Market Overview - The main board saw significant gains with stocks like Changshan Beiming (+10.02%), Dongshan Precision (+10.00%), and others reaching the maximum increase of 10.00% [1] - The ChiNext board led with Mankun Technology (+20.01%) and Jinxi Modern (+20.00%) showing strong performance [1] - The Sci-Tech Innovation board also performed well, with Shengyi Electronics (+13.86%) and Suochen Technology (+12.70%) among the top gainers [1] - Active sub-industries included SW Printed Circuit Boards (+7.56%) and SW Communication Network Equipment and Devices (+4.57%) [1] Domestic News - Coray, a brand under Chengdu Guangyu High Dimension, launched its flagship product, Coray Air2 smart AR glasses, featuring a full-color silicon carbide etched waveguide supplied exclusively by Guangna Siwei [1] - TSMC announced a consolidated revenue of NT$933.79 billion and a net profit of NT$398.27 billion for Q2 2025, driven by the ramp-up of 3nm processes and explosive growth in HPC demand [1] - Zhiyuan Robotics received strategic investment from Charoen Pokphand Group, marking a new phase in promoting the globalization of domestic robotics [1] - Jiangxi Zhaochi Integrated, a subsidiary of Zhaochi Co., held a ceremony for its optical laser epitaxy and chip product line, aiming for mass production of 25G DFB laser chips and planning to launch 50G DFB and 100G VCSEL chips by 2026 [1] Company Announcements - State Grid Information Communication announced that its subsidiary, Jiyuan Software, won a major contract for the State Grid's 2025 procurement, totaling approximately CNY 966.01 million [3] - Tuojing Technology projected Q2 2025 revenue between CNY 1.21 billion and CNY 1.26 billion, representing a year-on-year growth of 52% to 58%, with net profit expected to grow by 101% to 108% [3] - Yunsai Zhili announced a cash dividend of CNY 0.045 per share for A-shares and USD 0.006275 for B-shares, totaling CNY 61.55 million [3] - Dianguang Media revealed a profit distribution plan for 2024, proposing a total cash distribution of CNY 28.35 million [3] International News - Lumus, a manufacturer of reflective waveguide technology for AR glasses, expanded its partnership with Quanta Computer to enhance its supply chain infrastructure [2] - Marvell announced plans to collaborate with TSMC on advanced processes below 3nm, further solidifying TSMC's dominance in the chip foundry market [2] - ASML announced the shipment of the world's first second-generation High NA EUV lithography machine, which offers higher wafer throughput compared to its predecessor [2] - Counterpoint Research reported a 2% year-on-year increase in global smartphone shipments for Q2 2025, driven by strong performance in North America, Japan, and Europe [2]

Core Viewpoint - Xiaomi has unveiled its self-developed SoC chip, Xuanjie O1, which utilizes the advanced second-generation 3nm process, positioning it among the top tier in terms of energy efficiency and performance, directly comparing it to Apple's latest mobile chip [1][9]. Group 1: Chip Specifications and Performance - The Xuanjie O1 features a dual super-large core design, with multi-core performance scores surpassing Apple's A18 Pro, and a GPU frame rate in the Manhattan test improved by 43% compared to A18 Pro [2][19]. - The chip is built on a 109mm² area housing 19 billion transistors, achieving a comprehensive score exceeding 3 million in AnTuTu, placing it in the top tier [9][12]. - The architecture includes a 10-core 4Cluster setup, with a peak performance increase of 36% over the previous generation [11][13]. - Single-core performance reached a score of 3008, while multi-core performance scored 9509, surpassing Apple's A18 Pro [16]. Group 2: Device Launch and Features - The Xiaomi 15S Pro smartphone, equipped with the Xuanjie O1 chip, was launched simultaneously, priced at 5499 yuan for the 16+512GB version [3]. - The Xiaomi 15S Pro features a durable dragon scale fiber back cover and a camera system with three 50MP Leica optical lenses [28][33]. - The device supports UWB technology for high-precision positioning and seamless communication, enhancing user experience in various scenarios [44]. Group 3: Investment and Future Plans - Xiaomi has invested 102 billion yuan in R&D over the past five years, with plans to increase this to 300 billion yuan by 2025 [83]. - The company aims to invest an additional 200 billion yuan over the next five years to further enhance its technological capabilities [84].

Core Viewpoint - Xiaomi has unveiled its self-developed SoC chip, Xuanjie O1, which utilizes the advanced second-generation 3nm process and aims to compete with Apple's latest mobile chips [1][5]. Group 1: Chip Specifications and Performance - The Xuanjie O1 features a dual super-large core design, with multi-core performance scores surpassing Apple's A18 Pro, and GPU performance in the Manhattan test improved by 43% compared to A18 Pro [2][17]. - The chip is built on a 109mm² area housing 19 billion transistors, achieving a comprehensive score exceeding 3 million in AnTuTu, placing it in the top tier [7][10]. - It employs a 10-core 4Cluster architecture, including two Arm X95 super-large cores, four A725 performance cores, and two A520 super-efficient cores [9][12]. - The single-core score of Xuanjie O1 reached 3008, while the multi-core score hit 9509, outperforming the A18 Pro [14]. Group 2: Energy Efficiency and Features - The Xuanjie O1's super-large cores and efficiency cores can match the energy efficiency of the A18 Pro, with the GPU's power consumption being 35% lower than that of A18 Pro [15][21]. - The chip incorporates dynamic GPU performance scheduling technology to balance performance and power consumption based on usage scenarios [18]. Group 3: Product Launch and Pricing - The Xiaomi 15S Pro, equipped with the Xuanjie O1 chip, was launched alongside the chip, with a price of 5499 yuan for the 16+512GB version [3]. - Xiaomi also introduced the Xiaomi Pad 7 Ultra, featuring a 14-inch OLED display and powered by the Xuanjie O1, emphasizing its capabilities for both entertainment and productivity [49][71]. Group 4: Future Investment Plans - Xiaomi has invested 102 billion yuan in R&D over the past five years, with plans to increase this to 300 billion yuan by 2025 and an additional 200 billion yuan over the next five years [80][82].

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 5月19日早间，小米董事长兼CEO雷军通过微博宣布，小米将于5月22日晚7点召开主题为"新起点"的"小 米战略新品发布会"，将正式发布小米旗舰手机SoC芯片玄戒O1，以及小米15SPro、小米平板7 Ultra、 小米首款SUV汽车小米yu7等。预计，即将发布的小米15S Pro新机将首发搭载玄戒O1。 与此同时，雷军也通过其个人微信公众号发布了题为：《雷军：小米玄戒O1，3nm旗舰处理器，力争跻 身第一梯队旗舰体验。》的文章，正式公布了玄戒O1将采用3nm制程的信息，并介绍了小米自研芯片的 研发历程。 雷军首先回顾了小米第一代自研手机SoC "澎湃S1"的失败经历，从2014年9月立项，到2017年正式发 布，" 因为种种原因，遭遇挫折"， 暂停了SoC大芯片的研发，转向了"小芯片"路线。 包含了快充芯 片、电池管理芯片、影像芯片、天线增强芯片等"小芯片"，在不同技术赛道中慢慢积累经验和能力。 直到2021年初，小米宣布造车的同时，还在内部 重启"大芯片"业务，重新开始研发手机SoC。 雷军说："小米一直有颗"芯片梦"，因为，要想成为一家伟大的硬核科 ...