qiu Wang· 2025-06-18 06:54
Group 1 - Apple plans a comprehensive upgrade for the MacBook Pro in 2026 to celebrate the product line's fifth anniversary [1] - The 2026 MacBook Pro is expected to feature OLED display technology for the first time, enhancing brightness, color vibrancy, and contrast [3] - The new MacBook Pro will adopt a thinner design and introduce the new M6 chip series, which is based on TSMC's advanced 2nm process, promising significant performance and energy efficiency improvements [3][4] Group 2 - The 2026 MacBook Pro series is likely to include M6, M6 Pro, and M6 Max versions, available in 14-inch and 16-inch sizes [4] - Apple is also developing a custom chip for its upcoming smart glasses, expected to begin production by the end of 2026 or in 2027, which will also be manufactured by TSMC [4] - The company is collaborating with Broadcom to develop its first chip specifically designed for AI servers, codenamed Baltra, expected to be completed by 2027 [4]
新 iPhone 发布时间曝光,新形态来了!
Xin Lang Cai Jing· 2025-06-09 10:42
Core Viewpoint - Apple is expected to launch its first foldable iPhone by the end of 2026, with credible sources and supply chain information supporting this claim [1][3]. Group 1: Product Features - The foldable iPhone is anticipated to be released alongside the iPhone 18 series in September 2026 [3]. - It will feature a horizontal large foldable design with dual screens, an inner screen measuring 7.76 inches with a resolution of 2713×1920 pixels, and an outer screen measuring 5.49 inches with a resolution of 2088×1422 pixels [5]. - The inner screen will utilize under-display camera technology, while the outer screen will have a punch-hole design [5]. - The device will incorporate a side-mounted Touch ID fingerprint unlock instead of Face ID, allowing for a true full-screen experience on the inner display [5]. Group 2: Technical Specifications - The foldable iPhone is expected to be powered by the A20 series chip, which is the same as that used in the iPhone 18 Pro series [7]. - This chip will be manufactured using TSMC's 2nm process technology, offering higher transistor density and improved performance [7]. - The A20 chip will also utilize TSMC's next-generation wafer-level multi-chip packaging technology, enhancing thermal efficiency, battery life, and AI capabilities [10]. Group 3: Market Positioning and Pricing - Analysts predict that the foldable iPhone will be positioned as a "truly AI-driven phone," with its large screen design enhancing multitasking and AI experiences [10]. - The expected price range for the foldable iPhone is projected to exceed $2000 to $2500 [10].
苹果彻底革新芯片,采用全新封装技术
半导体行业观察· 2025-06-04 01:09
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容 编译自 9to5mac 。 苹果计划为2026款iPhone彻底革新其芯片设计,此举可能标志着该公司首次在移动设备中使用先 进的多芯片封装技术。这听起来很复杂,但这意味着什么呢? 据分析师 Jeff Pu 在为广发证券撰写的新报告中称,iPhone 18 Pro、18 Pro Max 以及传闻已久的 iPhone 18 Fold预计将首次搭载苹果的 A20 芯片,该芯片基于台积电第二代 2nm 工艺(N2)打 造。 但这只是故事的一部分。更有趣的是这些芯片将如何组装。 苹 果 将 首 次 在 其 iPhone 处 理 器 中 采 用 晶 圆 级 多 芯 片 模 块 (WMCM : Wafer-Level Multi-Chip Module) 封装。WMCM 允许将 SoC 和 DRAM 等不同组件直接集成在晶圆级,然后再切割成单 个芯片。 它采用一种无需中介层或基板即可连接芯片的技术,从而可以带来热完整性和信号完整性方面的好 处。 众所周知,在芯片行业,有一种根据硅晶圆的制造差异将芯片分级的技术,具体而言,将其划分为 不同性能等级的一种工艺。这些差异可能由 ...
曝iPhone18首发台积电2nm制程!
国芯网· 2025-03-21 04:28
之前摩根士丹利发布报告称,2025年台积电2nm月产能将从今年的1万片试产规模,增加至5万片左右的 量产规模。由于产能爬坡以及良率提升都需要时间,2025年苹果iPhone 17系列的A19系列处理器可能不 会采用2nm制程,只是会升级到3nm家族的N3P制程。 根据台积电披露的资料,2nm制程在相同电压下可以将功耗降低24%-35%,或将性能提高15%,晶体管 密度比上一代3nm工艺高1.15倍,这些指标的提升主要得益于台积电的新型全环绕栅极(GAA)纳米片 晶体管,以及N2 NanoFlex设计技术协同优化和其他一些增强功能来实现。 价格方面,消息称台积电2nm晶圆的价格超过了3万美元,目前3nm晶圆的价格大概在1.85万至2万美 元,两者价格差距明显。半导体业内人士预计,由于先进制程报价居高不下,厂商势必会将成本压力转 嫁给下游客户或终端消费者。 ***************END*************** 国芯网[原:中国半导体论坛] 振兴国产半导体产业! 不拘中国、 放眼世界 ! 关注 世界半导体论坛 ↓ ↓ ↓ 3月21日消息,投资公司GF Securities在报告中称,iPhone 18 ...